CN102692255B - 热式传感器及其制造方法 - Google Patents

热式传感器及其制造方法 Download PDF

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Publication number
CN102692255B
CN102692255B CN201110461924.8A CN201110461924A CN102692255B CN 102692255 B CN102692255 B CN 102692255B CN 201110461924 A CN201110461924 A CN 201110461924A CN 102692255 B CN102692255 B CN 102692255B
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CN
China
Prior art keywords
film
control circuit
intermediate layer
laminated film
thermal sensor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201110461924.8A
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English (en)
Chinese (zh)
Other versions
CN102692255A (zh
Inventor
佐久间宪之
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Astemo Ltd
Original Assignee
Hitachi Automotive Systems Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Automotive Systems Ltd filed Critical Hitachi Automotive Systems Ltd
Publication of CN102692255A publication Critical patent/CN102692255A/zh
Application granted granted Critical
Publication of CN102692255B publication Critical patent/CN102692255B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F1/00—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
    • G01F1/68—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using thermal effects
    • G01F1/684—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow
    • G01F1/6845—Micromachined devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F1/00—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
    • G01F1/68—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using thermal effects
    • G01F1/684—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow
    • G01F1/688—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow using a particular type of heating, cooling or sensing element
    • G01F1/69—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow using a particular type of heating, cooling or sensing element of resistive type
    • G01F1/692—Thin-film arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/01—Manufacture or treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.

Landscapes

  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Measuring Volume Flow (AREA)
  • Investigating Or Analyzing Materials Using Thermal Means (AREA)
  • Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
CN201110461924.8A 2011-03-25 2011-12-31 热式传感器及其制造方法 Expired - Fee Related CN102692255B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011066964A JP5526065B2 (ja) 2011-03-25 2011-03-25 熱式センサおよびその製造方法
JP2011-066964 2011-03-25

Publications (2)

Publication Number Publication Date
CN102692255A CN102692255A (zh) 2012-09-26
CN102692255B true CN102692255B (zh) 2015-07-01

Family

ID=45470181

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201110461924.8A Expired - Fee Related CN102692255B (zh) 2011-03-25 2011-12-31 热式传感器及其制造方法

Country Status (4)

Country Link
US (2) US8714008B2 (enExample)
EP (1) EP2503305B1 (enExample)
JP (1) JP5526065B2 (enExample)
CN (1) CN102692255B (enExample)

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JP5114463B2 (ja) * 2009-09-25 2013-01-09 日立オートモティブシステムズ株式会社 発熱抵抗式空気流量測定装置
US9103705B2 (en) * 2012-02-27 2015-08-11 Freescale Semiconductor, Inc. Combined environmental parameter sensor
JP5758851B2 (ja) * 2012-06-15 2015-08-05 日立オートモティブシステムズ株式会社 熱式流量計
JP5675716B2 (ja) 2012-06-29 2015-02-25 日立オートモティブシステムズ株式会社 熱式空気流量センサ
JP6018903B2 (ja) * 2012-12-17 2016-11-02 日立オートモティブシステムズ株式会社 物理量センサ
JP5884769B2 (ja) 2013-05-09 2016-03-15 株式会社デンソー 空気流量計測装置
JP6043248B2 (ja) * 2013-07-24 2016-12-14 日立オートモティブシステムズ株式会社 熱式空気流量計
EP3064906A4 (en) * 2013-10-31 2017-03-08 Hitachi Automotive Systems, Ltd. Airflow measurement device
CN103996716B (zh) * 2014-04-25 2017-02-15 京东方科技集团股份有限公司 一种多晶硅薄膜晶体管的制备方法
JP6362913B2 (ja) * 2014-04-28 2018-07-25 日立オートモティブシステムズ株式会社 熱式空気流量センサ
JP6215773B2 (ja) * 2014-05-28 2017-10-18 日立オートモティブシステムズ株式会社 流量センサおよびその製造方法
JP6357535B2 (ja) * 2014-07-30 2018-07-11 日立オートモティブシステムズ株式会社 センサおよびその製造方法
JP6295209B2 (ja) 2015-01-09 2018-03-14 日立オートモティブシステムズ株式会社 熱式流体流量センサ
JP2016145764A (ja) * 2015-02-09 2016-08-12 株式会社東芝 マイクロ分析パッケージ
US9613719B1 (en) * 2015-02-17 2017-04-04 Darryl G. Walker Multi-chip non-volatile semiconductor memory package including heater and sensor elements
JP2019027881A (ja) * 2017-07-28 2019-02-21 アズビル株式会社 測定装置
US10510637B2 (en) * 2017-08-30 2019-12-17 Taiwan Semiconductor Manufacturing Co., Ltd. Devices and methods for heat dissipation of semiconductor integrated circuits
JP6993893B2 (ja) * 2018-02-16 2022-02-10 日立Astemo株式会社 半導体素子及びそれを用いた流量測定装置
KR102501675B1 (ko) * 2018-07-13 2023-02-17 삼성전자주식회사 반도체 장치 및 그 제조 방법
CN113207203A (zh) * 2021-04-19 2021-08-03 安徽精卓光显技术有限责任公司 一种无基材加热膜生产方法
KR20240001734A (ko) * 2022-06-24 2024-01-04 삼성디스플레이 주식회사 표시장치 및 이의 제조 방법

