CN102471495B - 螯合铝系潜伏性固化剂 - Google Patents
螯合铝系潜伏性固化剂 Download PDFInfo
- Publication number
- CN102471495B CN102471495B CN2011800026754A CN201180002675A CN102471495B CN 102471495 B CN102471495 B CN 102471495B CN 2011800026754 A CN2011800026754 A CN 2011800026754A CN 201180002675 A CN201180002675 A CN 201180002675A CN 102471495 B CN102471495 B CN 102471495B
- Authority
- CN
- China
- Prior art keywords
- compound
- curing agent
- latent curing
- aluminum chelate
- based latent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
- C08G59/70—Chelates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/08—Processes
- C08G18/0838—Manufacture of polymers in the presence of non-reactive compounds
- C08G18/0842—Manufacture of polymers in the presence of non-reactive compounds in the presence of liquid diluents
- C08G18/0861—Manufacture of polymers in the presence of non-reactive compounds in the presence of liquid diluents in the presence of a dispersing phase for the polymers or a phase dispersed in the polymers
- C08G18/0866—Manufacture of polymers in the presence of non-reactive compounds in the presence of liquid diluents in the presence of a dispersing phase for the polymers or a phase dispersed in the polymers the dispersing or dispersed phase being an aqueous medium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/62—Polymers of compounds having carbon-to-carbon double bonds
- C08G18/6212—Polymers of alkenylalcohols; Acetals thereof; Oxyalkylation products thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
- C08G18/72—Polyisocyanates or polyisothiocyanates
- C08G18/80—Masked polyisocyanates
- C08G18/8003—Masked polyisocyanates masked with compounds having at least two groups containing active hydrogen
- C08G18/8006—Masked polyisocyanates masked with compounds having at least two groups containing active hydrogen with compounds of C08G18/32
- C08G18/8009—Masked polyisocyanates masked with compounds having at least two groups containing active hydrogen with compounds of C08G18/32 with compounds of C08G18/3203
- C08G18/8022—Masked polyisocyanates masked with compounds having at least two groups containing active hydrogen with compounds of C08G18/32 with compounds of C08G18/3203 with polyols having at least three hydroxy groups
- C08G18/8029—Masked aromatic polyisocyanates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/188—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using encapsulated compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
- C08G65/04—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers only
- C08G65/06—Cyclic ethers having no atoms other than carbon and hydrogen outside the ring
- C08G65/16—Cyclic ethers having four or more ring atoms
- C08G65/18—Oxetanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/0091—Complexes with metal-heteroatom-bonds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/10—Encapsulated ingredients
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Dispersion Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Epoxy Resins (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Adhesive Tapes (AREA)
