CN103666297B - 各向异性导电膜和包括它的半导体装置 - Google Patents

各向异性导电膜和包括它的半导体装置 Download PDF

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Publication number
CN103666297B
CN103666297B CN201310432226.4A CN201310432226A CN103666297B CN 103666297 B CN103666297 B CN 103666297B CN 201310432226 A CN201310432226 A CN 201310432226A CN 103666297 B CN103666297 B CN 103666297B
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conductive film
anisotropic conductive
epoxy resin
ring
film according
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CN103666297A (zh
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朴永祐
徐准模
崔贤民
金智软
朴憬修
柳·阿伦
殷钟赫
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Guo Dujianduansucai
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Cheil Industries Inc
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    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
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Abstract

这里公开了通过确保优异的耐热性和耐湿性，从而即使在高温和高湿条件下仍呈现优异的连接可靠性的各向异性导电膜，以及包括所述各向异性导电膜的半导体装置。所述各向异性导电膜以特定的含量比包括含萘环的环氧树脂和含二环戊二烯环的环氧树脂，所述含萘环的环氧树脂和含二环戊二烯环的环氧树脂呈现高耐热性和/或高耐湿性，并在固化时具有不同的熔融粘度，从而在主要压制时，通过确保微电极之间的膜的均匀填充，而提供优异的连接可靠性。

Description

各向异性导电膜和包括它的半导体装置
技术领域
本发明涉及各向异性导电膜和包括它的半导体装置。
背景技术
通常，各向异性导电膜（ACF）是指膜状粘合剂，其中导电颗粒，例如包括镍颗粒或金颗粒的金属颗粒、或涂有金属的聚合物树脂颗粒分散在如环氧树脂的树脂中。各向异性导电膜表示具有电各向异性和粘合性的聚合物层，所述聚合物层在膜的厚度方向呈现导电性质且在其表面方向呈现绝缘性质的。
当置于将被连接的电路板之间的各向异性导电膜在特定条件下经受加热和加压时，电路端子通过导电颗粒电连接，并且绝缘粘合剂树脂填充相邻电路端子间的空间以使导电颗粒彼此绝缘，从而提供电路端子间的高绝缘性能。
各向异性导电膜中，用于玻璃上芯片(COG)的各向异性导电膜是指用于在液晶显示器等的面板上安装驱动IC的连接材料。
近来的技术发展显示向更轻、更短和更小的驱动IC和面板的趋势，并且由于随着驱动IC和面板的厚度变得更薄，在各向异性导电膜热固化时玻璃的弯曲可变得更严重，因此存在连接可靠性劣化的问题。
因此，由于用于COG的各向异性导电膜需要在均匀的压力下连接驱动IC和玻璃电极，并需要即使在高温和高湿条件下仍保持长时间的连接可靠性，已经积极地进行了改善各向异性导电膜的耐热性和耐湿性的研究。
