CN102484075A - 半导体器件及制造半导体器件的方法 - Google Patents

半导体器件及制造半导体器件的方法 Download PDF

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Publication number
CN102484075A
CN102484075A CN2010800398076A CN201080039807A CN102484075A CN 102484075 A CN102484075 A CN 102484075A CN 2010800398076 A CN2010800398076 A CN 2010800398076A CN 201080039807 A CN201080039807 A CN 201080039807A CN 102484075 A CN102484075 A CN 102484075A
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CN
China
Prior art keywords
semiconductor device
groove
warpage
semiconductor layer
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2010800398076A
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English (en)
Chinese (zh)
Inventor
穗永美纱子
增田健良
原田真
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
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Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Publication of CN102484075A publication Critical patent/CN102484075A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D12/00—Bipolar devices controlled by the field effect, e.g. insulated-gate bipolar transistors [IGBT]
    • H10D12/01—Manufacture or treatment
    • H10D12/031—Manufacture or treatment of IGBTs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/01—Manufacture or treatment
    • H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
    • H10D30/028—Manufacture or treatment of FETs having insulated gates [IGFET] of double-diffused metal oxide semiconductor [DMOS] FETs
    • H10D30/0291—Manufacture or treatment of FETs having insulated gates [IGFET] of double-diffused metal oxide semiconductor [DMOS] FETs of vertical DMOS [VDMOS] FETs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/64—Double-diffused metal-oxide semiconductor [DMOS] FETs
    • H10D30/66—Vertical DMOS [VDMOS] FETs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
    • H10D62/83—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge
    • H10D62/832—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge being Group IV materials comprising two or more elements, e.g. SiGe
    • H10D62/8325—Silicon carbide
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54426—Marks applied to semiconductor devices or parts for alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54453—Marks applied to semiconductor devices or parts for use prior to dicing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Formation Of Insulating Films (AREA)
CN2010800398076A 2009-09-08 2010-08-24 半导体器件及制造半导体器件的方法 Pending CN102484075A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2009207206A JP2011060901A (ja) 2009-09-08 2009-09-08 半導体装置および半導体装置の製造方法
JP2009-207206 2009-09-08
PCT/JP2010/064213 WO2011030661A1 (ja) 2009-09-08 2010-08-24 半導体装置および半導体装置の製造方法

Publications (1)

Publication Number Publication Date
CN102484075A true CN102484075A (zh) 2012-05-30

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN2010800398076A Pending CN102484075A (zh) 2009-09-08 2010-08-24 半导体器件及制造半导体器件的方法

Country Status (8)

Country Link
US (1) US20120171850A1 (enExample)
EP (1) EP2477213A4 (enExample)
JP (1) JP2011060901A (enExample)
KR (1) KR20120067340A (enExample)
CN (1) CN102484075A (enExample)
CA (1) CA2772676A1 (enExample)
TW (1) TW201130046A (enExample)
WO (1) WO2011030661A1 (enExample)

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US9420694B2 (en) * 2010-08-31 2016-08-16 Ge Embedded Electronics Oy Method for controlling warpage within electronic products and an electronic product
CN102436133A (zh) * 2011-08-17 2012-05-02 上海华力微电子有限公司 一种用于防止光掩模版应力传递致主图形移动的方法
CN102436134A (zh) * 2011-08-29 2012-05-02 上海华力微电子有限公司 一种用于非透光切割道中防止光掩模版应力损坏的方法
JP6887244B2 (ja) * 2016-12-09 2021-06-16 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法
US10998418B2 (en) * 2019-05-16 2021-05-04 Cree, Inc. Power semiconductor devices having reflowed inter-metal dielectric layers
DE102019120692B4 (de) * 2019-07-31 2025-12-11 Infineon Technologies Ag Leistungshalbleitervorrichtung und Verfahren
US12113131B2 (en) 2019-08-09 2024-10-08 Hitachi Energy Ltd Strain enhanced SiC power semiconductor device and method of manufacturing
CN117976698A (zh) * 2024-03-28 2024-05-03 南京第三代半导体技术创新中心有限公司 高可靠性平面栅型碳化硅mosfet功率器件及其制造方法

Citations (3)

