JP5825503B2 - 異方導電性接着剤 - Google Patents
異方導電性接着剤 Download PDFInfo
- Publication number
- JP5825503B2 JP5825503B2 JP2009291073A JP2009291073A JP5825503B2 JP 5825503 B2 JP5825503 B2 JP 5825503B2 JP 2009291073 A JP2009291073 A JP 2009291073A JP 2009291073 A JP2009291073 A JP 2009291073A JP 5825503 B2 JP5825503 B2 JP 5825503B2
- Authority
- JP
- Japan
- Prior art keywords
- component
- anisotropic conductive
- conductive adhesive
- test
- acp
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000853 adhesive Substances 0.000 title claims description 29
- 230000001070 adhesive effect Effects 0.000 title claims description 29
- 229920001971 elastomer Polymers 0.000 claims description 27
- 239000011248 coating agent Substances 0.000 claims description 23
- 238000000576 coating method Methods 0.000 claims description 23
- 239000000806 elastomer Substances 0.000 claims description 23
- 239000004952 Polyamide Substances 0.000 claims description 14
- 238000002844 melting Methods 0.000 claims description 14
- 230000008018 melting Effects 0.000 claims description 14
- 229920002647 polyamide Polymers 0.000 claims description 14
- 239000002904 solvent Substances 0.000 claims description 10
- 239000000843 powder Substances 0.000 claims description 9
- 238000007650 screen-printing Methods 0.000 claims description 8
- 238000007747 plating Methods 0.000 claims description 7
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 5
- 150000001875 compounds Chemical class 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 claims description 4
- FPAFDBFIGPHWGO-UHFFFAOYSA-N dioxosilane;oxomagnesium;hydrate Chemical compound O.[Mg]=O.[Mg]=O.[Mg]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O FPAFDBFIGPHWGO-UHFFFAOYSA-N 0.000 claims description 2
- 239000011146 organic particle Substances 0.000 claims description 2
- 238000006116 polymerization reaction Methods 0.000 claims description 2
- 235000021122 unsaturated fatty acids Nutrition 0.000 claims description 2
- 150000004670 unsaturated fatty acids Chemical class 0.000 claims description 2
- 238000012360 testing method Methods 0.000 description 40
- 239000010408 film Substances 0.000 description 18
- 239000002245 particle Substances 0.000 description 16
- 239000007787 solid Substances 0.000 description 12
- 239000011521 glass Substances 0.000 description 10
- 239000000126 substance Substances 0.000 description 10
- 229920002799 BoPET Polymers 0.000 description 9
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 9
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 9
- 238000000034 method Methods 0.000 description 8
- 239000000203 mixture Substances 0.000 description 8
- 238000007719 peel strength test Methods 0.000 description 7
- 238000007792 addition Methods 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- HJOVHMDZYOCNQW-UHFFFAOYSA-N isophorone Chemical compound CC1=CC(=O)CC(C)(C)C1 HJOVHMDZYOCNQW-UHFFFAOYSA-N 0.000 description 6
- 229920000728 polyester Polymers 0.000 description 6
- 235000010724 Wisteria floribunda Nutrition 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- 230000007423 decrease Effects 0.000 description 4
- 238000001035 drying Methods 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 239000011295 pitch Substances 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- 229920006311 Urethane elastomer Polymers 0.000 description 3
- 239000011162 core material Substances 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- -1 polyethylene terephthalate Polymers 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 229920003225 polyurethane elastomer Polymers 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- HZZOUWBMMWVPTR-UHFFFAOYSA-N 2-[[6-[bis(carboxymethyl)amino]-1,4-dioxocan-6-yl]-(carboxymethyl)amino]acetic acid Chemical compound OC(=O)CN(CC(O)=O)C1(N(CC(O)=O)CC(O)=O)CCOCCOC1 HZZOUWBMMWVPTR-UHFFFAOYSA-N 0.000 description 2
- 229910002012 Aerosil® Inorganic materials 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000004677 Nylon Substances 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000007602 hot air drying Methods 0.000 description 2
- 230000001771 impaired effect Effects 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 229920001778 nylon Polymers 0.000 description 2
- 229920000620 organic polymer Polymers 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229920006122 polyamide resin Polymers 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 239000012798 spherical particle Substances 0.000 description 2
