JP5526065B2 - 熱式センサおよびその製造方法 - Google Patents

熱式センサおよびその製造方法 Download PDF

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Publication number
JP5526065B2
JP5526065B2 JP2011066964A JP2011066964A JP5526065B2 JP 5526065 B2 JP5526065 B2 JP 5526065B2 JP 2011066964 A JP2011066964 A JP 2011066964A JP 2011066964 A JP2011066964 A JP 2011066964A JP 5526065 B2 JP5526065 B2 JP 5526065B2
Authority
JP
Japan
Prior art keywords
control circuit
film
laminated film
intermediate layer
heating resistor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2011066964A
Other languages
English (en)
Japanese (ja)
Other versions
JP2012202786A5 (enExample
JP2012202786A (ja
Inventor
憲之 佐久間
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Astemo Ltd
Original Assignee
Hitachi Automotive Systems Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Automotive Systems Ltd filed Critical Hitachi Automotive Systems Ltd
Priority to JP2011066964A priority Critical patent/JP5526065B2/ja
Priority to EP11010054.2A priority patent/EP2503305B1/en
Priority to CN201110461924.8A priority patent/CN102692255B/zh
Priority to US13/351,157 priority patent/US8714008B2/en
Publication of JP2012202786A publication Critical patent/JP2012202786A/ja
Publication of JP2012202786A5 publication Critical patent/JP2012202786A5/ja
Priority to US14/253,938 priority patent/US9379302B2/en
Application granted granted Critical
Publication of JP5526065B2 publication Critical patent/JP5526065B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F1/00—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
    • G01F1/68—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using thermal effects
    • G01F1/684—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow
    • G01F1/6845—Micromachined devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F1/00—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
    • G01F1/68—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using thermal effects
    • G01F1/684—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow
    • G01F1/688—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow using a particular type of heating, cooling or sensing element
    • G01F1/69—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow using a particular type of heating, cooling or sensing element of resistive type
    • G01F1/692—Thin-film arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/01—Manufacture or treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.

Landscapes

  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Measuring Volume Flow (AREA)
  • Investigating Or Analyzing Materials Using Thermal Means (AREA)
  • Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
JP2011066964A 2011-03-25 2011-03-25 熱式センサおよびその製造方法 Expired - Fee Related JP5526065B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2011066964A JP5526065B2 (ja) 2011-03-25 2011-03-25 熱式センサおよびその製造方法
EP11010054.2A EP2503305B1 (en) 2011-03-25 2011-12-21 Thermal fluid flow sensor and method of manufacturing the same
CN201110461924.8A CN102692255B (zh) 2011-03-25 2011-12-31 热式传感器及其制造方法
US13/351,157 US8714008B2 (en) 2011-03-25 2012-01-16 Thermal fluid flow sensor and method of manufacturing the same
US14/253,938 US9379302B2 (en) 2011-03-25 2014-04-16 Method of manufacturing the thermal fluid flow sensor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011066964A JP5526065B2 (ja) 2011-03-25 2011-03-25 熱式センサおよびその製造方法

Publications (3)

Publication Number Publication Date
JP2012202786A JP2012202786A (ja) 2012-10-22
JP2012202786A5 JP2012202786A5 (enExample) 2013-12-12
JP5526065B2 true JP5526065B2 (ja) 2014-06-18

Family

ID=45470181

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011066964A Expired - Fee Related JP5526065B2 (ja) 2011-03-25 2011-03-25 熱式センサおよびその製造方法

Country Status (4)