现有技术中，为了改善各向异性导电膜的耐热性，韩国专利注册号10-1138799公开了使用含芳香环的环氧树脂的各向异性导电膜，所述环氧树脂固化时具有高的粘度，并且固化后具有高Tg。
用作各向异性导电膜的材料的含芳香环的环氧树脂提供了优异的耐热性，并在驱动IC的电极的左侧、中间和右侧部分提供了优异的压力均匀性。然而，由于在各向异性导电膜固化时，膜组合物没有充分填充微电极之间的空间，存在连接可靠性劣化的问题。
因此，存在通过确保优异的耐热性和微电极之间膜的充分填充，使各向异性导电膜即使在高温和高湿条件下仍呈现优异的连接可靠性的需要。
发明内容
本发明的一个目的为提供通过确保关于耐热性和耐湿性的优异的性质，即使在高温和高湿条件下仍呈现优异的连接可靠性的各向异性导电膜。
更具体地，本发明旨在提供包括至少两种类型的环氧树脂的各向异性导电膜，所述环氧树脂呈现优异的耐热性和/或耐湿性，并在固化时具有不同的熔融粘度，从而通过确保主要压制时微电极之间膜的均匀填充而呈现出优异的连接可靠性。
本发明的实施方式提供了各向异性导电膜，所述各向异性导电膜包括至少两种类型的环氧树脂，所述环氧树脂在固化时具有不同的熔融粘度，并呈现高耐热性和高耐湿性。
更具体地，所述各向异性导电膜包括固化时具有高粘度的含萘环的环氧树脂和固化时具有低粘度的含二环戊二烯环的环氧树脂。
根据本发明的一个实施方式，提供了各向异性导电膜，所述各向异性导电膜包括：a)聚合物粘结剂树脂；b)环氧树脂；c)导电颗粒；和d)固化剂，其中，所述b)环氧树脂包括含萘环的环氧树脂和含二环戊二烯环的环氧树脂，并且，其中，基于100重量份的所述含二环戊二烯环的环氧树脂，所述含萘环的环氧树脂的含量为100重量份至500重量份。
根据本发明的另一个实施方式，提供了各向异性导电膜，所述各向异性导电膜包括含萘环的环氧树脂和含二环戊二烯环的环氧树脂，并具有：a)在150℃下的0.2Pa·s至0.5Pa·s的熔融粘度；和b)0.8%或更小的吸湿率。
根据本发明的实施方式，所述各向异性导电膜包括在固化时具有不同熔融粘度的含萘环的环氧树脂和含二环戊二烯环的环氧树脂，并因此呈现关于耐热性和耐湿性的优异的性质。
更具体地，根据本发明的实施方式，所述各向异性导电膜包括含二环戊二烯环的环氧树脂，所述含二环戊二烯环的环氧树脂在固化后具有高Tg，并且固化时具有低熔融粘度，并呈现高耐热性和高耐湿性，以允许适当调节膜组合物的熔融粘度，因此所述膜在压制时可充分并均匀地填充微电极之间的空间。
由此，所述各向异性导电膜可充分地填充微电极之间的空间，从而甚至在高温和高湿条件下呈现优异的连接可靠性。
附图说明
图1为根据本发明的一个实施方式的半导体装置的截面图，所述半导体装置包括通过各向异性导电膜10彼此连接并分别包含第一电极70和第二电极80的第一连接元件50和第二连接元件60。这里，当在具有第一电极70的第一连接元件50与具有第二电极80的第二连接元件60之间放置并压缩各向异性导电膜10时，第一电极70和第二电极80通过导电颗粒40彼此电连接。
具体实施方式
下文，将详细说明本发明。为了清楚，将省略本领域普通技术人员显而易见的细节的说明。
根据实施方式，本发明涉及即使在高温和高湿条件下，仍呈现优异的连接可靠性，并具有高耐热性和高耐湿性的各向异性导电膜。
更具体地，根据实施方式的本发明提供了以特定含量比包括具有高熔融粘度的含萘环的环氧树脂和具有低熔融粘度的含二环戊二烯环的环氧树脂的各向异性导电膜，以允许主要压制时各向异性导电膜充分且均匀地填充微电极之间的空间，从而通过允许适当调节膜组合物的粘度而提供改善的连接可靠性。
本创造性概念的一个实施方式提供了各向异性导电膜，包括：a)聚合物粘结剂树脂；b)环氧树脂；c)导电颗粒；和d)固化剂，其中b)环氧树脂包括包含萘环的环氧树脂和含二环戊二烯环的环氧树脂，并且，其中，基于100重量份的所述含二环戊二烯环的环氧树脂，所述含萘环的环氧树脂的含量为100重量份至500重量份。
同样，所述各向异性导电膜包括各向异性导电粘合剂层和附着到所述各向异性导电粘合剂层的背面的基膜。
下文，将详细说明根据实施方式的各向异性导电膜或各向异性导电粘合剂层。
a)聚合物粘结剂树脂