- 229910052623 talc Inorganic materials 0.000 description 2
- 229920005992 thermoplastic resin Polymers 0.000 description 2
- 239000004709 Chlorinated polyethylene Substances 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 239000004831 Hot glue Substances 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000004823 Reactive adhesive Substances 0.000 description 1
- 229920000800 acrylic rubber Polymers 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 229920001400 block copolymer Polymers 0.000 description 1
- DQXBYHZEEUGOBF-UHFFFAOYSA-N but-3-enoic acid;ethene Chemical compound C=C.OC(=O)CC=C DQXBYHZEEUGOBF-UHFFFAOYSA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000006482 condensation reaction Methods 0.000 description 1
- 238000012790 confirmation Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000005038 ethylene vinyl acetate Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 229920001973 fluoroelastomer Polymers 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 239000012943 hotmelt Substances 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 150000003951 lactams Chemical class 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 239000012766 organic filler Substances 0.000 description 1
- 125000000962 organic group Chemical group 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- WVDDGKGOMKODPV-ZQBYOMGUSA-N phenyl(114C)methanol Chemical compound O[14CH2]C1=CC=CC=C1 WVDDGKGOMKODPV-ZQBYOMGUSA-N 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920001084 poly(chloroprene) Polymers 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 238000006068 polycondensation reaction Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000003505 polymerization initiator Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000010526 radical polymerization reaction Methods 0.000 description 1
- 238000000518 rheometry Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 229920001935 styrene-ethylene-butadiene-styrene Polymers 0.000 description 1
- 230000002194 synthesizing effect Effects 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229920002725 thermoplastic elastomer Polymers 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/16—Solid spheres
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J177/00—Adhesives based on polyamides obtained by reactions forming a carboxylic amide link in the main chain; Adhesives based on derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J177/00—Adhesives based on polyamides obtained by reactions forming a carboxylic amide link in the main chain; Adhesives based on derivatives of such polymers
- C09J177/12—Polyester-amides
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/001—Conductive additives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00013—Fully indexed content
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0221—Insulating particles having an electrically conductive coating
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Health & Medical Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Conductive Materials (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Combinations Of Printed Boards (AREA)
Description
(A)成分:ポリアミドエラストマー
(B)成分:球状の導電性粉体
(C)成分:溶剤
異方導電性接着剤を調製するために下記成分を準備した。また、(A)成分および(A’)成分のTG/DTAによる融点の測定結果を表1にまとめた。
・ポリアミドエラストマー(固形分100%)(TPAE−32 富士化成工業株式会社製)
・ポリアミドエラストマー(固形分100%)(TPAE−31 富士化成工業株式会社製)
・ポリアミドエラストマー(固形分100%)(PA−201 富士化成工業株式会社製)
・ポリアミドエラストマー(固形分100%)(PA−200 富士化成工業株式会社製)
(B)成分:球状の導電性粉体
・平均粒径30μmの球状メッキ粉(ブライト6GNR30−BHB 日本化学工業株式会社製)
(C)成分:溶剤
・工業用トルエン(トルエン 日本アルコール販売株式会社製)
・工業用メタノール(メタノール 三菱ガス化学株式会社製)
その他の成分:充填剤
・タルク粉(ミクロエースP−2 日本タルク株式会社製)
・アモルファスシリカ(アエロジルR972 日本アエロジル株式会社製)
異方導電性接着剤を調製するために下記成分を準備した。(A’)成分以外の成分は実施例と同様の原料を使用した。
・ポリウレタンエラストマー(固形分100%)(パンテックスT−5202 大日本インキ工業株式会社製)
・ポリウレタンエラストマー(固形分100%)(パンテックスT−5210 大日本インキ工業株式会社製)
・ポリウレタンエラストマー(固形分100%)(ミラクトランP22SRNAT )
・ポリエステルエラストマー(固形分60%)(ニチゴーポリエスターTP−290 日本合成化学工業株式会社製)
・ポリエステルエラストマー(固形分60%)(ニチゴーポリエスターTP−293 日本合成化学工業株式会社製)
・SEBSゴムエラストマー(固形分100%)(クレイトンFG1901X クレイトンポリマージャパン株式会社製)
(C)成分:溶剤
・工業用イソホロン(イソホロン ゴードー溶剤株式会社製)
表1におけるTG/DTAによる融点の測定条件は次の通り。アルミニウムカップに1mg〜10mgのサンプルを入れ、窒素雰囲気下で昇温速度10℃/minにて、−40℃〜150℃の温度範囲で測定を行い、示差熱量(DTA)が減少する温度もしくは微分示差熱量(DDTA)値が急激に減少する変化点の温度を「融点(℃)」とする。融点が確認できない場合、例えばDTA、DDTAが徐々に変動するため明確な変化点がわからない時は、「無し」と表記する。
装置メーカー:Seiko Instruments Inc.
