CN102693946B - 半导体器件制造方法以及存储器制造方法 - Google Patents
半导体器件制造方法以及存储器制造方法 Download PDFInfo
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- CN102693946B CN102693946B CN201210191226.5A CN201210191226A CN102693946B CN 102693946 B CN102693946 B CN 102693946B CN 201210191226 A CN201210191226 A CN 201210191226A CN 102693946 B CN102693946 B CN 102693946B
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66825—Unipolar field-effect transistors with an insulated gate, i.e. MISFET with a floating gate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/423—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
- H01L29/42312—Gate electrodes for field effect devices
- H01L29/42316—Gate electrodes for field effect devices for field-effect transistors
- H01L29/4232—Gate electrodes for field effect devices for field-effect transistors with insulated gate
- H01L29/42324—Gate electrodes for transistors with a floating gate
- H01L29/42328—Gate electrodes for transistors with a floating gate with at least one additional gate other than the floating gate and the control gate, e.g. program gate, erase gate or select gate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/788—Field effect transistors with field effect produced by an insulated gate with floating gate
- H01L29/7881—Programmable transistors with only two possible levels of programmation
- H01L29/7884—Programmable transistors with only two possible levels of programmation charging by hot carrier injection
- H01L29/7885—Hot carrier injection from the channel
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B41/00—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates
- H10B41/30—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by the memory core region
- H10B41/35—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by the memory core region with a cell select transistor, e.g. NAND
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Non-Volatile Memory (AREA)
- Semiconductor Memories (AREA)
Abstract
Description
Claims (11)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
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CN201210191226.5A CN102693946B (zh) | 2012-06-11 | 2012-06-11 | 半导体器件制造方法以及存储器制造方法 |
US13/914,244 US8778761B2 (en) | 2012-06-11 | 2013-06-10 | Method of manufacturing semiconductor device |
Applications Claiming Priority (1)
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CN201210191226.5A CN102693946B (zh) | 2012-06-11 | 2012-06-11 | 半导体器件制造方法以及存储器制造方法 |
Publications (2)
Publication Number | Publication Date |
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CN102693946A CN102693946A (zh) | 2012-09-26 |
CN102693946B true CN102693946B (zh) | 2017-04-05 |
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CN201210191226.5A Active CN102693946B (zh) | 2012-06-11 | 2012-06-11 | 半导体器件制造方法以及存储器制造方法 |
Country Status (2)
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US (1) | US8778761B2 (zh) |
CN (1) | CN102693946B (zh) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103077926B (zh) * | 2012-12-20 | 2016-06-29 | 上海华虹宏力半导体制造有限公司 | 半导体器件的形成方法 |
CN103295968B (zh) * | 2013-06-03 | 2016-12-28 | 上海华虹宏力半导体制造有限公司 | 半导体器件的制备方法 |
CN104347516B (zh) * | 2013-08-02 | 2017-06-13 | 中芯国际集成电路制造(上海)有限公司 | 一种制作嵌入式闪存的方法 |
CN105655341B (zh) * | 2016-01-29 | 2018-07-27 | 上海华虹宏力半导体制造有限公司 | 半导体器件的形成方法 |
KR102650539B1 (ko) * | 2016-09-23 | 2024-03-27 | 삼성전자주식회사 | 3차원 반도체 장치의 제조 방법 |
CN107731837A (zh) * | 2017-09-19 | 2018-02-23 | 上海华虹宏力半导体制造有限公司 | 存储器工艺方法 |
