CN102656244B - 各向异性导电性粘接剂 - Google Patents

各向异性导电性粘接剂 Download PDF

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Publication number
CN102656244B
CN102656244B CN201080056864.5A CN201080056864A CN102656244B CN 102656244 B CN102656244 B CN 102656244B CN 201080056864 A CN201080056864 A CN 201080056864A CN 102656244 B CN102656244 B CN 102656244B
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CN
China
Prior art keywords
composition
anisotropic conductive
mass parts
compound
conductive adhesive
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Active
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CN201080056864.5A
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English (en)
Chinese (zh)
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CN102656244A (zh
Inventor
长田诚之
久保山俊史
加藤诚
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ThreeBond Co Ltd
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ThreeBond Co Ltd
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Publication of CN102656244A publication Critical patent/CN102656244A/zh
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Publication of CN102656244B publication Critical patent/CN102656244B/zh
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/16—Solid spheres
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J177/00—Adhesives based on polyamides obtained by reactions forming a carboxylic amide link in the main chain; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J177/00—Adhesives based on polyamides obtained by reactions forming a carboxylic amide link in the main chain; Adhesives based on derivatives of such polymers
    • C09J177/12—Polyester-amides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00013—Fully indexed content
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0221—Insulating particles having an electrically conductive coating

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)
CN201080056864.5A 2009-12-22 2010-12-06 各向异性导电性粘接剂 Active CN102656244B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2009-291073 2009-12-22
JP2009291073A JP5825503B2 (ja) 2009-12-22 2009-12-22 異方導電性接着剤
PCT/JP2010/072307 WO2011077979A1 (ja) 2009-12-22 2010-12-06 異方導電性接着剤

Publications (2)

Publication Number Publication Date
CN102656244A CN102656244A (zh) 2012-09-05
CN102656244B true CN102656244B (zh) 2014-06-04

Family

ID=44195510

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201080056864.5A Active CN102656244B (zh) 2009-12-22 2010-12-06 各向异性导电性粘接剂

Country Status (5)

Country Link
JP (1) JP5825503B2 (enExample)
KR (1) KR101727774B1 (enExample)
CN (1) CN102656244B (enExample)
TW (1) TWI493013B (enExample)
WO (1) WO2011077979A1 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5838674B2 (ja) * 2011-09-12 2016-01-06 住友電気工業株式会社 フィルム状異方導電性接着剤
JP5964187B2 (ja) 2012-09-18 2016-08-03 デクセリアルズ株式会社 異方性導電フィルム、接続方法、及び接合体
JP6164416B2 (ja) * 2013-09-25 2017-07-19 株式会社スリーボンド 導電性接着剤組成物
JP2017111978A (ja) * 2015-12-16 2017-06-22 デクセリアルズ株式会社 異方性導電フィルム、接続方法、及び接合体
CN106905889A (zh) * 2017-03-08 2017-06-30 上海腾烁电子材料有限公司 一种改性橡胶热硫化反应结合热塑性各向异性导电粘结剂
JP6969165B2 (ja) * 2017-06-02 2021-11-24 昭和電工マテリアルズ株式会社 異方導電性接着剤組成物、異方導電性フィルム、及び接続構造体
JP2020077645A (ja) * 2020-01-29 2020-05-21 デクセリアルズ株式会社 異方性導電フィルム、接続方法、及び接合体

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003268344A (ja) * 2002-03-20 2003-09-25 Shin Etsu Polymer Co Ltd 異方導電性接着剤及びヒートシールコネクター
JP2008165034A (ja) * 2006-12-28 2008-07-17 Sony Corp 集積モジュール、表示装置、および電子機器
JP2008222941A (ja) * 2007-03-15 2008-09-25 Toray Ind Inc 電子部品用接着剤組成物およびそれを用いた電子部品用接着シート
WO2009119324A1 (ja) * 2008-03-27 2009-10-01 ソニーケミカル＆インフォメーションデバイス株式会社 異方性導電フィルム、並びに、接合体及びその製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6132085A (ja) * 1984-07-24 1986-02-14 富士通株式会社 表示素子の実装方法
JP2007062126A (ja) * 2005-08-31 2007-03-15 Dainippon Printing Co Ltd インクジェットヘッド及びその製造方法
JP4580021B2 (ja) * 2009-01-26 2010-11-10 タツタ電線株式会社 接着剤組成物

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003268344A (ja) * 2002-03-20 2003-09-25 Shin Etsu Polymer Co Ltd 異方導電性接着剤及びヒートシールコネクター
JP2008165034A (ja) * 2006-12-28 2008-07-17 Sony Corp 集積モジュール、表示装置、および電子機器
JP2008222941A (ja) * 2007-03-15 2008-09-25 Toray Ind Inc 電子部品用接着剤組成物およびそれを用いた電子部品用接着シート
WO2009119324A1 (ja) * 2008-03-27 2009-10-01 ソニーケミカル＆インフォメーションデバイス株式会社 異方性導電フィルム、並びに、接合体及びその製造方法

Non-Patent Citations (5)

* Cited by examiner, † Cited by third party
Title
JP昭61-32085A 1986.02.14
JP特开2003-268344A 2003.09.25
JP特开2007-62126A 2007.03.15
JP特开2008-165034A 2008.07.17
JP特开2008-222941A 2008.09.25

Also Published As

Publication number Publication date
TW201134916A (en) 2011-10-16
WO2011077979A1 (ja) 2011-06-30
KR20120117832A (ko) 2012-10-24
CN102656244A (zh) 2012-09-05
JP2011132304A (ja) 2011-07-07
TWI493013B (zh) 2015-07-21
KR101727774B1 (ko) 2017-04-17
JP5825503B2 (ja) 2015-12-02

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Legal Events

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C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
C41 Transfer of patent application or patent right or utility model
TR01 Transfer of patent right

Effective date of registration: 20140820

Address after: Kanagawa

Patentee after: Three Bond Co., Ltd.

Address before: Tokyo, Japan

Patentee before: Three Bond Co., Ltd.