CN101978016B - Adhesive composition - Google Patents

Adhesive composition Download PDF

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CN101978016B
CN101978016B CN2010800011133A CN201080001113A CN101978016B CN 101978016 B CN101978016 B CN 101978016B CN 2010800011133 A CN2010800011133 A CN 2010800011133A CN 201080001113 A CN201080001113 A CN 201080001113A CN 101978016 B CN101978016 B CN 101978016B
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weight parts
adhesive composition
weight
resinous principle
mentioned
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CN101978016A (en
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木下淳一
寺田恒彦
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Tatsuta Electric Wire and Cable Co Ltd
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Tatsuta Electric Wire and Cable Co Ltd
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J153/00—Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J177/00—Adhesives based on polyamides obtained by reactions forming a carboxylic amide link in the main chain; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/14—Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
    • C08L2666/20—Macromolecular compounds having nitrogen in the main chain according to C08L75/00 - C08L79/00; Derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/24—Graft or block copolymers according to groups C08L51/00, C08L53/00 or C08L55/02; Derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L75/00—Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
    • C08L75/04—Polyurethanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)
  • Combinations Of Printed Boards (AREA)
  • Inorganic Chemistry (AREA)

Abstract

Disclosed is an adhesive composition which has excellent adhesion strength, heat resistance and workability, without using halogen. The adhesive composition is suitable for applications in conductive adhesives which are especially suitable for connecting substrates. Specifically disclosed is an adhesive composition which contains a resin component that is composed of (A) 10-80 parts by weight of a polyamide elastomer, (B) 10-80 parts by weight of a polyurethane elastomer and (C) 10-80 parts by weight of a styrene-isobutylene-styrene copolymer (with the total of (A), (B) and (C) being 100 parts by weight).