Country Link
US (2) US8714008B2 (enExample)
EP (1) EP2503305B1 (enExample)
JP (1) JP5526065B2 (enExample)
CN (1) CN102692255B (enExample)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5114463B2 (ja) * 2009-09-25 2013-01-09 日立オートモティブシステムズ株式会社 発熱抵抗式空気流量測定装置
US9103705B2 (en) * 2012-02-27 2015-08-11 Freescale Semiconductor, Inc. Combined environmental parameter sensor
JP5758851B2 (ja) * 2012-06-15 2015-08-05 日立オートモティブシステムズ株式会社 熱式流量計
JP5675716B2 (ja) * 2012-06-29 2015-02-25 日立オートモティブシステムズ株式会社 熱式空気流量センサ
JP6018903B2 (ja) 2012-12-17 2016-11-02 日立オートモティブシステムズ株式会社 物理量センサ
JP5884769B2 (ja) 2013-05-09 2016-03-15 株式会社デンソー 空気流量計測装置
JP6043248B2 (ja) * 2013-07-24 2016-12-14 日立オートモティブシステムズ株式会社 熱式空気流量計
JP6200962B2 (ja) * 2013-10-31 2017-09-20 日立オートモティブシステムズ株式会社 空気流量測定装置
CN103996716B (zh) * 2014-04-25 2017-02-15 京东方科技集团股份有限公司 一种多晶硅薄膜晶体管的制备方法
JP6362913B2 (ja) * 2014-04-28 2018-07-25 日立オートモティブシステムズ株式会社 熱式空気流量センサ
JP6215773B2 (ja) * 2014-05-28 2017-10-18 日立オートモティブシステムズ株式会社 流量センサおよびその製造方法
CN106461439B (zh) * 2014-07-30 2019-08-16 日立汽车系统株式会社 传感器及其制造方法
JP6295209B2 (ja) * 2015-01-09 2018-03-14 日立オートモティブシステムズ株式会社 熱式流体流量センサ
JP2016145764A (ja) * 2015-02-09 2016-08-12 株式会社東芝 マイクロ分析パッケージ
US9928925B1 (en) * 2015-02-17 2018-03-27 Darryl G. Walker Multi-chip non-volatile semiconductor memory package including heater and sensor elements
JP2019027881A (ja) * 2017-07-28 2019-02-21 アズビル株式会社 測定装置
US10510637B2 (en) * 2017-08-30 2019-12-17 Taiwan Semiconductor Manufacturing Co., Ltd. Devices and methods for heat dissipation of semiconductor integrated circuits
JP6993893B2 (ja) * 2018-02-16 2022-02-10 日立Astemo株式会社 半導体素子及びそれを用いた流量測定装置
KR102501675B1 (ko) * 2018-07-13 2023-02-17 삼성전자주식회사 반도체 장치 및 그 제조 방법
CN113207203A (zh) * 2021-04-19 2021-08-03 安徽精卓光显技术有限责任公司 一种无基材加热膜生产方法
KR20240001734A (ko) * 2022-06-24 2024-01-04 삼성디스플레이 주식회사 표시장치 및 이의 제조 방법

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60142268A (ja) 1983-12-27 1985-07-27 株式会社山武 流速センサ
DE3444347A1 (de) * 1984-12-05 1986-06-12 Robert Bosch Gmbh, 7000 Stuttgart Vorrichtung zur luftmengenmessung
US4735086A (en) * 1987-06-26 1988-04-05 Ford Motor Company Thick film mass airflow meter with minimal thermal radiation loss
US5231878A (en) * 1991-12-23 1993-08-03 Ford Motor Company Mass air flow sensor
DE4418207C1 (de) * 1994-05-25 1995-06-22 Siemens Ag Thermischer Sensor/Aktuator in Halbleitermaterial
US5763775A (en) * 1996-03-13 1998-06-09 Ricoh Company, Ltd. Flow sensor having first and second temperature detecting portions for accurate measuring of a flow rate and a manufacturing method thereof
DE19952055A1 (de) * 1999-10-28 2001-05-17 Bosch Gmbh Robert Massenflußsensor mit verbesserter Membranstabilität
US7154372B2 (en) * 2001-01-10 2006-12-26 Sensirion Ag Micromechanical flow sensor with tensile coating
JP3698679B2 (ja) * 2002-03-27 2005-09-21 株式会社日立製作所 ガス流量計及びその製造方法
US7765679B2 (en) * 2004-03-11 2010-08-03 Siargo, Inc. Method of manufacturing a flow rate sensor
JP4882732B2 (ja) * 2006-12-22 2012-02-22 株式会社デンソー 半導体装置
JP2008170382A (ja) * 2007-01-15 2008-07-24 Hitachi Ltd 熱式流体流量センサ及びその製造方法
JP5202007B2 (ja) 2008-01-29 2013-06-05 日立オートモティブシステムズ株式会社 熱式流体流量センサ
JP5276964B2 (ja) * 2008-12-08 2013-08-28 日立オートモティブシステムズ株式会社 熱式流体流量センサおよびその製造方法
JP2010281758A (ja) 2009-06-08 2010-12-16 Hitachi Automotive Systems Ltd 熱式空気流量計

Also Published As

Publication number Publication date
CN102692255A (zh) 2012-09-26
US8714008B2 (en) 2014-05-06
CN102692255B (zh) 2015-07-01
US20140227819A1 (en) 2014-08-14
EP2503305A1 (en) 2012-09-26
JP2012202786A (ja) 2012-10-22
US20120240674A1 (en) 2012-09-27
EP2503305B1 (en) 2019-10-23
US9379302B2 (en) 2016-06-28

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