根据本发明，可使用本领域中已知的任何聚合物粘结剂树脂，无需限制。
所述聚合物粘结剂树脂的实例包括聚酰亚胺树脂、聚酰胺树脂、苯氧基树脂、环氧树脂、聚甲基丙烯酸酯树脂、聚丙烯酸酯树脂、聚氨酯树脂、聚酯树脂、聚酯氨基甲酸酯树脂、聚乙烯基丁缩醛树脂、苯乙烯-丁烯-苯乙烯(SBS)树脂和它的环氧树脂改性物、苯乙烯-乙烯-丁烯-苯乙烯(SEBS)树脂和它的环氧树脂改性物、丙烯腈丁二烯橡胶(NBR)或它的氢化的化合物，不限于此。上述聚合物粘合剂树脂可单独或以它们的组合使用。
基于所述各向异性导电粘合剂层组合物的固含量的总量，所述聚合物粘结剂树脂含量为5重量%(wt%)至35wt%，优选10wt%至30wt%。在该范围内，所述各向异性导电膜可呈现优异的附着力和膜成形性。
b)环氧树脂
根据本发明，所述环氧树脂包括含萘环的环氧树脂和含二环戊二烯环的环氧树脂。此外，所述环氧树脂可进一步包括其它环氧树脂而无需限制，只要所述其它环氧树脂具有与含萘环的环氧树脂和含二环戊二烯环的环氧树脂的相容性，例如，其它类型的多环含芳香环的环氧树脂等。
为了给予膜以高耐热性，所述含萘环的环氧树脂在固化后可具有160℃至250℃的玻璃化转变温度，并且固化时在150℃下具有约10Pa·s至约100Pa·s的熔融粘度。
所述含二环戊二烯环的环氧树脂呈现优异的耐热性和耐湿性，并在固化后具有高玻璃转化温度。为了实现对各向异性导电膜组合物的熔融粘度的适当的调节，所述含二环戊二烯环的环氧树脂在150℃下可具有约0.1Pa·s至约1Pa·s的熔融粘度。
根据实施方式，本发明提供了各向异性导电膜，所述各向异性导电膜的熔融粘度通过以特定的含量比来包括含萘环的环氧树脂和含二环戊二烯环的环氧树脂而被适当地调节。
根据创造性概念，基于所述各向异性导电粘合剂层组合物的固含量的总量，所述环氧树脂的含量为5wt%至40wt%，更优选10wt%至40wt%。
基于100重量份的含二环戊二烯环的环氧树脂，含萘环的环氧树脂的含量为100重量份至500重量份，优选100重量份至400重量份，更优选140重量份至300重量份。
在该范围内，各向异性导电膜在主要压制时具有合适的熔融粘度，并充分地填充微电极之间的空间，从而改善连接可靠性。
c)导电颗粒
导电颗粒可包括本领域中常用的任何导电颗粒，没有具体的限制。
导电颗粒的实例可包括金属颗粒，所述金属颗粒包括金(Au)、银(Ag)、镍(Ni)、铜(Cu)和焊料颗粒；碳颗粒；树脂颗粒，例如聚乙烯、聚丙烯、聚酯、聚苯乙烯、聚乙烯醇和它们涂有例如金(Au)、银(Ag)、镍(Ni)等金属的改性树脂颗粒；且所述导电颗粒进一步涂有绝缘颗粒。
导电颗粒的尺寸可根据要使用的电路间距以及目的被确定在2至30μm的范围内。
基于所述各向异性导电粘合剂层组合物的固含量的总量，导电颗粒的含量为5wt%至30wt%，优选10wt%至20wt%。在该范围内，各向异性导电膜可防止连接和/或绝缘缺陷，并确保优异的连接。
d)固化剂
根据创造性概念，固化剂可使用任何固化剂而无需限制，只要所述固化剂可固化环氧树脂并形成各向异性导电膜。
固化剂可为潜伏性固化剂，但不限于此。固化剂的实例包括咪唑、异氰酸酯、胺、酰胺、酚醛、酸酐固化剂等。所述固化剂可单独或以它们的组合使用。
基于所述各向异性导电粘合剂层组合物的固含量的总量，固化剂的含量为5wt%至50wt%，优选20wt%至40wt%。在该范围内，固化剂可确保各向异性导电膜的充分固化，并通过确保优异的相容性而促进形成所述各向异性导电膜。
除了a)、b)、c)和d)，各向异性导电膜可进一步包括无机颗粒。所述无机颗粒用于改善各向异性导电膜的附着力和绝缘性质。
根据创造性概念，所述无机颗粒可使用二氧化硅纳米颗粒，但不限于此。
当在形成各向异性导电膜时一起使用含萘环的环氧树脂和含二环戊二烯环的环氧树脂时，防止了压制时厚度方向的压力不平衡，从而允许膜在微电极之间更充分的填充。
二氧化硅纳米颗粒可具有1nm至50nm的粒径。此外，基于所述各向异性导电粘合剂层组合物的固含量的总量，二氧化硅纳米颗粒的含量为0.1wt%至20wt%，优选1wt%至10wt%。在该范围内，可使被施加到电极的压力均匀分布，并且各向异性导电膜可呈现改善的附着力和连接可靠性。