装置:EXSTAR6000 TG/DTA6200
アルミニウムカップ:Open Sample Pan φ5
異方導電性接着剤をFPCに対して以下の条件でスクリーン印刷を行う。
メッシュ規格:SUSメッシュ#80
印刷速度:40mm/sec
印圧:0.2MPa
異方導電性接着剤を印刷したPETフィルムまたはFPCを熱風乾燥炉に入れて、120℃×10分で乾燥させて(C)成分を揮発させて、PETフィルムまたはFPCの表面に均一な組成物の塗膜を形成させる。塗膜を形成したPETフィルムまたはFPCと基板の位置を調整した後、剥離強度試験、クリープ試験、導通性試験で作成するテストピースは、以下の条件で加熱圧着することで接着を行う。テストピース作成に際しては適宜最適な条件設定で行う。
ヘッド接触面積:3mm×60mm
加熱条件:110〜160℃
加圧条件:3〜5MPa
加熱圧着時間:10〜30sec
PETフィルム上に印刷、乾燥し、ITOガラスへ図1の様に加熱圧着してテストピースを作成する。接着部の寸法は3mm×10mmとする。30分放置後、は強度強度試験を行う。ITOガラスに対して90度の角度でPETフィルムを試験速度50mm/minで引張りはく離強度を測定する。4個のテストピースを測定する。最大強度(N)の平均値と幅(10mm)から計算して「剥離強度(N/m)」とする。PETフィルムとITOガラスの仕様は以下の通り。
PETフィルム:幅10mm、厚さ38μm
ITOガラス:蒸着膜付きガラスを指す。60mm×25mm×1.1mm
面積抵抗10Ω/□ (以下、ITOガラスは同様の仕様)
「剥離強度(N/m)」の評価は以下の通り行い、表2にまとめた。
○:800N/m以上
△:400〜800N/m
×:400N/m未満
剥離強度試験と同様のPETフィルムおよびITOガラスを用いて図2の様に加熱圧着してテストピースを作成した。30分放置後、余分な接着部は引き剥がして3mm×50mmとして、図2の5:加重方向に3gf/mm(幅)の割合で加重をかけてテストピースを85℃雰囲気に放置する。5個のテストピースを同時に放置する。すべてのテストピースが加重で剥離するまで測定を行い、以下の判断基準から「クリープ特性」を評価して、表2にまとめた。
○:24時間以上ですべて剥離
△:12〜24時間ですべて剥離
×:12時間ですべて剥離
以下のFPCと剥離強度試験およびクリープ試験と同仕様のITOガラスを用いて導通性確認を行った。図3の様に、導電性塗料の端部からFPCの圧着部までは7mmの距離を保って加熱圧着する。30分放置後、テストピースをヒートサイクル試験器に投入し、−40℃×30分+85℃×30分を1サイクルとして100時間連続してヒートサイクルを繰り返す。試験終了後、取り出して30分放置後に、テスターの電極を図3の8:銀ペーストの塗膜と9:FPCの電極に当てて抵抗値を測定する。50本の配線の平均抵抗値を「導通性(Ω)」とする。
FPCの材質:ポリイミド
FPCの厚さ:25μm
配線:厚さ35μmの銅に金メッキ処理
配線のピッチ:0.4mm(L/S=0.2mm/0.2mm)
配線の本数:50本
銀ペースト:ThreeBond3350C(室温乾燥タイプ)
以下の判断基準から「導通性(Ω)」を評価して、表2にまとめた。
○:平均値が15Ω未満
△:平均値が15〜20Ω
×:平均値が20Ω以上
以下の点数に従い剥離強度試験、クリープ試験、導通性試験の結果を合計して「総合評価」とする。
○:2点
△:1点
×:0点
2:ITOガラス
3:接着部
4:剥離方向
5:加重方向
6:FPC
7:ITOガラスの導通面
8:銀ペーストの塗膜
9:FPCの電極
Claims (6)
- (A)〜(C)成分を含み、エラストマーは(A)成分のみ含む非反応型異方導電性接着剤。
(A)成分:融点が90℃〜140℃のポリアミドエラストマー
(B)成分:球状の導電性粉体
(C)成分:溶剤 - (A)成分が、不飽和脂肪酸の重合反応により合成された1分子に2以上のカルボキシル基を有する化合物を原料として合成されたポリアミドエラストマーからなる請求項1に記載の非反応型異方導電性接着剤。
- (B)成分が有機粒子をコアとするメッキ粉である請求項1または2のいずれかに記載の非反応型異方導電性接着剤。
- さらに、タルク粉を含む請求項1〜3のいずれかに記載の非反応型異方導電性接着剤
- フレキシブルプリントサーキットに請求項1〜4のいずれかに記載の非反応型異方導電性接着剤をスクリーン印刷または塗布した後、(C)成分を揮発させるフレキシブルプリントサーキット部材の製造方法。
- 請求項1〜4のいずれかに記載の非反応型異方導電性接着剤をスクリーン印刷または塗布した後、(C)成分を揮発させることで形成された塗膜の製造方法。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009291073A JP5825503B2 (ja) | 2009-12-22 | 2009-12-22 | 異方導電性接着剤 |
TW099140394A TWI493013B (zh) | 2009-12-22 | 2010-11-23 | 異向導電性黏著劑 |
KR1020127018873A KR101727774B1 (ko) | 2009-12-22 | 2010-12-06 | 이방 도전성 접착제 |
PCT/JP2010/072307 WO2011077979A1 (ja) | 2009-12-22 | 2010-12-06 | 異方導電性接着剤 |