Description

Adhesive composite
Technical field
The present invention relates to good adhesive composites such as bonding strength, thermotolerance, operability, particularly relate to the adhesive composite that is suitable for the application of conductive adhesive.
Background technology
In being connected of bonding, the various film substrates of the electrode film of touch panel and junctor etc., generally use chloroprene class conductive adhesive (for example, patent documentation 1).
But, in recent years because environmental problem reaches the requirement raising to security, so strong request Halogen caking agent.In addition, existing chloroprene class conductive adhesive is according to purposes, consider from aspects such as bonding strength or thermotolerance, operability, may not meet the demands, particularly as the adhesive composite that is used for substrate bonding, have the thermotolerance sufficient problem of can not saying so.
Here, present situation is any all good Halogen conductive adhesives of requirement bonding strength, thermotolerance, operability, particularly requires to be suitable for the bonding adhesive composite with good characteristic of aforesaid substrate.
The prior art document
Patent documentation
Patent documentation 1: the spy opens the 2004-143219 communique
Summary of the invention
Invent problem to be solved
The present invention In view of the foregoing proposes, purpose provides bonding strength, thermotolerance, operability any all good Halogen adhesive composites.Wherein, purpose provides the adhesive composite that is suitable for the employed application to conductive adhesive of substrate bonding.
Be used for solving the means of problem
The inventor concentrates one's attention on found that of research in order to solve above-mentioned problem, by adopting 3 kinds of different thermoplastic elastomers of polarity, can obtain the caking agent of bonding strength and excellent heat resistance, has finished the present invention.
Namely, adhesive composite of the present invention contains following resinous principle and forms: comprise A. polyamide elastomer 10～80 weight parts, B. polyurethane elastomer 10～80 weight parts and C. vinylbenzene-isobutylene-styrene copolymer 10～80 weight parts (wherein, weight is the conversion of resin solid composition, and the total amount of A, B and C is 100 weight parts) resinous principle.
Resinous principle in the above-mentioned adhesive composite, it is preferred having the phase separation structure that has disperseed above-mentioned B. polyurethane elastomer and C. vinylbenzene-isobutylene-styrene copolymer in above-mentioned A. polyamide elastomer.
Adhesive composite of the present invention further contains electroconductive stuffing.
The invention effect
Adhesive composite of the present invention, not only satisfy the requirement of Halogen, and, bonding strength, thermotolerance, operability etc. are compared all good with existing chloroprene class caking agent, be suitable for the application of using in being connected of the bonding or various film substrates of the electrode film of touch panel and junctor to conductive adhesive.
Description of drawings
The orthographic plan of the flexible printing substrate 1 (the following FPC that is called for short sometimes) that Fig. 1 uses in the embodiment of the invention for expression.
The orthographic plan of the polymer thick film 2 (the following PTF that is called for short sometimes) that Fig. 2 uses in the embodiment of the invention for expression.
Fig. 3 is the orthographic plan of the link position of the above-mentioned FPC1 of expression and PTF substrate 2.
Fig. 4 is stereographic map and the sectional drawing of 90 degree peeling strength test methods.
Fig. 5 connects the measuring method orthographic plan of resistance for expression.
The explanation of symbol
1... flexible printing substrate (FPC)
2... polymer thick film (PTF) substrate
3... adhesive composite
Embodiment
Below adhesive composite of the present invention is described in detail.
Adhesive composite of the present invention contains: (two ends are polystyrene chain to comprise polyamide-based thermoplastic elastomer (following polyamide elastomer or the TPAE of being called for short sometimes), polyurethanes thermoplastic elastomer (following polyurethane elastomer or the TPU of being called for short sometimes) and vinylbenzene-isobutylene-styrene copolymer, the complete saturation type multipolymer that constitutes for the polyisobutene chain is called for short SIBS below sometimes therebetween) resinous principle.Here, so-called " elastomerics " refers to have the elastomerics of thermoplasticity synthetic rubber material.Particularly among the present invention, refer to contain the elastomerics of the big hard segment of cohesive force and flexible soft chain segment.
The polyamide-based thermoplastic elastomer (TPAE) that the present invention uses has: respectively by the polymeric amide of high-melting-point (Tm) as hard segment, with the polyethers of low melting point or reduced TG transition point (Tg) or the polyester chain structure as soft chain segment.As the hard segment of TPAE, can adopt nylon 12 or nylon 6 etc.As soft chain segment, both can adopt aliphatic polyether or aliphatic polyester.Polymer soluble in amine solvent or ketones solvent more particularly.
As amine solvent, can enumerate diethylamine, triethylamine, propylamine, Isopropylamine, dipropyl amine, Diisopropylamine, butylamine, isobutylamine, the second month in a season-butylamine, uncle-butylamine, dibutylamine, diisobutylamine, Tributylamine, amylamine, diamylamine, triamylamine, 2 ethyl hexylamine, allylamine, aniline, methylphenylamine, quadrol, propylene diamine, diethylenetriamine, methane amide, the N-methylformamide, N, dinethylformamide, N, the N-diethylformamide, ethanamide, the N-methylacetamide, N,N-dimethylacetamide, the N-methyl propanamide, 2-Pyrrolidone, N-methylpyrroline ketone, ε-Ji Neixianan, urea acid esters etc.
As ketones solvent, can enumerate acetone, methylethylketone, 2 pentanone, propione, methyl-n-butyl ketone, mibk, 2-heptanone, dipropyl ketone, diisobutyl ketone, acetonyl-acetone, mesityl oxide, sym.-diisopropylideneacetone, isophorone, pimelinketone, methylcyclohexanone etc.
Market sale, for example, can adopt Fuji to change into the TPAE series (solvent soluble grade, polyether ester amides type, polyesteramide type) that industry (strain) is made.Wherein, the TPAE-12 of TPAE series, TPAE-31, TPAE-32, TPAE-617, TPAE-H471EP are preferred.
Polyurethane termoplastic elastomer (TPU) contains rigid polyurethane segment and polyester or polyether soft segments, has the structure that isocyanic ester and polyvalent alcohol are combined by urethane bonds.
As the polyester polyvalent alcohol, can enumerate adipic acid ester class, polycaprolactam amine, polycarbonate-based etc., as polyether alcohol, can enumerate polyoxygenated tetramethylene glycol (PTMG) etc.
As isocyanic ester, can enumerate 4,4 '-diphenylmethanediisocyanate (MDI), hydrogenation MDI, isophorone diisocyanate (IPDI) etc.
Market sale, for example, ミ ラ Network ト ラ Application (registered trademark) series that can adopt Japanese polyurethane industry (strain) to make.Wherein, can preferably adopt P390RSUP, P395SRNAT, P480RSUI, P485RSUI, P490RSUI, P890RSUA, P22MRNAT, P25MRNAT, P26MRNAT, P22SRNAT, P26SRNAT.
The SIBS that uses among the present invention contains as the vinylbenzene of hard segment and iso-butylene as soft chain segment, and three block structures that iso-butylene and vinylbenzene carry out living polymerization are preferred.Be saturation type by the SIBS main chain, have good thermostability, adopt the heat-resistant aging of its adhesive composite to be improved greatly.Market sale, for example, the SIBSTAR (registered trademark) that can adopt (strain) カ ネ カ to make.