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KR20050001717A (ko) * 2003-06-26 2005-01-07 주식회사 하이닉스반도체 반도체 소자의 트렌치형 소자분리막 형성 방법
US20080203402A1 (en) * 2007-02-28 2008-08-28 Denso Corporation SiC semiconductor device and method for manufacturing the same
US20100015797A1 (en) * 2005-08-26 2010-01-21 Toshio Saito Manufacturing method of semiconductor device

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JPH10125905A (ja) 1996-10-17 1998-05-15 Denso Corp 半導体基板および半導体基板のそり矯正方法
US7282739B2 (en) * 2002-04-26 2007-10-16 Nissan Motor Co., Ltd. Silicon carbide semiconductor device
JP2003332270A (ja) * 2002-05-15 2003-11-21 Renesas Technology Corp 半導体装置およびその製造方法
JP4303917B2 (ja) * 2002-06-05 2009-07-29 パナソニック株式会社 半導体装置の製造方法
US7407837B2 (en) * 2004-01-27 2008-08-05 Fuji Electric Holdings Co., Ltd. Method of manufacturing silicon carbide semiconductor device
JP4237086B2 (ja) * 2004-03-22 2009-03-11 関西電力株式会社 電圧制御型半導体装置
DE102005023891B4 (de) * 2004-05-24 2009-08-27 DENSO CORPORATION, Kariya-shi Verfahren zum Herstellen einer Siliziumkarbid-Halbleitervorrichtung und Siliziumkarbid-Halbleitervorrichtung
JP2005337956A (ja) * 2004-05-28 2005-12-08 Yamaha Corp 物理量センサとその製法
US7781802B2 (en) * 2006-04-28 2010-08-24 Nissan Motor Co., Ltd. Semiconductor device and manufacturing method thereof
JP4710724B2 (ja) * 2006-06-07 2011-06-29 株式会社デンソー 半導体装置の製造方法
JP2008053363A (ja) * 2006-08-23 2008-03-06 Matsushita Electric Ind Co Ltd 半導体基板およびその製造方法
JP5018044B2 (ja) * 2006-11-28 2012-09-05 パナソニック株式会社 半導体装置製造基材
JP4899829B2 (ja) * 2006-11-30 2012-03-21 パナソニック株式会社 半導体装置製造基材
JP5509520B2 (ja) * 2006-12-21 2014-06-04 富士電機株式会社 炭化珪素半導体装置の製造方法
JP4331773B2 (ja) * 2007-03-20 2009-09-16 Ｏｋｉセミコンダクタ株式会社 半導体装置及びその製造方法
JP2007201499A (ja) * 2007-04-06 2007-08-09 Denso Corp 半導体基板およびその製造方法
US7820534B2 (en) * 2007-08-10 2010-10-26 Mitsubishi Electric Corporation Method of manufacturing silicon carbide semiconductor device
JP2009054718A (ja) * 2007-08-24 2009-03-12 Fuji Electric Device Technology Co Ltd 半導体装置の製造方法
JP5141227B2 (ja) * 2007-12-12 2013-02-13 住友電気工業株式会社 半導体装置の製造方法
JP2009182271A (ja) * 2008-01-31 2009-08-13 Toshiba Corp 炭化珪素半導体装置
JP4640439B2 (ja) * 2008-04-17 2011-03-02 株式会社デンソー 炭化珪素半導体装置

Patent Citations (3)

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Publication number Priority date Publication date Assignee Title
KR20050001717A (ko) * 2003-06-26 2005-01-07 주식회사 하이닉스반도체 반도체 소자의 트렌치형 소자분리막 형성 방법
US20100015797A1 (en) * 2005-08-26 2010-01-21 Toshio Saito Manufacturing method of semiconductor device
US20080203402A1 (en) * 2007-02-28 2008-08-28 Denso Corporation SiC semiconductor device and method for manufacturing the same

Also Published As

Publication number Publication date
WO2011030661A1 (ja) 2011-03-17
EP2477213A1 (en) 2012-07-18
EP2477213A4 (en) 2014-05-14
KR20120067340A (ko) 2012-06-25
CA2772676A1 (en) 2011-03-17
JP2011060901A (ja) 2011-03-24
US20120171850A1 (en) 2012-07-05
TW201130046A (en) 2011-09-01

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Application publication date: 20120530