JP4580021B2 - 接着剤組成物 - Google Patents
接着剤組成物 Download PDFInfo
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- JP4580021B2 JP4580021B2 JP2009014152A JP2009014152A JP4580021B2 JP 4580021 B2 JP4580021 B2 JP 4580021B2 JP 2009014152 A JP2009014152 A JP 2009014152A JP 2009014152 A JP2009014152 A JP 2009014152A JP 4580021 B2 JP4580021 B2 JP 4580021B2
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- JP
- Japan
- Prior art keywords
- adhesive composition
- weight
- parts
- elastomer
- styrene
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J153/00—Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J177/00—Adhesives based on polyamides obtained by reactions forming a carboxylic amide link in the main chain; Adhesives based on derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
- C08L2666/14—Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
- C08L2666/20—Macromolecular compounds having nitrogen in the main chain according to C08L75/00 - C08L79/00; Derivatives thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
- C08L2666/24—Graft or block copolymers according to groups C08L51/00, C08L53/00 or C08L55/02; Derivatives thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L75/00—Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
- C08L75/04—Polyurethanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0133—Elastomeric or compliant polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Conductive Materials (AREA)
- Combinations Of Printed Boards (AREA)
- Inorganic Chemistry (AREA)
Description
表1に示した3種の樹脂成分をそれぞれ表に示した比率(重量比、樹脂固形分換算)で配合し、分散させた。分散はプラネタリー混練機を使用し、加温85℃、回転数50rpmで、6時間混練することにより行った。
溶剤:ジメチルホルムアミド(DMF) 180重量部
シクロヘキサノン 80重量部
トルエン 45重量部
充填材(タルク、平均粒径4〜5μm) 50重量部
粘着性付与剤(荒川化学工業(株)製、ペンセルD−125) 30重量部
安定剤(チバ・スペシャルティケミカルズ社製、イルガノックス(登録商標)1010) 1.3重量部
構成:ポリイミド 25μm/銅箔 18μm
電極メッキ:Ni3μ/Au0.3μm
ピッチ:3mm
電極幅(a):10mm
<PTF基板>
ポリマー:東レ(株)製ポリエチレンテレフタレート(PET) 188μm
銀ペースト:約10μm
*銀ペースト上にレジスト塗工
ピッチ:3mm
図4に示すように、引張試験機(ミネベア(株)製 PT−200N)で、引張速度100mm/min、剥離方向90度で剥離し、破断時の最大値を測定した。
図5に示すように、FPC/PTF試験用サンプルのFPC端末端子間で、低抵抗計(HIOKI製、直流方式 3227ミリオームハイテスタ)を使用して、a−b、b−c、c−d間の接続抵抗をそれぞれ測定し、平均値を求めた。
80℃で1000時間保持した後に、90度ピール強度を測定し、次の基準で評価した:
○:5N/cm以上、△:3N/cm以上、×:3N/cm未満。
スクリーン80メッシュ<テトロン(登録商標)>を使用し、乾燥膜厚(乾燥時間120℃、15分間)が20±5μmを維持する様に、印刷を実施した。目視により、スクリーンと印刷物間の糸引き、版ぬけ、泡かみ、にじみ等の有無を観察し、次の基準で評価した:
○:印刷作業性良好、△:普通、×不良。
コンスタントヒータ方式プレス機((株)大橋製作所製、HBM−10)を使用して、圧着温度130〜140℃、圧力30kgf/cm2、時間15秒でプレス圧着し、目視により、樹脂流れ、ボイド等を観察し、次の基準で評価した:
○:印刷作業性良好、△:普通、×不良。
接着剤組成物としてクロロプレン系組成物を用いた以外は上記と同様にして、90度ピール強度、接続抵抗を測定し、耐老化性を測定し、印刷作業性、プレス作業性を評価した。
2……ポリマー厚膜フィルム(PTF)基板
3……接着剤組成物
Claims (3)
- A.ポリアミドエラストマー 10〜80重量部、
B.ポリウレタンエラストマー 10〜80重量部、及び
C.スチレン−イソブチレン−スチレンコポリマー 10〜80重量部
(但し、A,B及びCの合計量を100重量部とする)
からなる樹脂成分を含有してなる接着剤組成物。 - 前記樹脂成分が、前記A.ポリアミドエラストマー中に前記B.ポリウレタンエラストマー及び前記C.スチレン−イソブチレン−スチレンコポリマーが分散した相分離構造を有することを特徴とする、請求項1に記載の接着剤組成物。
- 導電性フィラーをさらに含有することを特徴とする、請求項1又は2に記載の接着剤組成物。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009014152A JP4580021B2 (ja) | 2009-01-26 | 2009-01-26 | 接着剤組成物 |
TW099100549A TWI378132B (en) | 2009-01-26 | 2010-01-11 | Adhesive composition |
PCT/JP2010/000207 WO2010084722A1 (ja) | 2009-01-26 | 2010-01-15 | 接着剤組成物 |
KR1020107016570A KR101022124B1 (ko) | 2009-01-26 | 2010-01-15 | 접착제 조성물 |
CN2010800011133A CN101978016B (zh) | 2009-01-26 | 2010-01-15 | 粘接剂组合物 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009014152A JP4580021B2 (ja) | 2009-01-26 | 2009-01-26 | 接着剤組成物 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010168510A JP2010168510A (ja) | 2010-08-05 |