The cooperation ratio of above-mentioned polyamide elastomer, polyurethane elastomer and SIBS, when the total amount of this 3 composition was 100 weight parts, each composition reached the ratio in 10～80 weight part scopes, more preferably was respectively the ratio in 20～60 weight part scopes that reach.
Reach by the use level that makes polyamide elastomer in the scope of 10～80 weight parts, can reach good with the cementability of polyimide resin or metal.
In addition, reach by the use level that makes polyurethane elastomer in the scope of 10～80 weight parts, thermotolerance, can reach good with cementability, thixotropy, the silk screen printing of metal.
In addition, reach by the use level that makes SIBS in the scope of 10～80 weight parts, reach good with cementability and the thermotolerance of pet resin and polyolefin resin or metal.
Above-mentioned 3 kinds of resinous principles, wherein, in the polyamide elastomer of polarity maximum, disperseed the medium polyurethane elastomer of polarity and polarity resinous principle little vinylbenzene-iso-butylene-styrene copolymer, that have phase separation structure respectively, can reach purpose of the present invention, any all good adhesive composites that obtain bonding strength, thermotolerance, operability.
In order to obtain the dispersion of above-mentioned 3 kinds of resins, for example, adopt the mixing roll as planetary mixing roll, add solvent in 3 kinds of resins, heat, carry out solvent and also can.
As solvent, can adopt N-Methyl pyrrolidone, hexane, heptane, decane, toluene, dimethylbenzene, hexanaphthene, solvent wet goods nitrogen class or amide solvent, isophorone etc.
As the consumption of solvent, it is preferred that the solid component concentration of adhesive composite reaches 10～50 weight % scopes.When solid component concentration during less than 10 weight %, can not guarantee coating thickness, when greater than 50 weight %, it is too high that viscosity becomes, the printing difficulty.In addition since with the relation of above-mentioned resinous principle, resinous principle 100 weight parts relatively, nitrogen class or amide solvent, ketones solvent are respectively 0～375 weight part, it is preferred that varsol reaches in 0～125 weight part scope.
In adhesive composite of the present invention, add electroconductive particles such as metal powder, can give anisotropic conductive.
As the example of electroconductive particle, can enumerate metal powders such as copper, silver, lead, zinc, iron, nickel, or on these metal powders or inorganic powder such as synthetic resin moulding compound or glass powder the particle of plated nickel, gold and silver, copper etc.
Shape to electroconductive particle is not particularly limited, and can use arbitrary shapes such as proper sphere, scale, potato shape, needle-like, amorphous, and its size is preferred for the scope of median size 1～50 μ m.
The use level of electroconductive particle, according to the purposes of adhesive composite, the scope that common above-mentioned relatively resinous principle 100 weight parts are 1～100 weight part is preferred.
In adhesive composite of the present invention, can further add other compositions that use in the adhesive composite as required, i.e. cementability imparting agent (tackifier), stablizer, oxidation inhibitor, filler, toughener, pigment, defoamer etc.
Embodiment
Embodiments of the invention are shown below, but the present invention is not limited by the following example.
[embodiment 1～6, comparative example 1～4]
3 kinds of resinous principles shown in the table 1 are cooperated, disperse in the ratio (weight ratio is converted into the resin solid composition) shown in the table respectively.Disperse to use planetary mixing roll, heat to 85 ℃ in rotating speed 50rpm mixing 6 hours.
In these resinous principle 100 weight parts (being converted into solids component), add, mix following composition, the preparation adhesive composite.
Electroconductive particle: metal powder (Ni powder, median size 35 μ m) 55 weight parts
Solvent: dimethyl formamide (DMF) 180 weight parts
Pimelinketone 80 weight parts
Toluene 45 weight parts
Filler (talcum, median size 4～5 μ m) 50 weight parts
The cementability imparting agent
(waste river chemical industry (strain) is made, ペ Application セ Le D-125) 30 weight parts
Stablizer (the special chemical society of Chiba makes イ Le ガ ノ Star Network ス (registered trademark) 1010)
1.3 weight part
The adhesive composite that obtains is measured 90 degree stripping strengths, connected resistance, ageing resistance, estimate printing operation, punching operation.Test sample, evaluation of measuring method such as following.The results are shown in table 1.
The test sample of 90 degree stripping strengths, connection resistance, ageing resistance, the flexible printing substrate shown in Figure 1 that the following table specification is made (the following FPC that is called for short sometimes) 1 and polymer thick film (the following PTF that is called for short sometimes) substrate 2 shown in Figure 2, as shown in Figure 3, adopt adhesive composite 3, at 130～140 ℃ of crimping temperature, pressure 30kgf/cm 2Pressurize and carried out crimping, connection in 15 seconds, make, so that the thickness when dry reaches 20 ± 5 μ m.
＜FPC: ニ Star カ Application industry (strain) is made 〉
Constitute: polyimide 25 μ m/ Copper Foils 18 μ m
Electrode plating: Ni 3 μ/Au 0.3 μ m
Pitch: 3mm
Electrode wide (a): 10mm
＜PTF substrate 〉
Polymkeric substance: make in east beautiful (strain), polyethylene terephthalate (PET) 188 μ m
Silver paste: about 10 μ m
* painting erosion resistant agent on silver paste
Pitch: 3mm
＜90 degree stripping strengths 〉
As shown in Figure 4, (ミ ネ ベ ア (strain) makes, and PT-200N), is determined at that draw speed 100mm/min, direction of delaminate 90 degree peel off, the maximum value when rupturing with tensile testing machine.
＜connection resistance 〉
As shown in Figure 5, between the terminal of FPC/PTF test with the FPC end of sample, with low ohmmeter (HI OKI makes, direct current mode, 3227 ミ リ オ, one Si Ha イ テ ス タ), measure the connection resistance between a-b, b-c, c-d respectively, obtain mean value.
＜ageing resistance 〉
After 1000 hours, measure 90 degree stripping strengths in 80 ℃ of maintenances, estimate with following standard.
Zero: 5N/cm is above, △: 3N/cm is above, *: less than 3N/cm
＜printing operation 〉
Use silk screen 80 orders＜テ ト ロ Application (registered trademark) 〉, remain in dry film thickness (drying temperature 120 ℃, 15 minutes) under the state of 20 ± 5 μ m and implement printing.By visual, have or not curled hair, version to extract, bubble, ooze the moon etc. out between observation silk screen and print, estimate with following standard.
Zero: printing operation is good, △: common, *: bad
＜punching operation 〉
With the contact heating type stamping machine ((strain) bridge is made manufacturing, HBM-10), 130～140 ℃ of crimping temperature, pressure 30kgf/cm 2Pressurize and carried out crimping in 15 seconds, visual, observe resin flows, space etc., estimate with following standard.
Zero: punching operation is good, △: common, *: bad
Comparative example 5
, except adopting the chloroprene based composition, with above-mentioned same operation, measure 90 degree stripping strengths, connect resistance as adhesive composite, measure ageing resistance, estimate printing operation, punching operation
Table 1
Figure BPA00001211640600081
Utilize possibility on the industry
Adhesive composite of the present invention is particularly suitable for the connection of various substrates, i.e. connection of being connected of liquid crystal panel and substrate, or the connection of thin film switch, EL backlight terminal etc.