CN201080056864.5A CN102656244B (zh) | 2009-12-22 | 2010-12-06 | 各向异性导电性粘接剂 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009291073A JP5825503B2 (ja) | 2009-12-22 | 2009-12-22 | 異方導電性接着剤 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2011132304A JP2011132304A (ja) | 2011-07-07 |
JP2011132304A5 JP2011132304A5 (ja) | 2011-09-22 |
JP5825503B2 true JP5825503B2 (ja) | 2015-12-02 |
Family
ID=44195510
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009291073A Active JP5825503B2 (ja) | 2009-12-22 | 2009-12-22 | 異方導電性接着剤 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP5825503B2 (ja) |
KR (1) | KR101727774B1 (ja) |
CN (1) | CN102656244B (ja) |
TW (1) | TWI493013B (ja) |
WO (1) | WO2011077979A1 (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5838674B2 (ja) * | 2011-09-12 | 2016-01-06 | 住友電気工業株式会社 | フィルム状異方導電性接着剤 |
JP5964187B2 (ja) | 2012-09-18 | 2016-08-03 | デクセリアルズ株式会社 | 異方性導電フィルム、接続方法、及び接合体 |
JP6164416B2 (ja) * | 2013-09-25 | 2017-07-19 | 株式会社スリーボンド | 導電性接着剤組成物 |
JP2017111978A (ja) * | 2015-12-16 | 2017-06-22 | デクセリアルズ株式会社 | 異方性導電フィルム、接続方法、及び接合体 |
CN106905889A (zh) * | 2017-03-08 | 2017-06-30 | 上海腾烁电子材料有限公司 | 一种改性橡胶热硫化反应结合热塑性各向异性导电粘结剂 |
JP6969165B2 (ja) * | 2017-06-02 | 2021-11-24 | 昭和電工マテリアルズ株式会社 | 異方導電性接着剤組成物、異方導電性フィルム、及び接続構造体 |
JP2020077645A (ja) * | 2020-01-29 | 2020-05-21 | デクセリアルズ株式会社 | 異方性導電フィルム、接続方法、及び接合体 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6132085A (ja) * | 1984-07-24 | 1986-02-14 | 富士通株式会社 | 表示素子の実装方法 |
JP4236856B2 (ja) * | 2002-03-20 | 2009-03-11 | 信越ポリマー株式会社 | 異方導電性接着剤及びヒートシールコネクター |
JP2007062126A (ja) * | 2005-08-31 | 2007-03-15 | Dainippon Printing Co Ltd | インクジェットヘッド及びその製造方法 |
JP2008165034A (ja) * | 2006-12-28 | 2008-07-17 | Sony Corp | 集積モジュール、表示装置、および電子機器 |
JP5286679B2 (ja) * | 2007-03-15 | 2013-09-11 | 東レ株式会社 | 電子部品用接着剤組成物およびそれを用いた電子部品用接着シート |
JP5226562B2 (ja) * | 2008-03-27 | 2013-07-03 | デクセリアルズ株式会社 | 異方性導電フィルム、並びに、接合体及びその製造方法 |
JP4580021B2 (ja) * | 2009-01-26 | 2010-11-10 | タツタ電線株式会社 | 接着剤組成物 |
-
2009
- 2009-12-22 JP JP2009291073A patent/JP5825503B2/ja active Active
-
2010
- 2010-11-23 TW TW099140394A patent/TWI493013B/zh active
- 2010-12-06 KR KR1020127018873A patent/KR101727774B1/ko active IP Right Grant
- 2010-12-06 CN CN201080056864.5A patent/CN102656244B/zh active Active
- 2010-12-06 WO PCT/JP2010/072307 patent/WO2011077979A1/ja active Application Filing
Also Published As
Publication number | Publication date |
---|---|
CN102656244A (zh) | 2012-09-05 |
KR20120117832A (ko) | 2012-10-24 |