- Polyethers (AREA)
- Polyurethanes Or Polyureas (AREA)
Abstract
Description
Claims (15)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010146468A JP5365811B2 (ja) | 2010-06-28 | 2010-06-28 | アルミニウムキレート系潜在性硬化剤 |
JP2010-146468 | 2010-06-28 | ||
PCT/JP2011/063930 WO2012002177A1 (ja) | 2010-06-28 | 2011-06-17 | アルミニウムキレート系潜在性硬化剤 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102471495A CN102471495A (zh) | 2012-05-23 |
CN102471495B true CN102471495B (zh) | 2013-10-23 |
Family
ID=42969832
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2011800026754A Active CN102471495B (zh) | 2010-06-28 | 2011-06-17 | 螯合铝系潜伏性固化剂 |
Country Status (8)
Country | Link |
---|---|
US (1) | US8835572B2 (zh) |
EP (1) | EP2586817B1 (zh) |
JP (1) | JP5365811B2 (zh) |
KR (1) | KR101354875B1 (zh) |
CN (1) | CN102471495B (zh) |
HK (1) | HK1166510A1 (zh) |
TW (1) | TWI513727B (zh) |
WO (1) | WO2012002177A1 (zh) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4381255B2 (ja) * | 2003-09-08 | 2009-12-09 | ソニーケミカル&インフォメーションデバイス株式会社 | 潜在性硬化剤 |
JP5146645B2 (ja) * | 2007-08-28 | 2013-02-20 | デクセリアルズ株式会社 | マイクロカプセル型潜在性硬化剤 |
JP6235952B2 (ja) * | 2014-03-28 | 2017-11-22 | 三菱マテリアル株式会社 | 導電性ペースト |
JP6323247B2 (ja) * | 2014-08-11 | 2018-05-16 | デクセリアルズ株式会社 | アルミニウムキレート系潜在性硬化剤及びその製造方法 |
KR20160088512A (ko) | 2015-01-15 | 2016-07-26 | 삼성디스플레이 주식회사 | 전자기기 및 전자기기의 본딩 방법 |
JP2017101164A (ja) * | 2015-12-03 | 2017-06-08 | デクセリアルズ株式会社 | アルミニウムキレート系潜在性硬化剤、その製造方法及び熱硬化型エポキシ樹脂組成物 |
JP6915671B2 (ja) * | 2015-12-03 | 2021-08-04 | デクセリアルズ株式会社 | アルミニウムキレート系潜在性硬化剤、その製造方法及び熱硬化型エポキシ樹脂組成物 |
JP6804023B2 (ja) * | 2016-02-10 | 2020-12-23 | 日東電工株式会社 | 光学用感光性樹脂組成物およびそれを用いた光学材料 |
JP6833169B2 (ja) * | 2016-02-10 | 2021-02-24 | 日東電工株式会社 | 光学用感光性樹脂組成物およびそれを用いた光学材料 |
JP6948114B2 (ja) * | 2016-06-15 | 2021-10-13 | デクセリアルズ株式会社 | 熱硬化型エポキシ樹脂組成物、及びその製造方法 |
JP6670688B2 (ja) | 2016-06-15 | 2020-03-25 | デクセリアルズ株式会社 | 潜在性硬化剤、及びその製造方法、並びに熱硬化型エポキシ樹脂組成物 |
JP2018104653A (ja) * | 2016-12-28 | 2018-07-05 | 日立化成株式会社 | 接着剤組成物の選別方法、回路部材の接続方法、接続構造体、接着剤組成物及びフィルム状接着剤 |
CN111788247B (zh) * | 2018-01-12 | 2023-07-18 | 味之素株式会社 | 被覆粒子 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1633455A (zh) * | 2002-02-18 | 2005-06-29 | 索尼化学株式会社 | 潜在性固化剂及其制备方法、以及采用潜在性固化剂的粘合剂 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002212537A (ja) | 2001-01-24 | 2002-07-31 | Sony Chem Corp | 接着剤及び電気装置 |
JP4381255B2 (ja) | 2003-09-08 | 2009-12-09 | ソニーケミカル&インフォメーションデバイス株式会社 | 潜在性硬化剤 |
JP5285841B2 (ja) * | 2005-04-12 | 2013-09-11 | デクセリアルズ株式会社 | フィルム状接着剤の製造方法 |
US7557230B2 (en) * | 2005-06-06 | 2009-07-07 | Sony Corporation | Latent curing agent |
JP5057011B2 (ja) * | 2005-06-06 | 2012-10-24 | ソニーケミカル&インフォメーションデバイス株式会社 | 潜在性硬化剤 |
US8147720B2 (en) | 2007-01-24 | 2012-04-03 | Sony Corporation | Latent curing agent |
JP5298431B2 (ja) | 2007-01-24 | 2013-09-25 | デクセリアルズ株式会社 | 潜在性硬化剤 |
JP5067754B2 (ja) * | 2007-08-03 | 2012-11-07 | 独立行政法人理化学研究所 | 近接場顕微装置とその分光・画像取得方法 |