CN108695332B (zh) * | 2018-05-18 | 2021-05-07 | 上海华虹宏力半导体制造有限公司 | 分栅式闪存及其形成方法、控制方法 |
CN110896668B (zh) | 2018-12-18 | 2021-07-20 | 长江存储科技有限责任公司 | 多堆栈三维存储器件以及其形成方法 |
CN110896669B (zh) | 2018-12-18 | 2021-01-26 | 长江存储科技有限责任公司 | 多堆叠三维存储器件以及其形成方法 |
CN109768050B (zh) * | 2018-12-18 | 2020-11-17 | 长江存储科技有限责任公司 | 三维存储器及其制备方法 |
CN110914991B (zh) | 2018-12-18 | 2021-04-27 | 长江存储科技有限责任公司 | 具有转移的互连层的三维存储器件以及其形成方法 |
CN109830481A (zh) * | 2019-03-20 | 2019-05-31 | 上海华虹宏力半导体制造有限公司 | 分栅式闪存及其制造方法 |
CN110061066B (zh) * | 2019-04-30 | 2024-02-09 | 苏州固锝电子股份有限公司 | 一种浅沟槽的电极同侧二极管芯片的制造工艺 |
CN110349960B (zh) * | 2019-07-08 | 2021-06-18 | 上海华虹宏力半导体制造有限公司 | 嵌入式闪存的版图结构、嵌入式闪存及其形成方法 |
KR20210075689A (ko) * | 2019-12-13 | 2021-06-23 | 에스케이하이닉스 주식회사 | 반도체 장치 및 그 제조 방법 |
CN110993559B (zh) * | 2019-12-23 | 2023-08-18 | 上海华力微电子有限公司 | 半导体器件的形成方法 |
CN111341776B (zh) * | 2020-03-18 | 2023-11-14 | 上海华虹宏力半导体制造有限公司 | 存储器及其形成方法、存储器单元阵列及其驱动方法 |
CN112382635B (zh) * | 2020-11-12 | 2023-11-10 | 上海华虹宏力半导体制造有限公司 | 半导体器件的制造方法 |
CN113192838B (zh) * | 2021-03-24 | 2024-02-02 | 上海华虹宏力半导体制造有限公司 | 闪存存储器的形成方法 |
CN113192957B (zh) * | 2021-04-27 | 2024-04-16 | 上海华虹宏力半导体制造有限公司 | 闪存存储器的制造方法 |
CN115312454B (zh) * | 2022-10-11 | 2023-02-24 | 合肥新晶集成电路有限公司 | 半导体结构及其形成方法 |
Citations (3)
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CN1855442A (zh) * | 2005-04-25 | 2006-11-01 | 联华电子股份有限公司 | 非挥发性存储单元及其制造方法 |
CN1945798A (zh) * | 2005-08-17 | 2007-04-11 | 三星电子株式会社 | 制造非易失性存储器件的方法 |
CN102332432A (zh) * | 2011-07-28 | 2012-01-25 | 上海宏力半导体制造有限公司 | 半导体集成器件制造方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
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US6512263B1 (en) * | 2000-09-22 | 2003-01-28 | Sandisk Corporation | Non-volatile memory cell array having discontinuous source and drain diffusions contacted by continuous bit line conductors and methods of forming |
KR100532352B1 (ko) * | 2003-08-21 | 2005-12-01 | 삼성전자주식회사 | 반도체 장치 및 반도체 장치의 제조 방법 |
KR100646085B1 (ko) * | 2005-03-08 | 2006-11-14 | 매그나칩 반도체 유한회사 | 비휘발성 메모리 소자, 그 제조방법, 및 이를 이용한 반도체 소자의 제조방법 |
-
2012
- 2012-06-11 CN CN201210191226.5A patent/CN102693946B/zh active Active
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2013
- 2013-06-10 US US13/914,244 patent/US8778761B2/en active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1855442A (zh) * | 2005-04-25 | 2006-11-01 | 联华电子股份有限公司 | 非挥发性存储单元及其制造方法 |
CN1945798A (zh) * | 2005-08-17 | 2007-04-11 | 三星电子株式会社 | 制造非易失性存储器件的方法 |
CN102332432A (zh) * | 2011-07-28 | 2012-01-25 | 上海宏力半导体制造有限公司 | 半导体集成器件制造方法 |
Also Published As
Publication number | Publication date |
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US20130330894A1 (en) | 2013-12-12 |
CN102693946A (zh) | 2012-09-26 |
US8778761B2 (en) | 2014-07-15 |
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Address after: 201203 Shanghai Zhangjiang hi tech park Zuchongzhi Road No. 1399 Applicant after: Shanghai Huahong Grace Semiconductor Manufacturing Corp. Address before: 201203 Shanghai Guo Shou Jing Road, Pudong New Area Zhangjiang hi tech Park No. 818 Applicant before: Shanghai Huahong Grace Semiconductor Manufacturing Corp. Address after: 201203 Shanghai Guo Shou Jing Road, Pudong New Area Zhangjiang hi tech Park No. 818 Applicant after: Shanghai Huahong Grace Semiconductor Manufacturing Corp. Address before: 201203 Shanghai Guo Shou Jing Road, Pudong New Area Zhangjiang hi tech Park No. 818 Applicant before: Grace Semiconductor Manufacturing Corp. |
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