Claims (4)

1. conductive adhesive composition, contain resinous principle and electroconductive stuffing, described resinous principle is the resinous principle that comprises A. polyamide elastomer 10～80 weight parts, B. polyurethane elastomer 10～80 weight parts and C. vinylbenzene-isobutylene-styrene copolymer 10～80 weight parts, wherein, the total amount of A, B and C is 100 weight parts.
2. according to the described conductive adhesive composition of claim 1, it is characterized in that above-mentioned resinous principle has the phase separation structure that has disperseed above-mentioned B. polyurethane elastomer and C. vinylbenzene-isobutylene-styrene copolymer in above-mentioned A. polyamide elastomer.
3. according to claim 1 or 2 described conductive adhesive compositions, it is characterized in that, contain above-mentioned electroconductive stuffing 1～100 weight part with respect to described resinous principle 100 weight parts.
4. according to the described conductive adhesive composition of claim 3, it is characterized in that, be used for bonding or film substrate bonding of the electrode film of touch panel.
CN2010800011133A 2009-01-26 2010-01-15 Adhesive composition Active CN101978016B (en)

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JP5825503B2 (en) * 2009-12-22 2015-12-02 スリーボンドファインケミカル株式会社 Anisotropic conductive adhesive
KR101741292B1 (en) * 2010-07-23 2017-05-29 다츠다 덴센 가부시키가이샤 Adhesive agent composition and adhesive film
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CN103173180B (en) * 2013-03-23 2015-06-24 广东新展化工新材料有限公司 Thermoplastic adhesive and preparation method thereof
WO2015198578A1 (en) * 2014-06-25 2015-12-30 パナソニックＩｐマネジメント株式会社 Projection system
CN105367735A (en) * 2015-11-23 2016-03-02 苏州盖德精细材料有限公司 Polyurethane adhesive used for shoes and preparation method thereof
KR102336265B1 (en) * 2020-06-22 2021-12-06 김병수 Contaminant intrusion prevention type mobile carrier
KR102699619B1 (en) 2022-11-03 2024-08-28 율촌화학 주식회사 Thermally curable conductive bonding film with excellent step followability and resin flow, and manufacturing method thereof
KR102699620B1 (en) 2022-11-03 2024-08-28 율촌화학 주식회사 Thermally curable conductive bonding film with excellent bending property and step followability, and manufacturing method thereof

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