JP5212597B2 (ja) * | 2007-08-03 | 2013-06-19 | デクセリアルズ株式会社 | 潜在性硬化剤 |
JP5146645B2 (ja) | 2007-08-28 | 2013-02-20 | デクセリアルズ株式会社 | マイクロカプセル型潜在性硬化剤 |
JP5707662B2 (ja) * | 2008-01-25 | 2015-04-30 | デクセリアルズ株式会社 | 熱硬化型エポキシ樹脂組成物 |
JP5481995B2 (ja) * | 2009-07-24 | 2014-04-23 | デクセリアルズ株式会社 | アルミニウムキレート系潜在性硬化剤及びそれらの製造方法 |
-
2010
- 2010-06-28 JP JP2010146468A patent/JP5365811B2/ja active Active
-
2011
- 2011-06-17 KR KR1020117030676A patent/KR101354875B1/ko active IP Right Grant
- 2011-06-17 EP EP11800642.8A patent/EP2586817B1/en active Active
- 2011-06-17 US US13/320,996 patent/US8835572B2/en active Active
- 2011-06-17 WO PCT/JP2011/063930 patent/WO2012002177A1/ja active Application Filing
- 2011-06-17 CN CN2011800026754A patent/CN102471495B/zh active Active
- 2011-06-24 TW TW100122171A patent/TWI513727B/zh active
-
2012
- 2012-07-20 HK HK12107150.7A patent/HK1166510A1/xx unknown
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1633455A (zh) * | 2002-02-18 | 2005-06-29 | 索尼化学株式会社 | 潜在性固化剂及其制备方法、以及采用潜在性固化剂的粘合剂 |
Also Published As
Publication number | Publication date |
---|---|
US20120119156A1 (en) | 2012-05-17 |
TWI513727B (zh) | 2015-12-21 |
JP5365811B2 (ja) | 2013-12-11 |
EP2586817A4 (en) | 2017-10-18 |
TW201202293A (en) | 2012-01-16 |
KR20120040154A (ko) | 2012-04-26 |
US8835572B2 (en) | 2014-09-16 |
EP2586817A1 (en) | 2013-05-01 |
KR101354875B1 (ko) | 2014-01-22 |
CN102471495A (zh) | 2012-05-23 |
WO2012002177A1 (ja) | 2012-01-05 |
JP2010209359A (ja) | 2010-09-24 |
HK1166510A1 (en) | 2012-11-02 |
EP2586817B1 (en) | 2020-03-25 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN102471495B (zh) | 螯合铝系潜伏性固化剂 | |
CN102292373B (zh) | 铝螯合物类潜固化剂及其制造方法 | |
CN101925628B (zh) | 热固化型环氧树脂组合物 | |
CN102471462B (zh) | 铝螯合物系潜固化剂及其制造方法 | |
CN101115782B (zh) | 潜在性固化剂 | |
CN101189274B (zh) | 潜固化剂 | |
KR102331383B1 (ko) | 알루미늄 킬레이트계 잠재성 경화제, 그 제조 방법 및 열경화형 에폭시 수지 조성물 | |
CN1856521B (zh) | 潜在性固化剂 | |
CN101583648B (zh) | 潜伏性固化剂 | |
CN101098905B (zh) | 潜在性固化剂 | |
KR101039546B1 (ko) | 잠재성 경화제 | |
CN109071781A (zh) | 铝螯合物系潜伏性固化剂的制造方法和热固型环氧树脂组合物 | |
CN103249754B (zh) | 潜在性固化剂的制备方法 | |
CN106661201B (zh) | 铝螯合物系潜伏性固化剂及其制造方法 | |
JP5354192B2 (ja) | 熱硬化型導電ペースト組成物 | |
JP5360378B2 (ja) | 潜在性硬化剤の製造方法、及び接着剤の製造方法 | |
JP5130501B2 (ja) | 潜在性硬化剤 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
REG | Reference to a national code |
Ref country code: HK Ref legal event code: DE Ref document number: 1166510 Country of ref document: HK |
|
C53 | Correction of patent for invention or patent application | ||
CB02 | Change of applicant information |
Address after: Tokyo, Japan, Japan Applicant after: Dexerials Corporation Address before: Tokyo, Japan, Japan Applicant before: Sony Chemicals & Information Device Co., Ltd. |
|
COR | Change of bibliographic data |
Free format text: CORRECT: APPLICANT; FROM: + TO: DEXERIALS ELECTRONIC MATERIAL LTD. |
|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
REG | Reference to a national code |
Ref country code: HK Ref legal event code: GR Ref document number: 1166510 Country of ref document: HK |