CN102473658B - 用于引线接合的超声波换能器与使用超声波换能器形成引线接合的方法 - Google Patents

用于引线接合的超声波换能器与使用超声波换能器形成引线接合的方法 Download PDF

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CN102473658B
CN102473658B CN201080035549.4A CN201080035549A CN102473658B CN 102473658 B CN102473658 B CN 102473658B CN 201080035549 A CN201080035549 A CN 201080035549A CN 102473658 B CN102473658 B CN 102473658B
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frequency
electric energy
transducers
area
brushing
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CN102473658A (zh
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D·A·迪安杰利斯
G·W·舒尔策
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Kulicke and Soffa Industries Inc
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Kulicke and Soffa Industries Inc
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • B23K20/007—Ball bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/05599—Material
    • H01L2224/056—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2224/05617—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
    • H01L2224/05624—Aluminium [Al] as principal constituent
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45147—Copper (Cu) as principal constituent
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/485—Material
    • H01L2224/48505—Material at the bonding interface
    • H01L2224/48799—Principal constituent of the connecting portion of the wire connector being Copper (Cu)
    • H01L2224/488—Principal constituent of the connecting portion of the wire connector being Copper (Cu) with a principal constituent of the bonding area being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/48817—Principal constituent of the connecting portion of the wire connector being Copper (Cu) with a principal constituent of the bonding area being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950 °C
    • H01L2224/48824—Aluminium (Al) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/852—Applying energy for connecting
    • H01L2224/85201—Compression bonding
    • H01L2224/85203—Thermocompression bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/852—Applying energy for connecting
    • H01L2224/85201—Compression bonding
    • H01L2224/85205—Ultrasonic bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
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    • H01L2924/01013—Aluminum [Al]
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    • H01L2924/01028—Nickel [Ni]
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    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
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    • H01L2924/01033—Arsenic [As]
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    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/20—Parameters
    • H01L2924/203—Ultrasonic frequency ranges, i.e. KHz
    • H01L2924/20305—Ultrasonic frequency [f] 100 Khz=<f< 125 KHz

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
  • Apparatuses For Generation Of Mechanical Vibrations (AREA)
CN201080035549.4A 2009-08-12 2010-08-10 用于引线接合的超声波换能器与使用超声波换能器形成引线接合的方法 Active CN102473658B (zh)

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CN201410548734.3A CN104465422B (zh) 2009-08-12 2010-08-10 用于引线接合的超声波换能器与使用超声波换能器形成引线接合的方法

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US23323709P 2009-08-12 2009-08-12
US61/233,237 2009-08-12
PCT/US2010/044976 WO2011019692A2 (en) 2009-08-12 2010-08-10 Ultrasonic transducers for wire bonding and methods for forming wire bonds using ultrasonic transducers

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CN102473658B true CN102473658B (zh) 2014-11-26

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CN201410548734.3A Active CN104465422B (zh) 2009-08-12 2010-08-10 用于引线接合的超声波换能器与使用超声波换能器形成引线接合的方法