为了给予各向异性导电膜另外的性质，而不劣化它的基本性质，各向异性导电膜可进一步包括添加剂，例如聚合引发剂、抗氧化剂、热稳定剂、固化促进剂、偶联剂等。每种添加剂加入的量可根据膜的用途、期望的效果等而改变，并且为本领域普通技术人员已知，没有限制。
在一些实施方式中，各向异性导电膜在150℃下可具有0.2Pa·s至0.5Pa·s范围的熔融粘度。
根据本发明，各向异性导电膜包括在150℃下具有高粘度的含萘环的环氧树脂和在150℃下具有低粘度的包含二环戊二烯环的环氧树脂，以在上述范围内具有合适的熔融粘度。各向异性导电膜组合物在主要压制时具有合适的熔融粘度，并且充分填充微电极之间的空间。
可通过使用本领域中通常使用的任何方法，例如通过先进流变扩展系统(ARES)，测量各向异性导电膜或膜组合物的熔融粘度。例如，流变仪(ARESG2,TAInstruments)可用作粘度计。
在一些实施方式中，各向异性导电膜具有0.8%或更小、优选0.75%或更小、更优选0.7%或更小的吸湿率。在该范围内，各向异性导电膜可在高温和高湿条件下长时间使用，同时保持优异的连接可靠性。
当于85℃和85%RH的条件下放置24小时后，通过测量各向异性导电膜的重量变化，测量各向异性导电膜的吸湿率。
本发明的另一个实施方式提供了通过各向异性导电膜连接的半导体装置，所述各向异性导电膜在85℃和85%RH放置500小时的条件下，具有10Ω或更小的连接电阻。
通过在50MPa至80MPa于190℃至210℃主要压制各向异性导电膜5秒至10秒而进行固化。
可使用本领域中常用的任何方法测量连接电阻而无需限制。
具有10Ω或更小的连接电阻的各向异性导电膜即使在高温和高湿条件下仍可长时间使用。
本发明的另一个实施方式提供了各向异性导电膜，所述各向异性导电膜在固化后在85℃和85%RH的条件下放置500小时的条件下，在电极间的空白区域（spacearea）中具有20%或更小的电极间的气泡面积。
通过在50MPa至80MPa于190℃至210℃主要压制各向异性导电膜5秒至10秒而进行固化。
电极之间的空间是微电极和电极之间的空间，并且表示压制时用各向异性导电膜组合物填充的空间。
可使用本领域中常用的任何方法测量气泡面积，而无需限制。例如，可通过使用显微镜观察或拍照被所述膜组合物填充的电极之间的空间，并用图像分析仪或网格图计算气泡面积，来测量气泡面积。
当各向异性导电膜具有20%或更小的气泡面积时，使用它连接的半导体装置即使在高温和高湿条件下仍可长时间使用，同时保持连接可靠性。
“20%或更小的气泡面积”的表述不表示气泡面积为0和负值，并且气泡面积的下限可理解为接近于0的正值。
根据本发明，可使用本领域中已知的任何方法形成各向异性导电膜，而无需限制。
不需要特殊的设备或装置形成各向异性导电膜。例如，可通过将粘结剂树脂溶解于有机溶剂中，将其它组分加入溶解于所述溶剂的粘结剂树脂中，以预定的时间段搅拌所述组分，在离型膜上涂布所述组合物至合适的厚度，例如10μm至50μm，并以预定的时间段干燥所述混合物以挥发有机溶剂，从而获得各向异性导电膜。
根据本发明的另一个实施方式，半导体装置包括：具有第一电极的第一连接元件；具有第二电极的第二连接元件；和布置在第一连接元件和第二连接元件之间并使所述第一电极和所述第二电极彼此电连接的根据本发明的各向异性导电膜。
参照图1，根据实施方式的半导体装置包括具有第一电极70的第一连接元件50；具有第二电极80的第二连接元件60；和包括导电颗粒的各向异性导电膜10。当压制放置在具有第一电极70的第一连接元件50和具有第二电极80的第二连接元件60之间的各向异性导电膜10时，第一电极70和第二电极80通过导电颗粒40彼此连接。在一个实施方式中，所述第一连接元件和所述第二连接元件在材料、厚度、大小和物理互连性方面具有相似的结构。所述第一连接元件和所述第二连接元件具有约20μm至约100μm的厚度。
