CN102414851B - 发光模块、光源装置、液晶显示装置和发光模块的制造方法 - Google Patents
发光模块、光源装置、液晶显示装置和发光模块的制造方法 Download PDFInfo
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- CN102414851B CN102414851B CN201180001913.XA CN201180001913A CN102414851B CN 102414851 B CN102414851 B CN 102414851B CN 201180001913 A CN201180001913 A CN 201180001913A CN 102414851 B CN102414851 B CN 102414851B
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- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
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- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
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- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Led Device Packages (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Liquid Crystal (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
- Planar Illumination Modules (AREA)
Abstract
Description
Claims (18)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010-054268 | 2010-03-11 | ||
JP2010054268 | 2010-03-11 | ||
PCT/JP2011/001443 WO2011111399A1 (ja) | 2010-03-11 | 2011-03-11 | 発光モジュール、光源装置、液晶表示装置および発光モジュールの製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102414851A CN102414851A (zh) | 2012-04-11 |
CN102414851B true CN102414851B (zh) | 2016-06-22 |
Family
ID=44563230
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201180001913.XA Expired - Fee Related CN102414851B (zh) | 2010-03-11 | 2011-03-11 | 发光模块、光源装置、液晶显示装置和发光模块的制造方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US9261246B2 (zh) |
EP (1) | EP2546899B1 (zh) |
JP (5) | JP4932064B2 (zh) |
CN (1) | CN102414851B (zh) |
WO (1) | WO2011111399A1 (zh) |
Families Citing this family (71)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2012002010A1 (ja) * | 2010-06-28 | 2012-01-05 | パナソニック液晶ディスプレイ株式会社 | 液晶表示装置およびテレビ受像機 |
WO2012144126A1 (ja) * | 2011-04-20 | 2012-10-26 | パナソニック株式会社 | 発光装置、バックライトユニット、液晶表示装置及び照明装置 |
JP5644952B2 (ja) * | 2011-09-27 | 2014-12-24 | 東芝ライテック株式会社 | 照明器具 |
JP2013098416A (ja) * | 2011-11-02 | 2013-05-20 | Toshiba Lighting & Technology Corp | 発光モジュール、および照明器具 |
JPWO2013073181A1 (ja) * | 2011-11-15 | 2015-04-02 | パナソニックIpマネジメント株式会社 | 発光モジュールおよびこれを用いたランプ |
EP2792934B1 (en) * | 2011-12-16 | 2018-08-22 | Panasonic Intellectual Property Management Co., Ltd. | Light-emitting module, and illumination light source and illumination device using same |
RU2012101194A (ru) * | 2012-01-10 | 2013-08-10 | Общество с ограниченной ответственностью "Оптоган. Новые технологии света" | Светоизлучающий модуль, блок источников света и способы их изготовления |
JP6096413B2 (ja) * | 2012-01-25 | 2017-03-15 | 新光電気工業株式会社 | 配線基板、発光装置及び配線基板の製造方法 |
CN104170102B (zh) * | 2012-02-02 | 2018-02-06 | 普瑞光电股份有限公司 | 在模制互连结构中封装仅具有顶侧连接的光子构建块 |
WO2013145054A1 (ja) * | 2012-03-26 | 2013-10-03 | パナソニック株式会社 | 照明用光源及び照明装置 |
JP2014135471A (ja) * | 2012-12-10 | 2014-07-24 | Nitto Denko Corp | 発光装置、発光装置集合体および電極付基板 |
