201031728 六、發明說明： 【發明所屬之·技術領威】 發明領域 本發明係關於一種黏著強度、耐熱性、作業性優良的 黏著劑組成物，尤其是關於一種適合於應用到導電性黏著 劑的黏著劑組成物。 發明背景 對於觸控面板的電極膜與連接器的黏著、各種薄膜基 板的黏著等…般是使用氣丁二稀系導電性黏著劑(例如專 利文獻1)。 然而’由於近年來對環境問題和安全性的要求提高， 對於黏著劑也強烈地要求無鹵素。另外，習知的氯丁二烯 系導電性黏著劑，根據用途，在黏著強度或耐熱性、作業 性的點上未必滿足要求’尤其是作為用於基板連接的黏著 劑組成物，有耐熱性難謂為足夠的問題。 因此’黏著強度、耐熱性、作業性每一者都優良的無 鹵素導電性黏著劑就受到需求，尤其，現狀是需求也能適 用於如上所述之基板連接的具有優良特性的材料。 【先前技術文獻】 【專利文獻】 【專利文獻1】特開2004-143219號公報 【發明内容3 發明概要 3 201031728 【發明欲解決之課題】 本發明係㈣於上述需求而完成者，目的在於提供一 種黏著強度、料性、作業性任—者都優㈣錢素黏著 劑組成物。其巾之目的尤其在於提供—種適合於應用到基 板的連接中所使用之導電性黏著劑的黏著劑組成物。 【用以欲解決課題之手段】 本發明人等為解決上述課題潛心研究的結果，發現透 過使用極性不同的3種熱可塑性彈性體，可以獲得黏著強度 與耐熱性優良的黏著劑，終而完成本發明。 亦即’本發明之黏著劑組成物係由含有A.聚酿胺彈性 體10〜80重|分’ B.聚氨基曱酸酯彈性體1〇〜8〇重量分， 及C.笨乙烯-異丁烯-苯乙烯共聚物1〇〜8〇重量分(但是a、 B及C的合計量為1〇〇重量分）組成之樹脂成分形成。 上述黏著劑域物巾_脂成分宜具有前述B聚氨 基甲酸㈣性體及前述C.苯乙稀異丁烯·苯乙烯共聚物分 散在前述A.聚醯胺彈性體中的相分離結構。 本發明之黏著劑組成物可以製成進一步含有導電性填 充劑。 【發明效果】 本發明黏著劑組成物不僅滿足無齒素的要求，黏著強 度、财熱性、作業性等也比習知的氯丁二稀系黏著劑優良， 適合於應用到觸控面板的電極膜與連接器的連接和各種薄 膜基板的連接中所使用之導電性黏著劑。 圖式簡單說明 201031728 [第1圖]所示為本發明的實施例中使用的撓性印刷基板 (以下有時簡寫成FPC)1之平面圖。 [第2圖]所示為本發明的實施例中使用的聚合物厚膜電 路片（以下有時簡寫成PTF)基板2之平面圖。 [第3圖]所示為上述FPcmRTT基板2的連接位置之平 面圖。 [第4圖]所示為9〇度剝離強度的試驗方法之斜視圖及斷 面圖。 [第5圖]所示為連接電阻的測定方法之平面圖。 t實施方式;J 用以實施發明之形態 以下將就本發明之黏著劑組成物做詳細說明。 本發明之黏著劑組成物是含有由聚酿胺系熱可塑性彈 性體（以下，有時簡寫成聚醯胺彈性體或TPAE)、聚氨基甲 酸酯系熱可塑性彈性體（以下，有時簡寫成聚氨基甲酸酯彈 性體或tpu) ’及苯㈣聚物（&兩端為聚 苯乙烯鏈，其間為聚異丁烯鏈形成的完全飽和型共聚物。 以下，有時也簡寫成SIBS)形成的樹脂成分者。此處「彈性 體」是指，具有熱可塑性的合成橡膠物質。尤其在本發明 中是使用由凝集力大的硬鏈段與撓性軟鏈段形成者。 本發明使用的聚醯胺系熱可塑性彈性體(TPAE)具有分 別將高熔點(Tm)的聚醯胺當做硬鏈段，將低熔點或低玻璃 轉移溫度(Tg)的聚醚或聚酯鏈當做軟鏈段的結構。11>八£的 硬鏈段可以使用尼龍12或尼龍6等。軟鏈段是兩者都可以使 5 201031728 用脂肪族聚醚或脂肪族聚酯。更具體的說是可以在胺系溶 劑或酮系溶劑中溶解者。 胺系溶劑可以例舉，二乙胺、三乙胺、丙胺、異丙胺、 二丙胺、二異丙胺、丁胺、異丁胺、sec-丁胺、tert-丁胺、 二丁胺、二異丁胺、三丁胺、戊胺、二戊胺、三戊胺、2-乙基己基胺、烯丙胺、苯胺、N-甲基苯胺、乙二胺、丙二 胺、二乙烯三胺、曱醯胺、N-甲基甲醯胺、N，N-二曱基曱 醯胺、Ν,Ν-二乙基曱醯胺、乙醯胺、N-曱基乙醯胺、N，N-二甲基乙醯胺、N-曱基丙醯胺、2-吡咯烷酮、N-甲基吡咯 院_、ε-己内醋、胺甲酸S旨等。 酮系溶劑可以例舉，丙酮、甲乙酮、2-戊酮、3-戊酮、 2-己酮、甲基異丁酮、2-庚酮、4-庚酮、二異丁酮、丙酮基 丙酮、亞異丙基丙酮、佛耳酮、異佛耳酮、環己酮、曱基 環己酮等。 市售產品中，可以使用例如，富士化成工業公司製的 ΤΡΑΕ系列（溶劑可溶性等級，聚醚酯醯胺型，聚酯醯胺型）。 其中又以 ΤΡΑΕ 系列的 ΤΡΑΕ-12、ΤΡΑΕ-31、ΤΡΑΕ-32、 ΤΡΑΕ-617、ΤΡΑΕ-Η471ΕΡ為佳。 聚氨基甲酸酯系熱可塑性彈性體(TPU)由聚氨基甲酸 酯硬鏈段和聚酯或聚醚軟鏈段構成，具有異氰酸酯與聚醇 通過氨基甲酸酯鍵鍵結成的構造。 聚酯系多元醇可以例舉，己二酸酯系、聚己内酯系、 聚碳酸酯系等；聚醚系多元醇可以例舉聚氧四亞甲基二醇 (PTMG)等。 201031728 異氰酸酯可以例舉，二苯甲烷二異氰酸酯（MDI)、 氫化MDI、異佛爾酮二異氰酸酯(IPDI)等。 市售產品中可以使用例如’ Nippon Polyurethane Industry Co·，Ltd.製的Miractran(註冊商標）系列。其中尤其 可以適當的使用 P390RSUP、R395SRNAT、P480RSUI、 P485RSUI、P490RSUI、P890RSUI、P22MRNAT、 P25MRNAT、P26MRNAT、P22SRNAT、P26SRNAT。 本發明使用的SIBS是由硬鏈段的苯乙稀和軟連段的異 丁烯形成者，以使異丁烯與苯乙烯發生活性聚合之三嵌段 共聚物結構為佳。SIBS因為主鏈是飽和型故具有優良的熱 安定性’會發揮讓使用它的黏著劑組成物之耐熱老化性大 幅提高的效果。市售產品中’可以使用例如Kanaka Corporation製的シ 7、’乂 夕一（SIBSTAR)(註冊商標）〇 上述聚醯胺彈性體、聚胺酯彈性體’及SIBS的混合比 例，當這3個成分的合計量為1〇〇重量分時，各成分的比例 落在10〜80重量分的範圍内’較佳的是分別在20〜60重量 分的範圍内的比例。 透過將聚醯胺彈性體的混合量定在1〇〜8〇重量分的範圍 内，可以製得與聚醯亞胺樹脂或金屬的黏著性良好的產品。 另外’透過將聚氨基甲酸酯彈性體的混合量定在丨〇〜 8〇重量分的範圍内，可以製得耐熱性、與金屬的密著性、 觸變性'網版印刷性良好者。 此外，透過將SIBS的混合量定在1〇〜8〇重量分的範圍 可以製得與聚對本二甲酸乙二醇酯樹脂或聚烯烴樹脂 7 201031728 或金屬的密著性和财熱性良好的產品。 通過使上述3種樹脂成分形成具有其中極性中等程度 的聚氨基甲酸酯彈性體及極性小的苯乙烯-異丁稀-苯乙烯 共聚物係各別地分散在極性最大的聚醯胺彈性體中的相分 離結構，可以獲得本發明之目的的黏著強度、耐熱性，及 作業性之任一者都優良的黏著劑組成物。 