CN102712436B - 基板盒及基板收容装置 - Google Patents

基板盒及基板收容装置 Download PDF

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Publication number
CN102712436B
CN102712436B CN201080060044.3A CN201080060044A CN102712436B CN 102712436 B CN102712436 B CN 102712436B CN 201080060044 A CN201080060044 A CN 201080060044A CN 102712436 B CN102712436 B CN 102712436B
Authority
CN
China
Prior art keywords
substrate
axle portion
maintaining part
sheet
cover
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201080060044.3A
Other languages
English (en)
Chinese (zh)
Other versions
CN102712436A (zh
Inventor
水谷英夫
木内徹
川口透
增川孝志
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nikon Corp
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Publication of CN102712436A publication Critical patent/CN102712436A/zh
Application granted granted Critical
Publication of CN102712436B publication Critical patent/CN102712436B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H75/00—Storing webs, tapes, or filamentary material, e.g. on reels
    • B65H75/02—Cores, formers, supports, or holders for coiled, wound, or folded material, e.g. reels, spindles, bobbins, cop tubes, cans, mandrels or chucks
    • B65H75/18—Constructional details
    • B65H75/28—Arrangements for positively securing ends of material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H75/00—Storing webs, tapes, or filamentary material, e.g. on reels
    • B65H75/02—Cores, formers, supports, or holders for coiled, wound, or folded material, e.g. reels, spindles, bobbins, cop tubes, cans, mandrels or chucks
    • B65H75/18—Constructional details
    • B65H75/28—Arrangements for positively securing ends of material
    • B65H75/285—Holding devices to prevent the wound material from unwinding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67363—Closed carriers specially adapted for containing substrates other than wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H19/00—Changing the web roll
    • B65H19/22—Changing the web roll in winding mechanisms or in connection with winding operations
    • B65H19/2276—The web roll being driven by a winding mechanism of the coreless type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2405/00—Parts for holding the handled material
    • B65H2405/40—Holders, supports for rolls
    • B65H2405/42—Supports for rolls fully removable from the handling machine
    • B65H2405/421—Supports for rolls fully removable from the handling machine and serving also as package
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2601/00—Problem to be solved or advantage achieved
    • B65H2601/20—Avoiding or preventing undesirable effects
    • B65H2601/25—Damages to handled material

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Packaging Frangible Articles (AREA)
  • Storage Of Web-Like Or Filamentary Materials (AREA)
CN201080060044.3A 2009-12-29 2010-12-28 基板盒及基板收容装置 Active CN102712436B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US28219809P 2009-12-29 2009-12-29
US61/282,198 2009-12-29
US12/976,149 2010-12-22
US12/976,149 US10541160B2 (en) 2009-12-29 2010-12-22 Substrate case and substrate accommodation apparatus
PCT/JP2010/073899 WO2011081220A1 (en) 2009-12-29 2010-12-28 Substrate case and substrate accommodation apparatus

Publications (2)

Publication Number Publication Date
CN102712436A CN102712436A (zh) 2012-10-03
CN102712436B true CN102712436B (zh) 2014-12-31

Family

ID=44186239

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201080060044.3A Active CN102712436B (zh) 2009-12-29 2010-12-28 基板盒及基板收容装置

Country Status (6)

Country Link
US (2) US10541160B2 (enExample)
JP (1) JP5708649B2 (enExample)
KR (1) KR101706412B1 (enExample)
CN (1) CN102712436B (enExample)
TW (1) TWI499546B (enExample)
WO (1) WO2011081220A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020093339A1 (zh) * 2018-11-09 2020-05-14 丁飞燕 一种除尘型印制板存放架
CN114078730B (zh) * 2020-08-12 2025-05-13 大立钰科技有限公司 可伸缩收纳机构以及供该可伸缩收纳机构容置的收纳盒
TWI760258B (zh) * 2020-08-12 2022-04-01 大立鈺科技有限公司 可伸縮收納機構以及可供該可伸縮收納機構容置的收納盒

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1208320A (zh) * 1997-08-08 1999-02-17 田中电子工业株式会社 连接线用的卷筒罩壳
CN1713072A (zh) * 2004-06-16 2005-12-28 诺日士钢机株式会社 记录纸暗盒
JP2006327784A (ja) * 2005-05-27 2006-12-07 Sharp Corp シート材巻き付け具及びシート材の保管方法
EP1965017A2 (de) * 2007-03-02 2008-09-03 BOS GmbH & Co. KG Verfahren zur Befestigung eines flexiblen Flächengebildes an einer Wickelwelle und Rollo