JP4580021B2 true JP4580021B2 (ja) | 2010-11-10 |
Family
ID=42355780
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009014152A Active JP4580021B2 (ja) | 2009-01-26 | 2009-01-26 | 接着剤組成物 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP4580021B2 (ja) |
KR (1) | KR101022124B1 (ja) |
CN (1) | CN101978016B (ja) |
TW (1) | TWI378132B (ja) |
WO (1) | WO2010084722A1 (ja) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5825503B2 (ja) * | 2009-12-22 | 2015-12-02 | スリーボンドファインケミカル株式会社 | 異方導電性接着剤 |
WO2012011265A1 (ja) * | 2010-07-23 | 2012-01-26 | タツタ電線株式会社 | 接着剤組成物及び接着フィルム |
JP5675975B2 (ja) * | 2011-05-31 | 2015-02-25 | タツタ電線株式会社 | 接着剤組成物及び接着フィルム |
JP5849036B2 (ja) * | 2012-09-27 | 2016-01-27 | 富士フイルム株式会社 | 導電ペースト、プリント配線基板 |
CN103173180B (zh) * | 2013-03-23 | 2015-06-24 | 广东新展化工新材料有限公司 | 一种热塑性胶黏剂及其制备方法 |
JP6251888B2 (ja) * | 2014-06-25 | 2017-12-27 | パナソニックIpマネジメント株式会社 | 投影システム |
CN105367735A (zh) * | 2015-11-23 | 2016-03-02 | 苏州盖德精细材料有限公司 | 一种鞋用聚氨酯胶粘剂及其制备方法 |
KR102336265B1 (ko) * | 2020-06-22 | 2021-12-06 | 김병수 | 오염물질 침입 방지형 이동식 캐리어 |
KR20240063724A (ko) | 2022-11-03 | 2024-05-10 | 율촌화학 주식회사 | 단차 추종성과 레진플로우가 우수한 열경화형 도전성 접착 필름 |
KR20240063725A (ko) | 2022-11-03 | 2024-05-10 | 율촌화학 주식회사 | 벤딩성 및 단차 추종성이 우수한 열경화형 도전성 접착 필름 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04145184A (ja) * | 1990-10-05 | 1992-05-19 | Nippon Zeon Co Ltd | 粘着剤組成物 |
JPH1153945A (ja) * | 1997-08-06 | 1999-02-26 | Furukawa Electric Co Ltd:The | ケーブル |
JP2004143219A (ja) * | 2002-10-22 | 2004-05-20 | Three Bond Co Ltd | 接着剤組成物 |
WO2005090509A1 (ja) * | 2004-03-19 | 2005-09-29 | Three Bond Co., Ltd. | 光硬化性感熱フィルム状接着剤組成物 |
JP2006152233A (ja) * | 2004-11-01 | 2006-06-15 | Tatsuta System Electronics Kk | 異方導電性接着剤及びこれを用いて形成された電子機器 |
JP2008274044A (ja) * | 2007-04-26 | 2008-11-13 | Fujitsu Ltd | 粘着材料、これを用いたタッチパネル型入力装置およびその製造方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3420809B2 (ja) * | 1993-12-16 | 2003-06-30 | 信越ポリマー株式会社 | 導電性粒子およびこれを用いた異方導電接着剤 |
EP0878505A4 (en) * | 1996-11-22 | 2000-05-03 | Daicel Chem | HOT MELT COMPOSITIONS AND MULTILAYERED OBJECTS CONTAINING LAYERS MADE THEREOF |
CN101255262A (zh) * | 2008-04-01 | 2008-09-03 | 宁波一舟塑胶有限公司 | 可与尼龙包覆粘结的热塑性弹性体 |
-
2009
- 2009-01-26 JP JP2009014152A patent/JP4580021B2/ja active Active
-
2010
- 2010-01-11 TW TW099100549A patent/TWI378132B/zh active
- 2010-01-15 CN CN2010800011133A patent/CN101978016B/zh active Active
- 2010-01-15 WO PCT/JP2010/000207 patent/WO2010084722A1/ja active Application Filing
- 2010-01-15 KR KR1020107016570A patent/KR101022124B1/ko active IP Right Grant
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04145184A (ja) * | 1990-10-05 | 1992-05-19 | Nippon Zeon Co Ltd | 粘着剤組成物 |
JPH1153945A (ja) * | 1997-08-06 | 1999-02-26 | Furukawa Electric Co Ltd:The | ケーブル |
JP2004143219A (ja) * | 2002-10-22 | 2004-05-20 | Three Bond Co Ltd | 接着剤組成物 |
WO2005090509A1 (ja) * | 2004-03-19 | 2005-09-29 | Three Bond Co., Ltd. | 光硬化性感熱フィルム状接着剤組成物 |
JP2006152233A (ja) * | 2004-11-01 | 2006-06-15 | Tatsuta System Electronics Kk | 異方導電性接着剤及びこれを用いて形成された電子機器 |
JP2008274044A (ja) * | 2007-04-26 | 2008-11-13 | Fujitsu Ltd | 粘着材料、これを用いたタッチパネル型入力装置およびその製造方法 |
Also Published As
Publication number | Publication date |
---|---|
CN101978016A (zh) | 2011-02-16 |
KR101022124B1 (ko) | 2011-03-17 |
JP2010168510A (ja) | 2010-08-05 |
KR20100096259A (ko) | 2010-09-01 |
CN101978016B (zh) | 2013-07-17 |
TW201031728A (en) | 2010-09-01 |
WO2010084722A1 (ja) | 2010-07-29 |
TWI378132B (en) | 2012-12-01 |
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