CN102416681A - 控制模块制造方法 - Google Patents

控制模块制造方法 Download PDF

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CN102416681A
CN102416681A CN2011102786180A CN201110278618A CN102416681A CN 102416681 A CN102416681 A CN 102416681A CN 2011102786180 A CN2011102786180 A CN 2011102786180A CN 201110278618 A CN201110278618 A CN 201110278618A CN 102416681 A CN102416681 A CN 102416681A
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packing material
jig
control module
housing
electronic unit
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CN102416681B (zh
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朝桐智
加藤恭子
伊藤康行
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Toshiba Corp
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    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05FSYSTEMS FOR REGULATING ELECTRIC OR MAGNETIC VARIABLES
    • G05F1/00Automatic systems in which deviations of an electric quantity from one or more predetermined values are detected at the output of the system and fed back to a device within the system to restore the detected quantity to its predetermined value or values, i.e. retroactive systems
    • G05F1/10Regulating voltage or current
    • G05F1/46Regulating voltage or current wherein the variable actually regulated by the final control device is dc
    • G05F1/56Regulating voltage or current wherein the variable actually regulated by the final control device is dc using semiconductor devices in series with the load as final control devices
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C39/00Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
    • B29C39/02Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles
    • B29C39/10Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. casting around inserts or for coating articles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/68Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts by incorporating or moulding on preformed parts, e.g. inserts or layers, e.g. foam blocks
    • B29C70/70Completely encapsulating inserts
    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02MAPPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M3/00Conversion of dc power input into dc power output
    • H02M3/22Conversion of dc power input into dc power output with intermediate conversion into ac
    • H02M3/24Conversion of dc power input into dc power output with intermediate conversion into ac by static converters
    • H02M3/28Conversion of dc power input into dc power output with intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode to produce the intermediate ac
    • H02M3/325Conversion of dc power input into dc power output with intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode to produce the intermediate ac using devices of a triode or a transistor type requiring continuous application of a control signal
    • H02M3/335Conversion of dc power input into dc power output with intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode to produce the intermediate ac using devices of a triode or a transistor type requiring continuous application of a control signal using semiconductor devices only
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B29C2043/181Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles encapsulated
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293Organic, e.g. plastic
    • H01L23/295Organic, e.g. plastic containing a filler
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Composite Materials (AREA)
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  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Casings For Electric Apparatus (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
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Abstract

一种控制模块制造方法,在壳体中配置安装有电子部件的基板,该壳体在上表面具有开口部;在壳体内注入填充材料;利用卡具将填充材料从其表面侧推压,该卡具在上面具有凸的凹部并且覆盖开口部,该凹部与以基板主体为基准较高的铝电解电容器相对应;使填充材料固化。

