CN102711374A - 多盘板嵌入式电容器及其制造方法 - Google Patents

多盘板嵌入式电容器及其制造方法 Download PDF

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Publication number
CN102711374A
CN102711374A CN2012101543665A CN201210154366A CN102711374A CN 102711374 A CN102711374 A CN 102711374A CN 2012101543665 A CN2012101543665 A CN 2012101543665A CN 201210154366 A CN201210154366 A CN 201210154366A CN 102711374 A CN102711374 A CN 102711374A
Authority
CN
China
Prior art keywords
conductive
pwb
vertical axis
conductive plate
capacitor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2012101543665A
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English (en)
Chinese (zh)
Inventor
D·Z·阿巴维
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co
Original Assignee
General Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Co filed Critical General Electric Co
Publication of CN102711374A publication Critical patent/CN102711374A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/33—Thin- or thick-film capacitors (thin- or thick-film circuits; capacitors without a potential-jump or surface barrier specially adapted for integrated circuits, details thereof, multistep manufacturing processes therefor)
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09618—Via fence, i.e. one-dimensional array of vias
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
CN2012101543665A 2011-03-04 2012-03-02 多盘板嵌入式电容器及其制造方法 Pending CN102711374A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/040,841 2011-03-04
US13/040,841 US8717773B2 (en) 2011-03-04 2011-03-04 Multi-plate board embedded capacitor and methods for fabricating the same

Publications (1)

Publication Number Publication Date
CN102711374A true CN102711374A (zh) 2012-10-03

Family

ID=45841250

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2012101543665A Pending CN102711374A (zh) 2011-03-04 2012-03-02 多盘板嵌入式电容器及其制造方法

Country Status (7)

Country Link
US (1) US8717773B2 (https=)
EP (1) EP2496059B1 (https=)
JP (1) JP2012191203A (https=)
CN (1) CN102711374A (https=)
AU (1) AU2012201295B2 (https=)
CA (1) CA2769923C (https=)
IN (1) IN2012DE00544A (https=)

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US8963615B1 (en) 2013-01-31 2015-02-24 General Electric Company Automatic bipolar signal switching
KR20210129056A (ko) * 2019-01-18 2021-10-27 나노-디멘션 테크놀로지스, 엘티디. 집적 인쇄회로기판 및 제조 방법
US10984957B1 (en) * 2019-12-03 2021-04-20 International Business Machines Corporation Printed circuit board embedded capacitor
CN112435984B (zh) * 2020-11-24 2022-09-06 复旦大学 半导体衬底、制备方法以及电子元器件
CN113503939A (zh) * 2021-08-23 2021-10-15 石河子大学 非接触式种箱料位实时监测系统

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6459561B1 (en) * 2001-06-12 2002-10-01 Avx Corporation Low inductance grid array capacitor
CN1401127A (zh) * 2000-11-16 2003-03-05 Tdk株式会社 电子部件用基板和电子部件
US20080239685A1 (en) * 2007-03-27 2008-10-02 Tadahiko Kawabe Capacitor built-in wiring board

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US5103283A (en) * 1989-01-17 1992-04-07 Hite Larry R Packaged integrated circuit with in-cavity decoupling capacitors
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US5774326A (en) * 1995-08-25 1998-06-30 General Electric Company Multilayer capacitors using amorphous hydrogenated carbon
US6344951B1 (en) * 1998-12-14 2002-02-05 Alps Electric Co., Ltd. Substrate having magnetoresistive elements and monitor element capable of preventing a short circuit
US6252760B1 (en) * 1999-05-26 2001-06-26 Sun Microsystems, Inc. Discrete silicon capacitor
JP3489728B2 (ja) * 1999-10-18 2004-01-26 株式会社村田製作所 積層コンデンサ、配線基板および高周波回路
JP4945842B2 (ja) * 2000-04-05 2012-06-06 イビデン株式会社 プリント配線板及びプリント配線板の製造方法
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KR100793916B1 (ko) 2006-04-05 2008-01-15 삼성전기주식회사 인쇄회로기판 내장형 커패시터의 제조방법
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CN1401127A (zh) * 2000-11-16 2003-03-05 Tdk株式会社 电子部件用基板和电子部件
US6459561B1 (en) * 2001-06-12 2002-10-01 Avx Corporation Low inductance grid array capacitor
US20080239685A1 (en) * 2007-03-27 2008-10-02 Tadahiko Kawabe Capacitor built-in wiring board

Also Published As

Publication number Publication date
CA2769923A1 (en) 2012-09-04
IN2012DE00544A (https=) 2015-06-05
EP2496059A2 (en) 2012-09-05
AU2012201295B2 (en) 2015-05-14
EP2496059B1 (en) 2025-05-21
US20120224333A1 (en) 2012-09-06
AU2012201295A1 (en) 2012-09-20
JP2012191203A (ja) 2012-10-04
CA2769923C (en) 2020-01-07
EP2496059A3 (en) 2013-10-09
US8717773B2 (en) 2014-05-06

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SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20121003