在另一个实施方式中，所述第一连接元件和所述第二连接元件在材料、厚度、大小和物理互连性方面可具有不同的结构和功能。所述第一连接元件或所述第二连接元件可由玻璃、PCB（印刷电路板）、fPCB、COF、TCP、ITO玻璃等形成，不限于此。所述第一电极或所述第二电极可为突出电极或平面电极。当所述第一电极和所述第二电极元件为突出电极时，这些电极可具有约2.50μm至约10μm的高度(H)、约50μm至约120μm的宽度(W)，和约50μm至约110μm的电极间的间隙(G)。优选地，所述电极具有2.50μm至约9μm的高度(H)、约50μm至约100μm的宽度(W)，和约60μm至约100μm的间隙(G)。
当所述第一电极和第二电极为平面电极时，这些电极可具有约至约的厚度。
所述第一电极或第二电极可由ITO、铜、硅、IZO等形成，不限于此。
所述平面电极可具有至的厚度，并且所述突出电极可具有6μm至10μm的高度。这里，当绝缘层具有4μm至12μm的厚度时，可确保充分的附着力。更优选地，所述平面电极具有的厚度，并且所述突出电极可具有8μm的高度。这里，所述绝缘层具有6μm至10μm的厚度。
根据另一个实施方式，制备半导体装置的方法包括：堆在包括第一电极的第一连接元件上布置的各向异性导电膜进行预压；且将包括第二电极的第二连接元件放置在预压的各向异性导电膜上后，进行主要压制，其中，所述各向异性导电膜在固化后在85℃和85%RH放置500小时的条件下，具有10Ω或更小的连接电阻，并在50MPa至80MPa于190℃至210℃进行固化5秒至10秒。可在1.0MPa至5.0MPa于50℃至60℃预压1秒至5秒，并且可在60MPa至80MPa于150℃至250℃主要压制2秒至8秒。
此外，在制备半导体装置的方法中，所述各向异性导电膜在固化后在85℃和85%RH的条件下放置500小时后，在其间的空白区域中具有20%或更小的电极间的气泡面积。在该范围内，所述各向异性导电膜在高温/高湿条件下呈现优异的连接可靠性。
根据创造性概念，可使用本领域中已知的任何方法制备半导体装置而无需限制。
接下来，将参照一些实施例更详细地说明根据实施方式的本发明。然而，应理解提供这些实施例仅为说明的目的，并且不应解释为以任何形式限制本发明。
[实施例1至5]制备以特定含量比(X:Y=1:1to5:1)包括含萘环的环氧树脂(X)和含二环戊二烯环的环氧树脂(Y)的各向异性导电膜
实施例1
基于各向异性导电粘合剂层组合物的固含量的总量，混合20wt%的苯氧基树脂（YP50，NipponSteel&SumitomoMetal有限公司）、15wt%的含萘环的环氧树脂（HP4032D，DainipponInk&Chemicals有限公司）、15wt%的含二环戊二烯环的环氧树脂（HP7200L,DainipponInk&Chemicals有限公司）、15wt%的导电颗粒（AUL704,SekisuiChemical有限公司）、30wt%的固化剂（HX-3922,AsahiKasei有限公司）和5wt%的二氧化硅纳米颗粒（R812,Degussa股份有限公司），以制备各向异性导电膜组合物。
在室温(25℃)以所述导电颗粒不被粉碎的搅拌速度搅拌所述组合物60分钟。使用所述组合物在硅酮离型表面处理的聚乙烯膜上形成35μm厚的膜，使用铸刀用于膜成形。所述膜在60℃干燥5分钟。
实施例2
除了使用17.5wt%的含萘环的环氧树脂和12.5wt%的含二环戊二烯环的环氧树脂以外，以与实施例1相同的方式制备各向异性导电膜。
实施例3
除了使用20wt%的含萘环的环氧树脂和10wt%的含二环戊二烯环的环氧树脂以外，以与实施例1相同的方式制备各向异性导电膜。
实施例4
除了使用22.5wt%的含萘环的环氧树脂和7.5wt%的含二环戊二烯环的环氧树脂以外，以与实施例1相同的方式制备各向异性导电膜。
实施例5
除了使用25wt%的含萘环的环氧树脂和5wt%的含二环戊二烯环的环氧树脂以外，以与实施例1相同的方式制备各向异性导电膜。
对比例1
除了不使用含萘环的环氧树脂，并且使用30wt%的含二环戊二烯环的环氧树脂以外，以与实施例1相同的方式制备各向异性导电膜。
对比例2