Description

控制模块制造方法
相关申请的引用
本申请基于2010年9月24日提出的日本专利申请2010-214355并要求其优先权,其全部内容通过引用包含于此。
技术领域
本发明的实施方式涉及搭载于摩托车或自行车、洗衣机等的电池的控制模块制造方法。
背景技术
在搭载有大型电池的电动摩托车或电动自行车上,使用了用于监测电池的电压和温度的控制模块。此外,在洗衣机等中也使用对电流进行控制的控制模块。由于这样的控制模块可能溅上水,所以需要防水性。因此,已知有用树脂来密封印刷基板的结构。
此外,为了进一步提高防水性,已知有用树脂(填充材料)将安装的电子部件与印刷基板一起密封的控制模块。这样的控制模块是在电绝缘性的壳体中载置安装有布线和电子部件的控制基板,并注入液状的填充材料。另外,填充材料具有防水性和电绝缘性。另外,为了防止作为湿气的主因的空隙(viod)产生,填充材料的注入是在减压室(chamber)内以减压下的状态进行的。另外,作为电子部件使用铝电解电容器的情况下,由于其性质,若在减压下保持则会产生问题。因此,需要在常压下进行填充材料的注入。
在上述的使用减压室的控制模块制造方法中,存在如下问题。即,为了与电子部件之中最大型的电子部件相匹配,填充材料的密封需要将填充材料注入到壳体的边缘位置为止。因此,向下一工序等的搬运时,填充材料可能从壳体溢出。此外,由于到不需要密封的部分为止都被注入填充材料,所以存在妨碍轻量化、或者花费过多的材料成本等问题。
发明内容
一实施方式的控制模块制造方法具备以下步骤:在壳体中配置安装有电子部件的基板,该壳体在上表面具有开口部;在该壳体内注入填充材料;利用卡具将所述填充材料从其表面侧推压,该卡具在上面具有凸的凹部并且覆盖所述开口部,该凹部与所述电子部件中的以所述基板为基准而较高的电子部件相对应;以及使所述填充材料固化。
另一实施方式的控制模块制造方法为:在壳体中配置安装有电子部件的基板,该壳体在上表面具有开口部;配置卡具,该卡具在上面具有凸的凹部并且覆盖所述开口部,该凹部与所述电子部件中的以所述基板为基准而较高的电子部件相对应;在所述壳体和所述卡具之间注入所述填充材料;以及使所述填充材料固化。
根据上述实施例,能够提供一种控制模块制造方法,既能削减树脂量,并且能使向下一工序的搬运变得容易。
附图说明
图1是示意性地表示使用通过一实施方式的控制模块制造方法制造的控制模块的电池组的立体图。
图2是示意性地表示该控制模块的制造工序的纵剖视图。
图3是示意性地表示该控制模块的制造工序的纵剖视图。
图4是示意性地表示该控制模块的制造工序的纵剖视图。
具体实施方式
图1是示意性地表示使用通过第1实施方式的控制模块制造方法制造的控制模块20的电池组10的立体图,图2是示意性地表示控制模块20的纵剖视图。
图1中10表示搭载于电动摩托车等的电池组。电池组10具备:外壳11;多个电池12,收容于外壳11内;控制模块20,进行这些电池12的电压·温度管理;以及接口部13,将来自控制模块20的信息传递到外部。另外,图1中14表示引线。
如图4所示,控制模块20用电绝缘性的材质形成,具备壳体21,该壳体在上部具有开口部21a。在壳体21中安装有控制基板30和电缆40,该电缆40在该控制基板30与外部之间进行电流和信号的输入输出,控制基板30及电缆40被填充材料50密封。填充材料50例如使用聚氨酯(urethane)。另外,填充材料50不限于聚氨酯,可以使用具有防水性的热固化性树脂、热塑性树脂。
控制基板30具备印刷基板等基板主体31、安装于该基板主体31的上表面的电子部件32、以及铝电解电容器33。铝电解电容器33以基板主体31为基准,相对于电子部件32形成得更高。
对控制模块20的制造方法进行说明。最初,如图2所示,在壳体21中安装控制基板30及电缆40。
接着,如图3所示,从填充材料喷嘴70向壳体21内注入液状的填充材料50。填充材料50注入既能充分覆盖电子部件32又不足铝电解电容器33的高度的量。
接着,如图4所述,设置卡具60以盖住壳体21的开口部21a。另外,卡具60具备:形成为圆板状的卡具主体61;在该卡具主体61的中央部向上凸出地形成的凹部62;以及遍及卡具主体61的外周形成的突缘部63。凹部62对应于上述的铝电解电容器33,并形成有在用填充材料50密封时能够使填充材料50充分进入铝电解电容器33的顶部33a和凹部62的底部62a之间的间隙S。进而,卡具60的材质优选为对聚氨酯具有优越的离模性的聚丙烯。
若这样使卡具60被覆在注入了填充材料50的壳体21上,则卡具主体61的下表面与填充材料50的表面抵接,通过其压力使填充材料50的一部分流入凹部62。在此,若敲打卡具60等而使其振动,则填充材料50顺畅地朝向凹部62的底部62a侧流入。然后,最终凹部62的内部整体被填充了填充材料50。另外,通过适当地设定铝电解电容器33和凹部62的间隙,通过毛细现象也能够进行填充材料50的填充。
然后,在安装着卡具60的状态下向下一工序、例如固化炉搬运。由于卡具60盖着壳体21的开口部21a,所示即使是固化前的填充材料50也不会溢出,能够容易地进行搬运。
最终,使填充材料50在固化炉中过热而热固化。另外,填充材料50的固化方法不限于热固化,通过紫外线照射进行的固化也可以。由此,仅将较高的铝电解电容器33较厚地密封,将较低的其他电子部件32较薄地密封。
另外,填充材料50和卡具60优选为适当地选择容易相互离模(分离)的材质。此外,也可以设置开口孔62b,用于在填充时释放封入卡具60的凹部62的底部62a的空气。
如上所述,根据本实施方式的控制模块制造方法,能够使用卡具60仅将较高的电子部件较厚地密封,而将较低的电子部件较薄地密封,所以能够谋求削减使用的树脂量而轻量化。此外,能够防止填充材料从壳体溢出,所以使向下一工序的搬运变得容易。
另外,在上述的实施方式中,在注入了填充材料50之后再配置卡具60,但是也可以在设置了卡具60之后再注入热塑性树脂,不使用固化炉而固化密封。
以上实施方式仅为示例,不意图限定发明的范围。这些新的实施方式可以以各种形式实施。此外,在不脱离本发明的主旨的范围内,可以对上述的实施方式进行各种省略、替换或变形。权利要求及其等价物包括这些方式及变形,它们都包括在本发明的主旨及范围内。

Claims (5)

1.一种控制模块制造方法,具备以下步骤:
在壳体中配置安装有电子部件的基板,该壳体在上表面具有开口部;
在该壳体内注入填充材料;
利用卡具将所述填充材料从其表面侧推压,该卡具在上面具有凸的凹部并且覆盖所述开口部,该凹部与所述电子部件中的以所述基板为基准而较高的电子部件相对应;以及
使所述填充材料固化。
2.如权利要求1所述的控制模块制造方法,
在注入所述填充材料时,使所述卡具振动。
3.如权利要求1所述的控制模块制造方法,
在所述卡具的凹部的底部形成有开口孔。
4.如权利要求1所述的控制模块制造方法,
所述卡具和所述填充材料用容易相互离模的材质形成。
5.一种控制模块制造方法,具备以下步骤:
在壳体中配置安装有电子部件的基板,该壳体在上表面具有开口部;
配置卡具,该卡具在上面具有凸的凹部并且覆盖所述开口部,该凹部与所述电子部件中的以所述基板为基准而较高的电子部件相对应;
在所述壳体和所述卡具之间注入所述填充材料;以及
使所述填充材料固化。
CN201110278618.0A 2010-09-24 2011-09-19 控制模块制造方法 Expired - Fee Related CN102416681B (zh)

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CN109318448A (zh) * 2018-11-13 2019-02-12 湖州中云机械制造有限公司 一种振动研磨机机壳内衬层的注塑工艺
CN110421767A (zh) * 2019-09-04 2019-11-08 西安微电子技术研究所 一种基于印制板的高压灌封工装

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