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US (2) US8251275B2 (enExample)
JP (1) JP6180736B2 (enExample)
CN (2) CN102473658B (enExample)
SG (2) SG10201404843RA (enExample)
TW (1) TWI531434B (enExample)
WO (1) WO2011019692A2 (enExample)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9504471B2 (en) 2013-09-25 2016-11-29 Cybersonics, Inc. Ultrasonic generator systems and methods
JP5930419B2 (ja) * 2014-03-14 2016-06-08 株式会社カイジョー ボンディング装置
JP5930423B2 (ja) 2014-05-09 2016-06-08 株式会社カイジョー ボンディング装置
DE102014109630A1 (de) * 2014-07-09 2016-01-14 Hesse Gmbh Vorrichtung zum Herstellen einer Bondverbindung und Transducer hierfür
US9847313B2 (en) * 2015-04-24 2017-12-19 Kulicke And Soffa Industries, Inc. Thermocompression bonders, methods of operating thermocompression bonders, and horizontal scrub motions in thermocompression bonding
EP3179527B1 (en) * 2015-12-07 2020-02-19 Danfoss A/S A tranducer with connectors soldered thereon
WO2017132027A1 (en) * 2016-01-26 2017-08-03 Orthodyne Electronics Corporation Wedge bonding tools, wedge bonding systems, and related methods
US10052714B2 (en) * 2016-10-14 2018-08-21 Sonics & Materials, Inc. Ultrasonic welding device with dual converters
KR102229002B1 (ko) 2016-12-14 2021-03-16 주식회사 엘지화학 가공성 및 내환경 응력 균열성이 우수한 에틸렌/알파-올레핀 공중합체
US10381321B2 (en) * 2017-02-18 2019-08-13 Kulicke And Soffa Industries, Inc Ultrasonic transducer systems including tuned resonators, equipment including such systems, and methods of providing the same
CN112385026B (zh) * 2018-07-11 2024-06-11 株式会社新川 打线接合装置
EP3603826B1 (en) * 2018-07-31 2023-05-10 Infineon Technologies AG Method for calibrating an ultrasonic bonding machine
US11937979B2 (en) 2021-04-27 2024-03-26 Kulicke And Soffa Industries, Inc. Ultrasonic transducers, wire bonding machines including ultrasonic transducers, and related methods
JP7441558B2 (ja) 2021-09-16 2024-03-01 株式会社新川 ピンワイヤ形成方法、及びワイヤボンディング装置
US11691214B2 (en) * 2021-10-17 2023-07-04 Shinkawa Ltd. Ultrasound horn
US11798911B1 (en) * 2022-04-25 2023-10-24 Asmpt Singapore Pte. Ltd. Force sensor in an ultrasonic wire bonding device
US20240116126A1 (en) * 2022-10-11 2024-04-11 Asmpt Singapore Pte. Ltd. Ultrasonic transducer operable at multiple resonant frequencies
US20240116127A1 (en) * 2022-10-11 2024-04-11 Asmpt Singapore Pte. Ltd. Ultrasonic transducer operable at multiple resonant frequencies

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5884834A (en) * 1996-09-20 1999-03-23 Kulicke And Soffa Investments, Inc. Multi-frequency ultrasonic wire bonder and method
CN1733369A (zh) * 2004-07-28 2006-02-15 库利克-索法投资公司 用于超声波换能器动态隔离的集成弯曲安装方案
TW200843887A (en) * 2007-04-04 2008-11-16 Oerlikon Assembly Equipment Ag Steinhausen Ultrasonic transducer