除了使用5wt%的含萘环的环氧树脂和25wt%的含二环戊二烯环的环氧树脂以外，以与实施例1相同的方式制备各向异性导电膜。
对比例3
除了使用10wt%的含萘环的环氧树脂和20wt%的含二环戊二烯环的环氧树脂以外，以与实施例1相同的方式制备各向异性导电膜。
对比例4
除了使用30wt%的含萘环的环氧树脂，并且不使用含二环戊二烯环的环氧树脂以外，以与实施例1相同的方式制备各向异性导电膜。
构成实施例1至5和对比例1至4中制备的各向异性导电膜的组分的详细情况显示于表1和表2中。
表1
表2
实验例1：各向异性导电膜的粘附力（滚珠粘着性）的测量
为了测量实施例1至5和对比例1至4中的每个各向异性导电膜的粘合强度，使用探针粘性测试仪(TopTack2000A)根据下面的方法进行测试。
首先，用MEK仔细地清洗上部和下部负载传感器，以使负载不超过200gf，并干燥约3分钟。接着，将双面带附着到探针粘性测试仪的样品台上，将实施例1至5和对比例1至4中制备的每个各向异性导电膜附着到上面。然后，在下面的条件下测量每个各向异性导电膜的粘附力：
1)压力：200gf
2)分离速度：0.08毫米/秒
3)停留时间：20秒
4)操作温度：30℃
5)负载传感器：1.0kg
6)探针夹具的尺寸：3/8英寸。
实验例2：测量初始连接电阻和可靠性连接电阻
为了测量实施例1至5和对比例1至4的各向异性导电膜的初始连接电阻和可靠性连接电阻，将每种各向异性导电膜置于室温（25℃）下1小时，然后通过在70℃的测量温度和1.0MPa下预压1秒并在185℃并在200℃和70MPa的条件下主要压制5秒而将各向异性导电膜连接到COF（SamsungElectronics有限公司），从而制备每个各向异性导电膜的10个样品，其中COF通过在用厚度的ITO层涂布的0.5t无图案玻璃上形成允许四探针测量图案而制备。然后用四探针法测量每个样品的初始连接电阻（根据ASTMF43-64T），并计算平均值。
通过在85℃和85%RH的条件下放置10个样品500小时，而进行高温和高湿可靠性评估，测量每个样品的可靠性连接电阻（根据ASTMD117），并计算平均值。
实验例3：测量初始气泡面积和可靠性气泡面积
为了测量实施例1至5和对比例1至4的各向异性导电膜的初始气泡面积和可靠性气泡面积，将每个各向异性导电膜置于室温（25℃）下1小时，然后通过在70℃的测量温度和1.0MPa下预压1秒并在185℃并在200℃和70MPa的条件下主要压制5秒而将各向异性导电膜连接到COF（SamsungElectronics有限公司），从而制备每个各向异性导电膜的10个样品，其中COF通过在用厚度的ITO层涂布的0.5t无图案玻璃上形成允许四探针测量图案而制备。然后，用光学显微镜拍照10个点后，用图像分析仪测量在每个点的电极间的最初的气泡面积，并计算平均值。
通过在85℃和85%RH的条件下将每种膜的10个样品放置500小时进行高温和高湿可靠性测试后，用与上述相同的方法测量电极之间的可靠性气泡面积，并计算平均值。
实验例4：测量吸湿率
为了测量实施例1至5和对比例1至4的各向异性导电膜的吸湿率，使用下面的方法。
在各向异性导电膜在85℃和85%RH的条件下放置24小时后，测量每个膜的重量变化，并计算重量增加比。
评估例的结果显示于表3和表4。
表3
表4
在表3和表4的评估项目的气泡面积评估中，在电极之间的空间中，评估超过0%和20%或更小的气泡面积为O，评估20%和50%或更小的气泡面积为Δ，并且评估超过50%以及100%可靠性的气泡面积为X。
如表3和表4显示，实施例1至5和对比例2和3中，包括包含萘环的环氧树脂和包含二环戊二烯环的环氧树脂的各向异性导电膜在初始连接电阻和气泡面积方面呈现优异的性质。然而，确认了与对比例2和3的膜相比，具有1:1至5:1的环氧树脂比的实施例1至5的各向异性导电膜在可靠性连接电阻和气泡性质中依赖于两种环氧树脂的含量比，呈现显著的差异。
具体地，当所述两种环氧树脂的含量比从1:1至5:1（实施例1至5）时，所述膜具有0.8%或更小的吸湿率，因而通过确保期望的连接电阻而呈现提高的耐湿性及高温和高压可靠性评估后的气泡性质。