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US2821883A (en) * 1956-02-17 1958-02-04 Da Lite Screen Company Inc Projection screen construction
NL6707394A (enExample) * 1967-05-26 1968-11-27
US3622099A (en) * 1969-06-20 1971-11-23 C Olivetti And C Spa Ing Plastic ribbon spool
US4165138A (en) * 1976-11-15 1979-08-21 Mosinee Paper Company Dispenser cabinet for sheet material and transfer mechanism
IT1100423B (it) * 1978-11-29 1985-09-28 Alberto Pietro Macchina automatica per la realizzazione in continuo di rotoli di tessuto
JPS56172837U (enExample) * 1980-05-23 1981-12-21
JPS5758134A (en) 1980-09-25 1982-04-07 Ricoh Co Ltd Film advancing spool of camera
JPS63181816A (ja) 1987-01-19 1988-07-27 Takenaka Komuten Co Ltd 地中梁構成材
JPS63271325A (ja) * 1987-04-30 1988-11-09 Konica Corp フイルム巻取方法
JPH0213521A (ja) * 1988-06-30 1990-01-17 Ricoh Co Ltd 給紙ロール及びそれを使用する画像形成装置
JPH0511169Y2 (enExample) * 1989-01-23 1993-03-18
JP3077275B2 (ja) 1991-07-08 2000-08-14 株式会社ニコン ズームレンズ鏡筒
JPH0575219A (ja) * 1991-07-25 1993-03-26 Sharp Corp フレキシブル回路基板及びフレキシブル回路基板の製造方法
JPH06100068A (ja) 1992-09-21 1994-04-12 Murata Mfg Co Ltd テーピング電子部品連
JPH06156882A (ja) 1992-11-18 1994-06-03 Hitachi Chem Co Ltd 感光性エレメントの保護フィルム巻き取り用巻芯、該巻芯を備えたラミネーター及びラミネート方法
CN1058091C (zh) 1993-12-22 2000-11-01 伊斯曼柯达公司 将胶片插入和/或取出胶卷暗盒的方法和设备
JPH07181631A (ja) 1993-12-24 1995-07-21 Konica Corp 写真フィルム用パトローネ及びそれに収納される写真フィルム
US5613787A (en) * 1996-03-18 1997-03-25 Axiohm Ipb Inc. Automatic journal loading assembly
US5833377A (en) * 1996-05-10 1998-11-10 Monarch Marking Systems, Inc. Core, spindle and combination thereof
JP4494573B2 (ja) 2000-03-03 2010-06-30 Ｊｕｋｉ株式会社 カバーテープ巻取りリール
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JP4320298B2 (ja) 2004-12-03 2009-08-26 日本特殊陶業株式会社 フィルム剥離装置
TWI336603B (en) 2004-12-03 2011-01-21 Ngk Spark Plug Co Method and apparatus for producing a wiring board, including film-peeling
US8080277B2 (en) * 2005-03-18 2011-12-20 Konica Minolta Holdings, Inc. Method of forming organic compound layer, method of manufacturing organic EL element and organic EL element
WO2006100868A1 (ja) 2005-03-18 2006-09-28 Konica Minolta Holdings, Inc. 有機化合物層の形成方法、有機ｅｌ素子の製造方法、有機ｅｌ素子
JP5010215B2 (ja) * 2006-09-07 2012-08-29 アスリートＦａ株式会社 基板供給装置、基板巻取装置および基板処理システム
CN101255785A (zh) * 2008-03-28 2008-09-03 安东石油技术（集团）有限公司 防滑固井胶塞
IT1391420B1 (it) * 2008-09-24 2011-12-23 Perini Fabio Spa "macchina ribobinatrice e metodo di avvolgimento"
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US8801307B2 (en) * 2009-09-25 2014-08-12 Nikon Corporation Substrate cartridge, substrate processing apparatus, substrate processing system, control apparatus, and method of manufacturing display element

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1208320A (zh) * 1997-08-08 1999-02-17 田中电子工业株式会社 连接线用的卷筒罩壳
CN1713072A (zh) * 2004-06-16 2005-12-28 诺日士钢机株式会社 记录纸暗盒
JP2006327784A (ja) * 2005-05-27 2006-12-07 Sharp Corp シート材巻き付け具及びシート材の保管方法
EP1965017A2 (de) * 2007-03-02 2008-09-03 BOS GmbH & Co. KG Verfahren zur Befestigung eines flexiblen Flächengebildes an einer Wickelwelle und Rollo

Also Published As

Publication number Publication date
JP5708649B2 (ja) 2015-04-30
JP2013516049A (ja) 2013-05-09
KR101706412B1 (ko) 2017-02-13
CN102712436A (zh) 2012-10-03
WO2011081220A1 (en) 2011-07-07
US11342206B2 (en) 2022-05-24
US20200118847A1 (en) 2020-04-16
US20110155838A1 (en) 2011-06-30
KR20120107099A (ko) 2012-09-28
TW201132567A (en) 2011-10-01
US10541160B2 (en) 2020-01-21
TWI499546B (zh) 2015-09-11

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