Family Cites Families (42)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63118715A (ja) * 1986-11-07 1988-05-23 Matsushita Electric Ind Co Ltd 音響光学素子
JPS63239834A (ja) 1987-03-27 1988-10-05 Hitachi Ltd スクラブ機構
JPS63242479A (ja) * 1987-03-31 1988-10-07 Jiromaru Tsujino 複合振動を用いた超音波溶接方法およびその装置
US4938217A (en) * 1988-06-21 1990-07-03 Massachusetts Institute Of Technology Electronically-controlled variable focus ultrasound hyperthermia system
JPH0799945B2 (ja) * 1989-05-26 1995-10-25 株式会社トーキン 圧電楕円運動振動子
US5237237A (en) * 1990-03-12 1993-08-17 Seiko Epson Corporation Ultrasonic motor and drive method
JP2981951B2 (ja) 1992-06-23 1999-11-22 株式会社新川 ワイヤボンデイング装置
JPH0645411A (ja) 1992-07-22 1994-02-18 Rohm Co Ltd ワイヤーボンディング方法
JP3274731B2 (ja) * 1992-12-29 2002-04-15 芝浦メカトロニクス株式会社 ワイヤボンディング装置
US5469011A (en) 1993-12-06 1995-11-21 Kulicke & Soffa Investments, Inc. Unibody ultrasonic transducer
US5603445A (en) * 1994-02-24 1997-02-18 Hill; William H. Ultrasonic wire bonder and transducer improvements
US5494207A (en) * 1994-05-20 1996-02-27 National Semiconductor Corporation Wire bonder transducer arrangement and method
US5816476A (en) * 1994-08-24 1998-10-06 Verity Instruments Inc. Dual frequency power supply and transducer
KR0129952B1 (ko) * 1994-11-09 1998-04-17 김광호 초음파 진동 융착장치
US5578888A (en) * 1994-12-05 1996-11-26 Kulicke And Soffa Investments, Inc. Multi resonance unibody ultrasonic transducer
US5595328A (en) 1994-12-23 1997-01-21 Kulicke And Soffa Investments, Inc. Self isolating ultrasonic transducer
DE19512820B4 (de) * 1995-04-05 2005-11-03 Branson Ultraschall Niederlassung Der Emerson Technologies Gmbh & Co Verfahren und Vorrichtung zum Einstellen der Arbeitsfrequenz eines Orbitalvibrationsschweißsystems
JP3086158B2 (ja) * 1995-07-26 2000-09-11 株式会社日立製作所 超音波ボンディング方法
US5832412A (en) * 1996-02-09 1998-11-03 Kulicke And Soffa Investments, Inc. Programmable digital frequency ultrasonic generator
US7629726B2 (en) * 2007-07-11 2009-12-08 Puskas William L Ultrasound system
US5890643A (en) * 1996-11-15 1999-04-06 Kulicke And Soffa Investments, Inc. Low mass ultrasonic bonding tool
JP3566039B2 (ja) * 1997-07-29 2004-09-15 株式会社新川 ボンディング装置
JP2000253496A (ja) * 1999-03-03 2000-09-14 Ge Yokogawa Medical Systems Ltd アレイ型超音波トランスデューサおよびその製造方法
JP2000278073A (ja) * 1999-03-26 2000-10-06 Asahi Rubber Kk 超音波複合振動を用いた表面実装型振動子等の封止方法
US6244498B1 (en) * 1999-04-16 2001-06-12 Micron Semiconductor, Inc. Ultrasonic vibration mode for wire bonding
US6190497B1 (en) * 1999-04-23 2001-02-20 The Hong Kong Polytechnic University Ultrasonic transducer
US6286747B1 (en) * 2000-03-24 2001-09-11 Hong Kong Polytechnic University Ultrasonic transducer
TW521358B (en) * 2000-09-22 2003-02-21 Asm Tech Singapore Pte Ltd A method of bonding wires
KR100896828B1 (ko) * 2001-10-26 2009-05-12 외르리콘 어셈블리 이큅먼트 아게, 슈타인하우젠 와이어 본더를 보정하는 방법
JP3738420B2 (ja) * 2001-11-16 2006-01-25 東京応化工業株式会社 ポジ型ホトレジスト組成物および傾斜インプランテーションプロセス用薄膜レジストパターンの形成方法
DE10160228A1 (de) 2001-12-07 2003-06-18 Hesse & Knipps Gmbh Kreuztransducer
JP3791485B2 (ja) * 2002-06-04 2006-06-28 株式会社村田製作所 音叉形振動子およびそれを用いた振動ジャイロおよびそれを用いた電子装置および音叉形振動子の製造方法
WO2004103014A2 (en) * 2003-05-09 2004-11-25 The Crest Group, Inc. Advanced ceramics in ultrasonic transducerized devices
US7002283B2 (en) 2003-06-03 2006-02-21 Asm Assembly Automation Ltd. Ultrasonic transducer assembly
DE10333783A1 (de) * 2003-07-24 2005-02-17 Multi Orbital Systems Gmbh Orbital-Reibschweissverfahren und Vorrichtung zur Durchführung des Verfahrens
CN101084586B (zh) * 2003-11-05 2010-04-28 顶峰集团有限公司 采用多个频率的换能器的超声波处理方法和设备
JP2005252978A (ja) * 2004-03-08 2005-09-15 Nec Tokin Corp 広帯域通過型一方向性変成器
US20070222339A1 (en) * 2004-04-20 2007-09-27 Mark Lukacs Arrayed ultrasonic transducer
JP4264388B2 (ja) * 2004-07-01 2009-05-13 富士通株式会社 半導体チップの接合方法および接合装置
DE102004045575A1 (de) * 2004-09-17 2006-04-06 Hesse & Knipps Gmbh Ultraschalltransducer mit einem in der Lagerung angeordneten Sensor
JP5309626B2 (ja) * 2007-03-14 2013-10-09 株式会社ニコン 振動アクチュエータ、振動子の製造方法及び振動アクチュエータの製造方法
KR100891851B1 (ko) * 2007-07-27 2009-04-07 삼성전기주식회사 고정자와 이를 갖는 압전 초음파 모터

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5884834A (en) * 1996-09-20 1999-03-23 Kulicke And Soffa Investments, Inc. Multi-frequency ultrasonic wire bonder and method
CN1733369A (zh) * 2004-07-28 2006-02-15 库利克-索法投资公司 用于超声波换能器动态隔离的集成弯曲安装方案
TW200843887A (en) * 2007-04-04 2008-11-16 Oerlikon Assembly Equipment Ag Steinhausen Ultrasonic transducer

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CN104465422B (zh) 2017-06-06
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JP6180736B2 (ja) 2017-08-23
TW201116354A (en) 2011-05-16
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