对比例1的膜具有低的粘合强度、可靠性评估后的高的连接电阻和大的气泡面积。此外，尽管良好的附着，对比例4的膜具有超过10Ω的连接电阻，和比实施例1至5的膜大的气泡面积。

Claims (19)

1.一种各向异性导电膜，基于各向异性导电粘合剂层的固含量的总量，包括：
a)10wt％至30wt％的聚合物粘结剂树脂；
b)5wt％至40wt％的环氧树脂；
c)5wt％至30wt％的导电颗粒；和
d)5wt％至50wt％的固化剂，
其中，所述b)环氧树脂包括含萘环的环氧树脂和含二环戊二烯环的环氧树脂，且
其中，基于100重量份的所述含二环戊二烯环的环氧树脂，所述含萘环的环氧树脂的含量为大于100重量份且小于等于500重量份。
2.根据权利要求1所述的各向异性导电膜，包括：各向异性导电粘合剂层和附着到所述各向异性导电粘合剂层的背面的基膜。
3.根据权利要求1所述的各向异性导电膜，进一步包括：二氧化硅纳米颗粒。
4.根据权利要求1所述的各向异性导电膜，在150℃下具有0.2Pa·s至0.5Pa·s的熔融粘度。
5.根据权利要求1所述的各向异性导电膜，具有0.8％或更小的吸湿率。
6.根据权利要求1所述的各向异性导电膜，具有30N/25mm至100N/25mm的粘合强度。
7.根据权利要求1至6的任一项所述的各向异性导电膜，其中，所述包含二环戊二烯环的环氧树脂在150℃具有0.1Pa·s至1Pa·s的熔融粘度。
8.根据权利要求1至6的任一项所述的各向异性导电膜，所述各向异性导电膜在固化后在85℃和85％RH放置500小时的条件下，具有10Ω或更小的连接电阻。
9.根据权利要求8所述的各向异性导电膜，其中，所述固化为在50MPa至80MPa的负载下，在190℃至210℃进行5秒至10秒。
10.根据权利要求8所述的各向异性导电膜，当固化后在85℃和85％RH放置500小时的条件下，在电极间的空白区域中具有20％或更小的电极间的气泡面积。
11.一种各向异性导电膜，其中所述各向异性导电膜包括含萘环的环氧树脂和含二环戊二烯环的环氧树脂，其中，基于100重量份的所述含二环戊二烯环的环氧树脂，所述含萘环的环氧树脂的含量为大于100重量份且小于等于500重量份，并在150℃下具有0.2Pa·s至0.5Pa·s的熔融粘度和0.8％或更小的吸湿率。
12.根据权利要求11所述的各向异性导电膜，其中，所述各向异性导电膜具有30N/25mm至100N/25mm的粘合强度。
13.根据权利要求11所述的各向异性导电膜，其中，所述含二环戊二烯环的环氧树脂在150℃下具有0.1Pa·s至1Pa·s的熔融粘度。
14.根据权利要求11所述的各向异性导电膜，其中，所述各向异性导电膜在固化后在85℃和85％RH放置500小时的条件下，具有10Ω或更小的连接电阻。
15.根据权利要求14所述的各向异性导电膜，其中，在50MPa至80MPa的负载下于190℃至210℃进行固化5秒至10秒。
16.根据权利要求11所述的各向异性导电膜，其中，所述各向异性导电膜在固化后在85℃和85％RH放置500小时的条件下，在电极间的空白区域中具有20％或更小的电极间的气泡面积。
17.一种装置，包括：
具有第一电极的第一连接元件；
具有第二电极的第二连接元件；和
布置在所述第一连接元件和所述第二连接元件之间并使所述第一电极和所述第二电极彼此电连接的根据权利要求1至16中的任一项所述的各向异性导电膜。
18.一种制备装置的方法，包括：
在包含第一电极的第一连接元件上放置并预压根据权利要求1至16的任一项所述的各向异性导电膜；和
在将包含第二电极的第二连接元件放置在所述预压的各向异性导电膜上后，进行主要压制，
其中，所述各向异性导电膜在固化后在85℃和85％RH放置500小时的条件下，具有10Ω或更小的连接电阻，并且所述固化为在50MPa至80MPa的负载下在190℃至210℃进行5秒至10秒。
19.一种装置，根据权利要求18的方法制备。
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