在獲得上述3種樹脂的分散體時，如果使用例如行星式 混練機之類的混練機，在3種樹脂中添加溶劑，予以加溫， 使之溶解混合即可。 溶劑可以使用N-甲基吡咯烷酮、己烷、庚烷、癸烷、 曱苯、二曱苯、環己烷、溶劑油等之氮系或醯胺系溶劑、 異佛耳酮等。 溶劑的使用量以在黏著劑組成物的固形分濃度會成為 10〜50重量％的範圍做使用為佳。固形分濃度如果不足10 重量％即無法確保塗布厚度，若超過50重量％則黏度會太 高，印刷變得困難。另外，與上述樹脂成分的關係是，相 對於樹脂成分100重量分，氮系或醯胺系溶劑、酮系溶劑以 分別在0〜375重量分，烴系溶劑在0〜125重量分的範圍内 為佳。 對於本發明之黏著劑組成物，可添加金屬粉等之導電 性粒子以賦予異方性導電性。 導電性粒子之例有，銅、銀、鉛、鋅、鐵、鎳等的金 屬粉，或者對這些金屬粉或塑膠粉或玻璃粉等的無機粉鍍 以鎳、金、銀、銅等之粒子。 201031728 導電性粒子的形狀並無特殊限制，可以使用球狀、鱗 片、馬铃薯狀、針狀、不絲等任意的粒子。大小以平均 粒徑1〜50μηι的範圍為佳。 導電性粒子的混合量雖然也取決於黏著劑組成物的用 途’但是通常相對上述樹脂成分刚重量分，以在丨〜觸重 量分的範圍内為佳。 本發明之黏著劑組成物中可依需要進—步添加會被使 用在黏著劑組成物巾的其他成分，亦即增黏师&咖㈣、 安定劑、抗氧化劑、填充劑、增強劑、顏料、消泡劑等。 【實施例】 以下所示為本發明的實施例，惟本發明並不受以下實 施例的限定。 [實施例1〜6，比較例1〜4] 將表1中所示的3種樹脂成分分別以示於表中的比例 (重量比、換算成樹脂固形分）混合，並使其分散。分散係使 用行星式混練機’以加溫85 C、轉數50rpm混練6小時的方 式進行。 在該樹脂成分100重量分(換算成固形分）中添加以卞成 分，經混合調製成黏著劑組成物。 導電性粒子：金屬粉(Ni粉，平均粒徑35μπι) 55重責分 溶劑：二甲基甲醯胺(DMF) 180重量分 環己酮 80重量分 甲苯45重量分 填充材（滑石，平均粒徑4〜5μηι) 50重量分 9 201031728 增黏劑（荒川化學工業（株)製，PenselD_125) 3〇重量分 · 女定劑(Ciba Specialty Chemicals公司製，IRGANOX(註 ’ 冊商標）1010) 1.3重量分 針對獲得的黏著劑組成物，測定9〇度剝離強度、連接 電阻、抗老化性，評價印刷作業性、壓製作業性。試驗用 樣品，測定•評價方法如下。結果示於表i。 90度剝離強度、連接電阻、抗老化性的試驗用樣品， 是將以下表的規格製作成之示於第丨圖的撓性印刷基板 1(以下有時簡寫成FPC)，和示於第2圖之聚合物厚膜路# 〇 (以下有時簡寫成PTF)基板2 ’如第3圖所示地，用黏著劑組 成物3 ’以壓製溫度，壓力3〇kgf/cm2壓製15秒鐘 予以連接製作成乾燥時的膜厚為2〇±5μιη。 〈FPC : ΝΙΚΚΑΝ工業（株）製〉 構成.聚酿亞胺25μηι/銅簿Ι8μηι 電極電鍍：Ni3p/Au〇.%m 節距：3 mm 電極寬(a) :10 mm ® 〈PTF基板〉 聚合物.東麗(株)製聚對苯二甲酸乙二醇醋(pET) 188μιη 銀膠：約ΙΟμιη *在銀膠上塗布抗蝕劑 節距：3mm 〈90度剝離強度〉 如第4圖所示，用拉伸試殮機（如加以冗。，ud.製 10 201031728 PT-200N) ’以拉伸速度100 mm/min，剝離方向90度進行剝 離，測定破斷時的最大值。 〈連接電阻〉 如第5圖所示，在FPC/PTF試驗用樣品的FPC端末端子 間，用低電阻計(11100製，直流式3227 111-〇11111扭丁63161·)， 分別測定a-b、b-c、c-d間的連接電阻，求算平均值。 〈抗老化性〉 在80°C保持1000小時後，測定90度剝離強度，以下列 基準進行評價： 〇：5 N/cm以上，△ : 3 N/cm以上，X :不足3 N/cm 〈印刷作業性〉 用80目網版〈Tetoron(註冊商標）〉，使乾燥膜厚（乾燥時 pBH20°C ’ 15分鐘）維持在20±5μηι的狀態下，實施印刷。通 過目視，觀察網版與印刷物間有無拉絲、版脫落、含泡、 滲出等，根據以下基準進行評價： 〇：作業性良好，△:普通，χ不良 〈壓製作業性〉 使用constant heater式壓製機（(株）大橋製作所製， HBM-10)’以壓製溫度130〜140°C，壓力30kgf/cm2,時間 15秒鐘進行軋製，通過目視觀察樹脂流動、空洞等，利用 以下基準進行評價： 〇.印刷作業性良好，△:普通，χ不良 [比較例5] 除使用氯丁二烯系組成物作為黏著劑組成物以外與上 11 201031728 述同樣地處理，測定90度剝離強度、連接電阻，測定抗老 化性，評價印刷作業性、壓製作業性。 [表1] 貧施例 比較例 1 2 3 4 5 6 1 2 1 4 < 聚醯胺彈性體 43 56 ———. 38 ~~ — 卜80 30 39 η Λ(\ υ 聚氨基甲酸酯彈性體 40 24 h--—- 20 / 11 οΖ _10_ 60 22 52 Q 83 SIBS 17 20 42、 Ό J 10 10 39 41 57 6 15 _ 氣丁二烯系黏著劑 - - - 100 90度剝離強(N/cm) 7 1U 8 6 10 4 8 3 6 7 連接電阻(Ω) 0.5 0.1 0.2 0.1 0.3 0.1 Λ勹 0.1 1 1.5 0.5 抗老化性 〇 〇 ---. 〇 U.Z 1 〇 〇 〇 X Λ X X Λ 印刷作業性 〇 〇 〇 〇 〇 Δ Γ\ 〇 〇 壓製作業性 〇 〇 — Δ U X Λ 〇 ---- 〇 〇 Γ\ Δ Λ Δ ΖΛ 【產業上之可利用性】 本發明之黏著劑組成物特別適用於各種基板的連接， ’ 亦即液晶面板與基板的連接，薄膜開關的連接、ELf光力 ‘ 子的連接等。 【圖式簡單說明】 [第1圖]所示為本發明的實施例中使用的撓性印刷基板 響 (以下有時簡寫成FPC)1之平面圖。 [第2圖]所示為本發明的實施例中使用的聚合物厚膜電 路片（以下有時簡寫成PTF)基板2之平面圖。 [第3圖]所示為上述FPC1與RTF基板2的連接位置之平 面圖。 [第4圖]所示為90度剝離強度的試驗方法之斜視圖及斷 面圖。 [第5圖]所示為連接電阻的測定方法之平面圖。 