CN102656244B (zh) | 2014-06-04 |
WO2011077979A1 (ja) | 2011-06-30 |
TWI493013B (zh) | 2015-07-21 |
JP2011132304A (ja) | 2011-07-07 |
KR101727774B1 (ko) | 2017-04-17 |
TW201134916A (en) | 2011-10-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5825503B2 (ja) | 異方導電性接着剤 | |
CN101689409B (zh) | 各向异性导电材料、连接结构体及其制造方法 | |
TWI415917B (zh) | 低溫結合電子黏接劑 | |
KR101355855B1 (ko) | 이방성 도전 필름 | |
TWI588235B (zh) | 各向異性導電薄膜、其連接方法及其接合體 | |
TW200815555A (en) | Anisotropic conductive adhesive compositions | |
JP2005347273A (ja) | 熱架橋型回路接続材料及びそれを用いた回路板の製造方法 | |
JP5002074B2 (ja) | 導電性接着剤組成物及び導電性接着フィルム | |
KR101464353B1 (ko) | 이방 도전성 필름용 조성물, 이방 도전성 필름, 및 이를 이용한 반도체 장치 | |
CN103320076A (zh) | 一种异方导电热熔胶粘剂 | |
JP2010168510A (ja) | 接着剤組成物 | |
CN108702845A (zh) | 连接结构体的制造方法 | |
US20100252783A1 (en) | Ambient-curable anisotropic conductive adhesive | |
JPS61276873A (ja) | 導電異方性接着剤 | |
JP5675975B2 (ja) | 接着剤組成物及び接着フィルム | |
JPH04323290A (ja) | 異方導電性接着剤組成物 | |
CN1836295B (zh) | 绝缘被覆导电粒子、其制备方法及各向异性导电粘合剂 | |
CN104778990A (zh) | 导电性糊剂以及带有导电膜的基材 | |
TWI784126B (zh) | 導電性接著劑組成物 | |
TW201807054A (zh) | 含導電性粒子之樹脂組成物及含該樹脂組成物之電子裝置 | |
JP2007317657A (ja) | 熱架橋型回路接続材料及びそれを用いた回路板の製造方法 | |
JP6301366B2 (ja) | 電子部品接着材料及び電子部品の接着方法 | |
Kiilunen et al. | Hygrothermal aging of an ACA attached PET flex-on-board assembly | |
JP6164416B2 (ja) | 導電性接着剤組成物 | |
JP2005294086A (ja) | フィルム状接着剤 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20110804 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20121016 |
|
A711 | Notification of change in applicant |
Free format text: JAPANESE INTERMEDIATE CODE: A712 Effective date: 20140129 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20140225 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20140409 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20140507 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20141126 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20141211 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20150701 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20150703 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20150820 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20150827 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20150917 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20150930 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5825503 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313111 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |