JP5204185B2 - 制御モジュール製造方法 - Google Patents
制御モジュール製造方法 Download PDFInfo
- Publication number
- JP5204185B2 JP5204185B2 JP2010214355A JP2010214355A JP5204185B2 JP 5204185 B2 JP5204185 B2 JP 5204185B2 JP 2010214355 A JP2010214355 A JP 2010214355A JP 2010214355 A JP2010214355 A JP 2010214355A JP 5204185 B2 JP5204185 B2 JP 5204185B2
- Authority
- JP
- Japan
- Prior art keywords
- filler
- control module
- jig
- case
- opening
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05F—SYSTEMS FOR REGULATING ELECTRIC OR MAGNETIC VARIABLES
- G05F1/00—Automatic systems in which deviations of an electric quantity from one or more predetermined values are detected at the output of the system and fed back to a device within the system to restore the detected quantity to its predetermined value or values, i.e. retroactive systems
- G05F1/10—Regulating voltage or current
- G05F1/46—Regulating voltage or current wherein the variable actually regulated by the final control device is dc
- G05F1/56—Regulating voltage or current wherein the variable actually regulated by the final control device is dc using semiconductor devices in series with the load as final control devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
- B29C39/02—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles
- B29C39/10—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. casting around inserts or for coating articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
- B29C70/68—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts by incorporating or moulding on preformed parts, e.g. inserts or layers, e.g. foam blocks
- B29C70/70—Completely encapsulating inserts
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M3/00—Conversion of dc power input into dc power output
- H02M3/22—Conversion of dc power input into dc power output with intermediate conversion into ac
- H02M3/24—Conversion of dc power input into dc power output with intermediate conversion into ac by static converters
- H02M3/28—Conversion of dc power input into dc power output with intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode to produce the intermediate ac
- H02M3/325—Conversion of dc power input into dc power output with intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode to produce the intermediate ac using devices of a triode or a transistor type requiring continuous application of a control signal
- H02M3/335—Conversion of dc power input into dc power output with intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode to produce the intermediate ac using devices of a triode or a transistor type requiring continuous application of a control signal using semiconductor devices only
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
- B29C2043/181—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles encapsulated
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/295—Organic, e.g. plastic containing a filler
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Description
以下に、本願出願の当初の特許請求の範囲に記載された発明を付記する。
[1]電子部品が実装された基板を上面に開口部を有するケースに配置し、
このケース内に充填材を注入し、
前記電子部品のうち、前記基板を基準にして高い電子部品に対応し上に凸の凹部を有するとともに、前記開口部を覆う治具により前記充填材をその表面側から押圧し、
前記充填材を硬化させることを特徴とする制御モジュール製造方法。
[2]前記充填材を注入する際に、前記治具を振動させることを特徴とする[1]に記載の制御モジュール製造方法。
[3]前記治具は、その凹部の底部に開口孔が形成されていることを特徴とする[1]に記載の制御モジュール製造方法。
[4]前記治具と前記充填材とは、互いに離型しやすい材質で形成されていることを特徴とする[1]に記載の制御モジュール製造方法。
[5]電子部品が実装された基板を上面に開口部を有するケースに配置し、
前記電子部品のうち、前記基板を基準にして高い電子部品に対応し上に凸の凹部を有するとともに、前記開口部を覆う治具を配置し、
前記ケースと前記治具との間に前記充填材を注入し、
前記充填材を硬化させることを特徴とする制御モジュール製造方法。
Claims (4)
- 電子部品が実装された基板を上面に開口部を有するケースに配置し、
このケース内に充填材を注入し、
前記電子部品のうち、前記基板を基準にして高い電子部品に対応し上に凸の凹部を有する板状に形成され、その凹部の底部に開口孔が形成されるとともに、前記開口部を覆う治具により前記充填材をその表面側から押圧し、
前記充填材を硬化させて前記ケースと前記充填材とを一体化することを特徴とする制御モジュール製造方法。 - 前記充填材を注入する際に、前記治具を振動させることを特徴とする請求項1に記載の制御モジュール製造方法。
- 前記治具と前記充填材とは、互いに離型しやすい材質で形成されていることを特徴とする請求項1に記載の制御モジュール製造方法。
- 電子部品が実装された基板を上面に開口部を有するケースに配置し、
前記電子部品のうち、前記基板を基準にして高い電子部品に対応し上に凸の凹部を有する板状に形成され、その凹部の底部に開口孔が形成されるともに、前記開口部を覆う治具を配置し、
前記ケースと前記治具との間に前記充填材を注入し、
前記充填材を硬化させて上記ケースと上記充填材とを一体化することを特徴とする制御モジュール製造方法。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010214355A JP5204185B2 (ja) | 2010-09-24 | 2010-09-24 | 制御モジュール製造方法 |
KR1020110093566A KR101361466B1 (ko) | 2010-09-24 | 2011-09-16 | 제어 모듈 제조 방법 |
CN201110278618.0A CN102416681B (zh) | 2010-09-24 | 2011-09-19 | 控制模块制造方法 |
US13/240,090 US9597824B2 (en) | 2010-09-24 | 2011-09-22 | Control module manufacturing method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010214355A JP5204185B2 (ja) | 2010-09-24 | 2010-09-24 | 制御モジュール製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2012069810A JP2012069810A (ja) | 2012-04-05 |
JP5204185B2 true JP5204185B2 (ja) | 2013-06-05 |
Family
ID=45869849
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010214355A Expired - Fee Related JP5204185B2 (ja) | 2010-09-24 | 2010-09-24 | 制御モジュール製造方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US9597824B2 (ja) |
JP (1) | JP5204185B2 (ja) |
KR (1) | KR101361466B1 (ja) |
CN (1) | CN102416681B (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109318448A (zh) * | 2018-11-13 | 2019-02-12 | 湖州中云机械制造有限公司 | 一种振动研磨机机壳内衬层的注塑工艺 |
CN110421767A (zh) * | 2019-09-04 | 2019-11-08 | 西安微电子技术研究所 | 一种基于印制板的高压灌封工装 |
Family Cites Families (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3650648A (en) * | 1970-02-25 | 1972-03-21 | Union Carbide Corp | System for molding electronic components |
US4293519A (en) * | 1978-03-27 | 1981-10-06 | Motorola Inc. | Method for potting and encapsulating electronic circuits |
DE3343534A1 (de) * | 1983-12-01 | 1985-06-13 | Siemens Ag | Verfahren zum ausgiessen von hohlraeumen |
JPH0432784Y2 (ja) * | 1986-09-25 | 1992-08-06 | ||
JPH0228993A (ja) | 1988-07-19 | 1990-01-31 | Matsushita Electric Ind Co Ltd | プリント基板の防水処理方法 |
JPH02244792A (ja) * | 1989-03-17 | 1990-09-28 | Hitachi Electron Eng Co Ltd | 電子部品の樹脂コーティング方法 |
JPH05326597A (ja) * | 1992-05-20 | 1993-12-10 | Toowa Kk | 電子部品の樹脂封止成形装置と成形品の離型方法 |
JPH0621280U (ja) * | 1992-08-07 | 1994-03-18 | 株式会社小糸製作所 | 回路基板 |
JPH08118859A (ja) * | 1994-10-20 | 1996-05-14 | Oki Electric Ind Co Ltd | Icカード |
JPH08222011A (ja) * | 1995-02-17 | 1996-08-30 | Matsushita Electric Works Ltd | 電気装置用防水ケース |
JPH08330357A (ja) * | 1995-06-02 | 1996-12-13 | Hitachi Ltd | 半導体装置の製造方法 |
MY114454A (en) * | 1996-03-14 | 2002-10-31 | Towa Corp | Method of sealing electronic component with molded resin |
DE19755408A1 (de) * | 1997-12-12 | 1998-12-03 | Braun Ag | Baueinheit zum Einbau in ein elektrisches Gerät |
JP2000085026A (ja) * | 1998-09-11 | 2000-03-28 | Toshiba Corp | 光学部品製造方法及びその装置 |
JP2000165021A (ja) * | 1998-11-27 | 2000-06-16 | Kokusan Denki Co Ltd | 制御ユニット及びその製造方法 |
JP3620349B2 (ja) * | 1999-06-21 | 2005-02-16 | 富士通株式会社 | 充填材の充填方法 |
US6688353B1 (en) * | 2000-03-31 | 2004-02-10 | Bridgestone/Firestone North American Tire, Llc | Attachment patch for mounting an electronic monitoring device to the inside of a pneumatic tire |
JP2003086925A (ja) * | 2001-09-12 | 2003-03-20 | Matsushita Electric Ind Co Ltd | 防湿構造付プリント基板、及びその製造方法 |
EP1643818A4 (en) * | 2003-07-03 | 2006-08-16 | Hitachi Ltd | MODULE AND METHOD OF MANUFACTURING THE SAME |
JP4291215B2 (ja) * | 2004-05-31 | 2009-07-08 | 三菱電機株式会社 | 電子機器の密閉筐体 |
JP4444309B2 (ja) * | 2007-04-19 | 2010-03-31 | パナソニック株式会社 | 放熱用基板及びその製造方法 |
JP2009289494A (ja) * | 2008-05-27 | 2009-12-10 | Panasonic Electric Works Co Ltd | 点灯装置、照明装置、および照明器具 |
WO2010146860A1 (ja) * | 2009-06-17 | 2010-12-23 | パナソニック株式会社 | 樹脂モールド型電子部品の製造方法 |
-
2010
- 2010-09-24 JP JP2010214355A patent/JP5204185B2/ja not_active Expired - Fee Related
-
2011
- 2011-09-16 KR KR1020110093566A patent/KR101361466B1/ko active IP Right Grant
- 2011-09-19 CN CN201110278618.0A patent/CN102416681B/zh not_active Expired - Fee Related
- 2011-09-22 US US13/240,090 patent/US9597824B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN102416681A (zh) | 2012-04-18 |
US9597824B2 (en) | 2017-03-21 |
CN102416681B (zh) | 2014-10-29 |
US20120074608A1 (en) | 2012-03-29 |
KR101361466B1 (ko) | 2014-02-10 |
KR20120031441A (ko) | 2012-04-03 |
JP2012069810A (ja) | 2012-04-05 |
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