JP5453580B1 (ja) * | 2012-07-12 | 2014-03-26 | パナソニック株式会社 | 発光モジュール |
JP6019906B2 (ja) * | 2012-08-07 | 2016-11-02 | 日亜化学工業株式会社 | 発光装置及びその製造方法 |
JP6006033B2 (ja) * | 2012-08-09 | 2016-10-12 | シャープ株式会社 | 発光装置、照明器具、および発光装置の製造方法 |
US9356070B2 (en) | 2012-08-15 | 2016-05-31 | Epistar Corporation | Light-emitting device |
US20140048824A1 (en) | 2012-08-15 | 2014-02-20 | Epistar Corporation | Light-emitting device |
WO2014030281A1 (ja) * | 2012-08-22 | 2014-02-27 | パナソニック株式会社 | 発光装置、電球形ランプ及び照明装置 |
JP6072472B2 (ja) * | 2012-08-27 | 2017-02-01 | シチズン電子株式会社 | Led発光装置 |
JP6024957B2 (ja) * | 2012-09-24 | 2016-11-16 | 東芝ライテック株式会社 | 発光装置および照明装置 |
JP5907388B2 (ja) * | 2012-09-24 | 2016-04-26 | 東芝ライテック株式会社 | 発光装置および照明装置 |
JP6080053B2 (ja) * | 2012-09-26 | 2017-02-15 | パナソニックIpマネジメント株式会社 | 発光モジュール |
JP6108756B2 (ja) * | 2012-10-18 | 2017-04-05 | シャープ株式会社 | 発光装置 |
JP2014107369A (ja) * | 2012-11-27 | 2014-06-09 | Citizen Holdings Co Ltd | 半導体発光装置 |
JP2014107495A (ja) * | 2012-11-29 | 2014-06-09 | Seiwa Electric Mfg Co Ltd | 発光装置 |
JP6261854B2 (ja) * | 2012-12-05 | 2018-01-17 | 日亜化学工業株式会社 | 発光ユニット |
TW201422968A (zh) * | 2012-12-11 | 2014-06-16 | Hon Hai Prec Ind Co Ltd | 發光二極體燈具 |
WO2014091655A1 (ja) * | 2012-12-13 | 2014-06-19 | パナソニック株式会社 | 発光装置、照明用光源及び照明装置 |
JP5979494B2 (ja) * | 2012-12-20 | 2016-08-24 | パナソニックIpマネジメント株式会社 | 照明装置及び発光モジュール |
JP6074704B2 (ja) * | 2012-12-28 | 2017-02-08 | パナソニックIpマネジメント株式会社 | 照明器具 |
JP6008290B2 (ja) * | 2012-12-28 | 2016-10-19 | パナソニックIpマネジメント株式会社 | 発光モジュール、照明装置および照明器具 |
WO2014115443A1 (ja) * | 2013-01-24 | 2014-07-31 | シャープ株式会社 | 電子装置およびその製造方法 |
JP6199568B2 (ja) * | 2013-01-30 | 2017-09-20 | 株式会社小糸製作所 | 発光モジュール |
ITMI20130338A1 (it) * | 2013-03-06 | 2014-09-07 | E R C Highlight S R L | Apparecchio di illuminazione con dispositivo per la protezione contro scariche elettrostatiche per moduli a led |
CN203258423U (zh) | 2013-04-11 | 2013-10-30 | 深圳市绎立锐光科技开发有限公司 | Led单元模组、发光装置以及光源系统 |
DE102014109718B4 (de) * | 2013-07-12 | 2018-03-08 | Panasonic Intellectual Property Management Co., Ltd. | Licht emittierende Vorrichtung und Beleuchtungseinrichtung unter Verwendung derselben |
JP6277510B2 (ja) * | 2013-09-11 | 2018-02-14 | パナソニックIpマネジメント株式会社 | 発光モジュール、照明装置および照明器具 |
TWI599745B (zh) * | 2013-09-11 | 2017-09-21 | 晶元光電股份有限公司 | 可撓式發光二極體組件及發光二極體燈泡 |
JP2015061024A (ja) * | 2013-09-20 | 2015-03-30 | パナソニック株式会社 | 発光モジュール |
JP6252753B2 (ja) * | 2013-12-20 | 2017-12-27 | パナソニックIpマネジメント株式会社 | 発光装置、照明装置及び実装基板 |
JP6203147B2 (ja) * | 2014-01-29 | 2017-09-27 | シャープ株式会社 | 発光装置 |
JP6230631B2 (ja) * | 2014-01-29 | 2017-11-15 | シャープ株式会社 | 発光装置 |
CN105143758B (zh) * | 2014-03-18 | 2018-02-13 | 飞利浦照明控股有限公司 | 包括环形光透射元件的照明设备 |
CN103872034A (zh) * | 2014-03-21 | 2014-06-18 | 长春希达电子技术有限公司 | 基于透光基板的全角度发光led光源及其封装方法 |
JP6035274B2 (ja) * | 2014-04-11 | 2016-11-30 | 浜井電球工業株式会社 | Led実装基板およびled照明灯具 |
JP2015222799A (ja) * | 2014-05-23 | 2015-12-10 | 東芝ライテック株式会社 | 発光モジュール及び照明装置 |