Citations (3)

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Publication number Priority date Publication date Assignee Title
US5596219A (en) * 1994-05-25 1997-01-21 Siemens Aktiengesellschaft Thermal sensor/actuator in semiconductor material
US6820481B1 (en) * 1999-10-28 2004-11-23 Robert Bosch Gmbh Mass flow sensor having an improved membrane stability
CN101750123A (zh) * 2008-12-08 2010-06-23 日立汽车系统株式会社 热式流体流量传感器及其制造方法

Family Cites Families (12)

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Publication number Priority date Publication date Assignee Title
JPS60142268A (ja) 1983-12-27 1985-07-27 株式会社山武 流速センサ
DE3444347A1 (de) * 1984-12-05 1986-06-12 Robert Bosch Gmbh, 7000 Stuttgart Vorrichtung zur luftmengenmessung
US4735086A (en) * 1987-06-26 1988-04-05 Ford Motor Company Thick film mass airflow meter with minimal thermal radiation loss
US5231878A (en) * 1991-12-23 1993-08-03 Ford Motor Company Mass air flow sensor
US5763775A (en) * 1996-03-13 1998-06-09 Ricoh Company, Ltd. Flow sensor having first and second temperature detecting portions for accurate measuring of a flow rate and a manufacturing method thereof
JP2004518119A (ja) * 2001-01-10 2004-06-17 ゼンジリオン アクチエンゲゼルシャフト 伸張性コーティングを有するマイクロメカニカルフローセンサ
JP3698679B2 (ja) * 2002-03-27 2005-09-21 株式会社日立製作所 ガス流量計及びその製造方法
US7765679B2 (en) * 2004-03-11 2010-08-03 Siargo, Inc. Method of manufacturing a flow rate sensor
JP4882732B2 (ja) * 2006-12-22 2012-02-22 株式会社デンソー 半導体装置
JP2008170382A (ja) * 2007-01-15 2008-07-24 Hitachi Ltd 熱式流体流量センサ及びその製造方法
JP5202007B2 (ja) 2008-01-29 2013-06-05 日立オートモティブシステムズ株式会社 熱式流体流量センサ
JP2010281758A (ja) 2009-06-08 2010-12-16 Hitachi Automotive Systems Ltd 熱式空気流量計

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5596219A (en) * 1994-05-25 1997-01-21 Siemens Aktiengesellschaft Thermal sensor/actuator in semiconductor material
US6820481B1 (en) * 1999-10-28 2004-11-23 Robert Bosch Gmbh Mass flow sensor having an improved membrane stability
CN101750123A (zh) * 2008-12-08 2010-06-23 日立汽车系统株式会社 热式流体流量传感器及其制造方法

Also Published As

Publication number Publication date
US8714008B2 (en) 2014-05-06
JP5526065B2 (ja) 2014-06-18
US20120240674A1 (en) 2012-09-27
JP2012202786A (ja) 2012-10-22
CN102692255A (zh) 2012-09-26
US20140227819A1 (en) 2014-08-14
US9379302B2 (en) 2016-06-28
EP2503305B1 (en) 2019-10-23
EP2503305A1 (en) 2012-09-26

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Address after: Ibaraki

Patentee after: Hitachi astemo Co.,Ltd.

Address before: Ibaraki

Patentee before: HITACHI AUTOMOTIVE SYSTEMS, Ltd.

CP01 Change in the name or title of a patent holder
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20150701

CF01 Termination of patent right due to non-payment of annual fee