KR101727774B1 - 이방 도전성 접착제 - Google Patents

이방 도전성 접착제 Download PDF

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Publication number
KR101727774B1
KR101727774B1 KR1020127018873A KR20127018873A KR101727774B1 KR 101727774 B1 KR101727774 B1 KR 101727774B1 KR 1020127018873 A KR1020127018873 A KR 1020127018873A KR 20127018873 A KR20127018873 A KR 20127018873A KR 101727774 B1 KR101727774 B1 KR 101727774B1
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South Korea
Prior art keywords
component
anisotropic conductive
conductive adhesive
mass
test
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KR1020127018873A
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English (en)
Korean (ko)
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KR20120117832A (ko
Inventor
마사유키 오사다
도시후미 구보야마
마코토 가토
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쓰리본드 화인 케미칼 가부시키가이샤
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Publication of KR20120117832A publication Critical patent/KR20120117832A/ko
Application granted granted Critical
Publication of KR101727774B1 publication Critical patent/KR101727774B1/ko
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/16—Solid spheres
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J177/00—Adhesives based on polyamides obtained by reactions forming a carboxylic amide link in the main chain; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J177/00—Adhesives based on polyamides obtained by reactions forming a carboxylic amide link in the main chain; Adhesives based on derivatives of such polymers
    • C09J177/12—Polyester-amides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00013—Fully indexed content
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0221—Insulating particles having an electrically conductive coating

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)
KR1020127018873A 2009-12-22 2010-12-06 이방 도전성 접착제 Active KR101727774B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2009-291073 2009-12-22
JP2009291073A JP5825503B2 (ja) 2009-12-22 2009-12-22 異方導電性接着剤
PCT/JP2010/072307 WO2011077979A1 (ja) 2009-12-22 2010-12-06 異方導電性接着剤

Publications (2)

Publication Number Publication Date
KR20120117832A KR20120117832A (ko) 2012-10-24
KR101727774B1 true KR101727774B1 (ko) 2017-04-17

Family

ID=44195510

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020127018873A Active KR101727774B1 (ko) 2009-12-22 2010-12-06 이방 도전성 접착제

Country Status (5)

Country Link
JP (1) JP5825503B2 (enExample)
KR (1) KR101727774B1 (enExample)
CN (1) CN102656244B (enExample)
TW (1) TWI493013B (enExample)
WO (1) WO2011077979A1 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5838674B2 (ja) * 2011-09-12 2016-01-06 住友電気工業株式会社 フィルム状異方導電性接着剤
JP5964187B2 (ja) 2012-09-18 2016-08-03 デクセリアルズ株式会社 異方性導電フィルム、接続方法、及び接合体
JP6164416B2 (ja) * 2013-09-25 2017-07-19 株式会社スリーボンド 導電性接着剤組成物
JP2017111978A (ja) * 2015-12-16 2017-06-22 デクセリアルズ株式会社 異方性導電フィルム、接続方法、及び接合体
CN106905889A (zh) * 2017-03-08 2017-06-30 上海腾烁电子材料有限公司 一种改性橡胶热硫化反应结合热塑性各向异性导电粘结剂
JP6969165B2 (ja) * 2017-06-02 2021-11-24 昭和電工マテリアルズ株式会社 異方導電性接着剤組成物、異方導電性フィルム、及び接続構造体
JP2020077645A (ja) * 2020-01-29 2020-05-21 デクセリアルズ株式会社 異方性導電フィルム、接続方法、及び接合体

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008222941A (ja) * 2007-03-15 2008-09-25 Toray Ind Inc 電子部品用接着剤組成物およびそれを用いた電子部品用接着シート

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6132085A (ja) * 1984-07-24 1986-02-14 富士通株式会社 表示素子の実装方法
JP4236856B2 (ja) * 2002-03-20 2009-03-11 信越ポリマー株式会社 異方導電性接着剤及びヒートシールコネクター
JP2007062126A (ja) * 2005-08-31 2007-03-15 Dainippon Printing Co Ltd インクジェットヘッド及びその製造方法
JP2008165034A (ja) * 2006-12-28 2008-07-17 Sony Corp 集積モジュール、表示装置、および電子機器
JP5226562B2 (ja) * 2008-03-27 2013-07-03 デクセリアルズ株式会社 異方性導電フィルム、並びに、接合体及びその製造方法
JP4580021B2 (ja) * 2009-01-26 2010-11-10 タツタ電線株式会社 接着剤組成物

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008222941A (ja) * 2007-03-15 2008-09-25 Toray Ind Inc 電子部品用接着剤組成物およびそれを用いた電子部品用接着シート

Also Published As

Publication number Publication date
TW201134916A (en) 2011-10-16
WO2011077979A1 (ja) 2011-06-30
KR20120117832A (ko) 2012-10-24
CN102656244A (zh) 2012-09-05
JP2011132304A (ja) 2011-07-07
CN102656244B (zh) 2014-06-04
TWI493013B (zh) 2015-07-21
JP5825503B2 (ja) 2015-12-02

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