12 201031728201031728 VI. Description of the Invention: [Technical Advantages of the Invention] Field of the Invention The present invention relates to an adhesive composition excellent in adhesion strength, heat resistance, and workability, and more particularly to a composition suitable for application to a conductive adhesive. Adhesive composition. Background of the Invention A gas-butadiene-based conductive adhesive is used for adhesion of an electrode film of a touch panel to a connector, adhesion of various film substrates, and the like (for example, Patent Document 1). However, due to increased environmental and safety requirements in recent years, halogen-free is also strongly required for adhesives. In addition, the conventional chloroprene-based conductive adhesive does not necessarily satisfy the requirements in terms of adhesion strength, heat resistance, and workability depending on the application, particularly as an adhesive composition for substrate connection, and has heat resistance. Difficult to say that it is enough. Therefore, a halogen-free conductive adhesive which is excellent in adhesion strength, heat resistance, and workability is required, and in particular, the present invention is also applicable to materials having excellent characteristics as described above for substrate connection. [PRIOR ART DOCUMENT] [Patent Document 1] JP-A-2004-143219 SUMMARY OF THE INVENTION PROBLEMS TO BE SOLVED BY THE INVENTION The present invention is based on the above needs, and aims to provide A kind of adhesive strength, materiality, and workability--all of them are excellent (four) money adhesive composition. The purpose of the towel is particularly to provide an adhesive composition suitable for use in a conductive adhesive used in the connection of a substrate. [Means for Solving the Problem] As a result of intensive research to solve the above problems, the present inventors have found that an adhesive having excellent adhesion strength and heat resistance can be obtained by using three kinds of thermoplastic elastomers having different polarities, and finally completed. this invention. That is, the adhesive composition of the present invention is composed of A. polyamine elastomer 10 to 80 wt%, B. polyaminophthalate elastomer 1 〇 8 〇, and C. stupid ethylene - The isobutylene-styrene copolymer is formed by a resin component having a weight fraction of 1 〇 to 8 〇 (but a total amount of a, B, and C is 1 〇〇 by weight). The above-mentioned adhesive domain towel-lipid component preferably has a phase separation structure in which the aforementioned B-polycarbamic acid (tetra)carboxylic acid and the aforementioned C. styrene-isobutylene-styrene copolymer are dispersed in the aforementioned A. polyamine elastomer. The adhesive composition of the present invention can be made to further contain a conductive filler. [Effect of the Invention] The adhesive composition of the present invention not only satisfies the requirement of dentate-free, but also has excellent adhesion strength, heat recovery, workability, and the like, which is superior to a conventional chloroprene adhesive, and is suitable for application to an electrode of a touch panel. Conductive adhesive used in the connection of the film to the connector and the connection of various film substrates. BRIEF DESCRIPTION OF THE DRAWINGS 201031728 [Fig. 1] is a plan view showing a flexible printed circuit board (hereinafter sometimes abbreviated as FPC) 1 used in an embodiment of the present invention. Fig. 2 is a plan view showing a polymer thick film circuit sheet (hereinafter sometimes abbreviated as PTF) substrate 2 used in the embodiment of the present invention. [Fig. 3] is a plan view showing the connection position of the FPcmRTT substrate 2. [Fig. 4] is a perspective view and a cross-sectional view showing a test method of 9-inch peel strength. [Fig. 5] is a plan view showing a method of measuring the connection resistance. t embodiment; J for carrying out the invention. The adhesive composition of the present invention will be described in detail below. The adhesive composition of the present invention contains a thermoplastic amine elastomer (hereinafter sometimes abbreviated as a polyamide elastomer or TPAE) or a polyurethane thermoplastic elastomer (hereinafter, abbreviated as follows) Polyurethane elastomer or tpu) ' and benzene (tetra) polymer (& both ends are polystyrene chains, which are fully saturated copolymers formed by polyisobutylene chains. Hereinafter, sometimes abbreviated as SIBS) The resin component formed. Here, "elastomer" means a synthetic rubber material having thermoplasticity. In particular, in the present invention, a hard segment having a large cohesive force and a flexible soft segment are used. The polyamidoline-based thermoplastic elastomer (TPAE) used in the present invention has a polyether or polyester chain which has a high melting point (Tm) polyamine as a hard segment and a low melting point or a low glass transition temperature (Tg), respectively. As the structure of the soft segment. 11> Eight hard corners can be made of nylon 12 or nylon 6, etc. Soft segments are both available for 5 201031728 with aliphatic polyether or aliphatic polyester. More specifically, it can be dissolved in an amine solvent or a ketone solvent. The amine solvent may, for example, be diethylamine, triethylamine, propylamine, isopropylamine, dipropylamine, diisopropylamine, butylamine, isobutylamine, sec-butylamine, tert-butylamine, dibutylamine or diisoamine. Butylamine, tributylamine, pentylamine, diamylamine, triamylamine, 2-ethylhexylamine, allylamine, aniline, N-methylaniline, ethylenediamine, propylenediamine, diethylenetriamine, guanidine Indoleamine, N-methylformamide, N,N-didecylguanamine, hydrazine, hydrazine-diethylguanamine, acetamidine, N-mercaptoacetamide, N,N-di Methylacetamide, N-mercaptopropionamide, 2-pyrrolidone, N-methylpyrrolidone, ε-caprolactone, urethane, etc. The ketone solvent may, for example, be acetone, methyl ethyl ketone, 2-pentanone, 3-pentanone, 2-hexanone, methyl isobutyl ketone, 2-heptanone, 4-heptanone, diisobutyl ketone or acetone acetone. , isopropylideneacetone, phorbolone, isophorone, cyclohexanone, nonylcyclohexanone, and the like. For the commercially available product, for example, a ruthenium series (solvent solubility grade, polyether ester guanamine type, polyester guanamine type) manufactured by Fuji Chemical Industry Co., Ltd. can be used. Among them, ΤΡΑΕ-12, ΤΡΑΕ-31, ΤΡΑΕ-32, ΤΡΑΕ-617, ΤΡΑΕ-Η471Η are preferred. The polyurethane thermoplastic elastomer (TPU) is composed of a polyurethane hard segment and a polyester or polyether soft segment, and has a structure in which an isocyanate and a polyhydroxide are bonded via a urethane bond. The polyester-based polyol may, for example, be an adipate-based, polycaprolactone-based or polycarbonate-based polyhydric alcohol; and the polyether-based polyhydric alcohol may, for example, be polyoxytetramethylene glycol (PTMG). 201031728 The isocyanate may, for example, be diphenylmethane diisocyanate (MDI), hydrogenated MDI, isophorone diisocyanate (IPDI) or the like. For example, the Miractran (registered trademark) series manufactured by Nippon Polyurethane Industry Co., Ltd. can be used for the commercially available product. In particular, P390RSUP, R395SRNAT, P480RSUI, P485RSUI, P490RSUI, P890RSUI, P22MRNAT, P25MRNAT, P26MRNAT, P22SRNAT, and P26SRNAT can be used as appropriate. The SIBS used in the present invention is formed by a hard segment of styrene and a soft segment of isobutylene, and a triblock copolymer structure in which isobutylene and styrene are livingly polymerized is preferred. Since the SIBS has a good thermal stability because the main chain is saturated, it exerts an effect of greatly improving the heat aging resistance of the adhesive composition using the same. In the commercially available product, for example, the mixing ratio of シ7, 'SIBSTAR (registered trademark) 〇 the above polyamine elastomer, polyurethane elastomer' and SIBS manufactured by Kanaka Corporation can be used. When the total amount is 1 part by weight, the proportion of each component falls within the range of 10 to 80 parts by weight, and it is preferable that the ratio is in the range of 20 to 60 parts by weight, respectively. By setting the mixing amount of the polyamide elastomer in a range of from 1 Torr to 8 Torr, a product having good adhesion to a polyimide resin or a metal can be obtained. Further, by setting the mixing amount of the polyurethane elastomer to a range of 丨〇 8 to 8 Å, it is possible to obtain heat resistance, adhesion to metal, and thixotropic 'screen printing property. In addition, by setting the mixing amount of SIBS in the range of 1 〇 to 8 〇 by weight, a product having good adhesion and good heat with the polyethylene terephthalate resin or polyolefin resin 7 201031728 or metal can be obtained. . The above-mentioned three kinds of resin components are each formed into a polyamidamide elastomer having a polystyrene elastomer having a moderate polarity and a small styrene-isobutylene-styrene copolymer having a small polarity dispersed in the largest polarity. In the phase separation structure, an adhesive composition excellent in any of adhesion strength, heat resistance, and workability of the object of the present invention can be obtained. When a dispersion of the above three kinds of resins is obtained, if a kneader such as a planetary kneader is used, a solvent is added to the three kinds of resins, and the mixture is heated and dissolved. As the solvent, a nitrogen-based or guanamine-based solvent such as N-methylpyrrolidone, hexane, heptane, decane, toluene, diphenylbenzene, cyclohexane or solvent oil, or isophorone can be used. The amount of the solvent to be used is preferably in the range of 10 to 50% by weight based on the solid content of the adhesive composition. If the solid content concentration is less than 10% by weight, the coating thickness cannot be ensured, and if it exceeds 50% by weight, the viscosity is too high and printing becomes difficult. In addition, the relationship with the resin component is such that the nitrogen-based or guanamine-based solvent and the ketone-based solvent are each in an amount of 0 to 375 parts by weight, and the hydrocarbon-based solvent is in the range of 0 to 125 parts by weight, based on 100 parts by weight of the resin component. It is better. To the adhesive composition of the present invention, conductive particles such as metal powder may be added to impart anisotropic conductivity. Examples of the conductive particles include metal powders such as copper, silver, lead, zinc, iron, and nickel, or particles of nickel, gold, silver, copper, and the like, such as inorganic powders such as metal powders or plastic powders or glass powders. . 201031728 The shape of the conductive particles is not particularly limited, and any particles such as a sphere, a scale, a potato, a needle, or a filament can be used. The size is preferably in the range of an average particle diameter of 1 to 50 μm. The amount of the conductive particles to be mixed depends on the use of the adhesive composition, but is usually in the range of 丨 to the weight of the resin component. The adhesive composition of the present invention may further add other components which will be used in the adhesive composition towel, that is, an viscosifier & coffee, a stabilizer, an antioxidant, a filler, an enhancer, Pigments, defoamers, etc. EXAMPLES Examples of the invention are shown below, but the invention is not limited by the following examples. [Examples 1 to 6 and Comparative Examples 1 to 4] The three kinds of resin components shown in Table 1 were each mixed at a ratio (weight ratio, converted into a resin solid content) shown in the table, and dispersed. The dispersion was carried out by a planetary kneader at a temperature of 85 C and a number of revolutions of 50 rpm for 6 hours. To the resin component, 100 parts by weight (calculated as a solid component), a cerium component was added and mixed to prepare an adhesive composition. Conductive particles: metal powder (Ni powder, average particle size 35μπι) 55 heavy solvent: dimethylformamide (DMF) 180 parts by weight cyclohexanone 80 parts by weight toluene 45 parts by weight filler (talc, average particle size 4~5μηι) 50 parts by weight 9 201031728 Adhesive agent (PenselD_125, manufactured by Arakawa Chemical Co., Ltd.) 3 〇 Weights · Female Pharmacy (manufactured by Ciba Specialty Chemicals, IRGANOX (Note) 1010) 1.3 Weight With respect to the obtained adhesive composition, the 9-degree peel strength, the connection resistance, and the aging resistance were measured, and the printing workability and the press workability were evaluated. For the test sample, the measurement and evaluation methods are as follows. The results are shown in Table i. The sample for the test of the 90-degree peeling strength, the connection resistance, and the aging resistance is the flexible printed circuit board 1 (hereinafter abbreviated as FPC) which is shown in the following table, and is shown in the second. Figure polymer thick film road # 〇 (hereinafter sometimes abbreviated as PTF) substrate 2 ' as shown in Figure 3, with the adhesive composition 3 'pressed at a pressing temperature, pressure 3 〇 kgf / cm 2 for 15 seconds The film thickness when the connection was made to dry was 2 〇 ± 5 μιη. <FPC: ΝΙΚΚΑΝIndustry Co., Ltd.> Composition. Polyaniline 25μηι/铜簿Ι8μηι Electrode plating: Ni3p/Au〇.%m Pitch: 3 mm Electrode width (a): 10 mm ® <PTF substrate> Polymerization Toray Polyethylene Terephthalate (pET) 188μιη Silver Glue: About ΙΟμιη * Coating resist pitch on silver paste: 3mm <90 degree peel strength> As shown in Figure 4 It is shown that the tensile tester (for redundancy, ud. 10 201031728 PT-200N) was peeled at a tensile speed of 100 mm/min and a peeling direction of 90 degrees, and the maximum value at the time of breaking was measured. <Connection resistance> As shown in Fig. 5, the low resistance meter (11100 system, DC type 3227 111-〇11111 twisted 63161·) was used to measure ab and bc, respectively, between the FPC end of the FPC/PTF test sample. The connection resistance between cd and cd is calculated as the average value. <Aging resistance> After maintaining at 80 ° C for 1,000 hours, the 90-degree peel strength was measured and evaluated on the following basis: 〇: 5 N/cm or more, Δ: 3 N/cm or more, and X: less than 3 N/cm 〈 Printing workability> Printing was carried out by using a 80-mesh screen (Tetoron (registered trademark)) to maintain a dry film thickness (pBH20 ° C '15 minutes during drying) at 20 ± 5 μm. By visual observation, the presence or absence of wire drawing, plate peeling, foaming, and bleeding between the screen and the printed matter was observed and evaluated according to the following criteria: 〇: good workability, △: ordinary, poor 〈 [pressing workability] using a constant heater type press (manufactured by Asahi Kasei Co., Ltd., HBM-10) was rolled at a pressing temperature of 130 to 140 ° C and a pressure of 30 kgf/cm 2 for 15 seconds. The resin flow and voids were visually observed and evaluated by the following criteria:印刷. Good printing workability, △: ordinary, χ [ [Comparative Example 5] The same treatment as described in the above 11 201031728 except that the chloroprene-based composition was used as the adhesive composition, and the 90-degree peel strength and the connection resistance were measured. The anti-aging property was measured, and the printing workability and the press workability were evaluated. [Table 1] Lean application Comparative Example 1 2 3 4 5 6 1 2 1 4 < Polyamide elastomer 43 56 ———. 38 ~~ — Bu 80 30 39 η Λ (\ 聚 Polyurethane Elastomer 40 24 h---- 20 / 11 οΖ _10_ 60 22 52 Q 83 SIBS 17 20 42, Ό J 10 10 39 41 57 6 15 _ Gas Butadiene Adhesive - - - 100 90 degree peeling strong ( N/cm) 7 1U 8 6 10 4 8 3 6 7 Connection resistance (Ω) 0.5 0.1 0.2 0.1 0.3 0.1 Λ勹 0.1 1 1.5 0.5 Anti-aging properties ----. 〇UZ 1 〇〇〇X Λ XX Λ Printing workability 〇〇〇〇〇 Δ Γ 〇〇 〇〇 pressing workability 〇〇 Δ UX Λ 〇 - - Δ Λ Δ ΖΛ [Industrial Applicability] Adhesive composition of the present invention It is especially suitable for the connection of various substrates, 'that is, the connection between the liquid crystal panel and the substrate, the connection of the membrane switch, the connection of the ELf light force', etc. [Simplified illustration of the drawing] [Fig. 1] shows the implementation of the present invention. The flexible printed circuit board used in the example (hereinafter sometimes abbreviated as FPC) 1 is a plan view. [Fig. 2] shows an embodiment of the present invention. A plan view of the polymer thick film sheet (hereinafter sometimes abbreviated as PTF) substrate 2. [Fig. 3] is a plan view showing the connection position of the FPC1 and the RTF substrate 2. [Fig. 4] shows 90 degrees. A perspective view and a cross-sectional view of the test method for peel strength. [Fig. 5] is a plan view showing a method of measuring the connection resistance. 12 201031728
【主要元件符號說明】 1···撓性印刷基板(FPC) 2.. .聚合物厚膜(PTE)基板 3.. .黏著劑組成物 13[Description of main component symbols] 1···Flexible printed circuit board (FPC) 2.. Polymer thick film (PTE) substrate 3.. Adhesive composition 13