US10854800B2 (en) | 2014-08-07 | 2020-12-01 | Epistar Corporation | Light emitting device, light emitting module, and illuminating apparatus |
JP2016058650A (ja) * | 2014-09-11 | 2016-04-21 | パナソニックIpマネジメント株式会社 | 発光装置、照明用光源、及び照明装置 |
WO2016047242A1 (ja) * | 2014-09-26 | 2016-03-31 | シャープ株式会社 | 照明装置 |
CN107148684A (zh) * | 2014-12-11 | 2017-09-08 | 西铁城电子株式会社 | 发光装置 |
US10342091B2 (en) | 2015-03-13 | 2019-07-02 | Sharp Kabushiki Kaisha | Light-emitting device |
JP6147793B2 (ja) * | 2015-04-07 | 2017-06-14 | 日星電気株式会社 | レーザモジュール |
CN105090775B (zh) * | 2015-04-23 | 2017-08-15 | 上海新蕊光电科技有限公司 | 一种直接替换型led日光灯管 |
JP6842234B2 (ja) * | 2015-10-13 | 2021-03-17 | ローム株式会社 | 光半導体装置の製造方法および光半導体装置 |
JP6066240B2 (ja) * | 2016-01-29 | 2017-01-25 | 東芝ライテック株式会社 | 照明器具 |
US10066805B1 (en) * | 2016-02-29 | 2018-09-04 | Optronics International, Llc | Multi-function vehicle light assembly |
JP6703731B2 (ja) * | 2016-04-28 | 2020-06-03 | 日亜化学工業株式会社 | 発光装置及びその発光装置を備える光照射装置、並びに発光ユニット |
JP6928823B2 (ja) * | 2016-10-17 | 2021-09-01 | パナソニックIpマネジメント株式会社 | 発光モジュール及び照明器具 |
JP6575507B2 (ja) * | 2016-12-28 | 2019-09-18 | 日亜化学工業株式会社 | 発光装置および集積型発光装置 |
JP2018121032A (ja) | 2017-01-27 | 2018-08-02 | パナソニックIpマネジメント株式会社 | 発光装置及び照明装置 |
JP6333429B2 (ja) * | 2017-03-06 | 2018-05-30 | シャープ株式会社 | 発光装置 |
EP3383146B8 (en) * | 2017-03-31 | 2023-08-30 | Inventronics GmbH | Lighting device with ip protection and multidirectional bending capability, and method for manufacturing the same |
KR101916371B1 (ko) * | 2017-04-21 | 2018-11-08 | 서울반도체 주식회사 | 엘이디 패키지 세트 및 이를 포함하는 엘이디 벌브 |
CN118315518A (zh) * | 2017-04-21 | 2024-07-09 | 首尔半导体株式会社 | 照明装置 |
KR101916373B1 (ko) * | 2017-04-21 | 2018-11-08 | 서울반도체 주식회사 | 엘이디 패키지 세트 및 이를 포함하는 엘이디 벌브 |
KR101937196B1 (ko) * | 2017-08-08 | 2019-01-14 | 재경전광산업 주식회사 | 엘이디 전구용 엘이디 모듈, 엘이디 모듈 어레이 및 그 제조방법 |
JP2019087691A (ja) * | 2017-11-09 | 2019-06-06 | シャープ株式会社 | 発光装置及び画像表示装置 |
DE102017222014A1 (de) * | 2017-12-06 | 2019-06-06 | Zf Friedrichshafen Ag | Elektronische Einheit mit Leiterplatte |
JP2019129176A (ja) * | 2018-01-22 | 2019-08-01 | パナソニックIpマネジメント株式会社 | 発光装置の製造方法、及び、発光装置 |
CN110534627A (zh) * | 2018-05-23 | 2019-12-03 | 青岛海信电器股份有限公司 | 一种led灯板、其制备方法及显示装置 |
CN209431157U (zh) * | 2019-02-10 | 2019-09-24 | 中山市蓝德电子有限公司 | 一种柔性led倒装软灯条 |
US10986722B1 (en) * | 2019-11-15 | 2021-04-20 | Goodrich Corporation | High performance heat sink for double sided printed circuit boards |
Family Cites Families (36)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS52120552U (zh) * | 1976-03-02 | 1977-09-13 | ||
JPS52120552A (en) | 1976-04-02 | 1977-10-11 | Toshiba Corp | Apparatus for sucking and removing floating matters on water surface |
JP2535786Y2 (ja) * | 1991-03-25 | 1997-05-14 | サンケン電気株式会社 | 発光表示装置 |
JPH05299702A (ja) * | 1992-04-17 | 1993-11-12 | Stanley Electric Co Ltd | Ledアレイ |
JPH11274572A (ja) * | 1998-03-23 | 1999-10-08 | Nec Corp | Led表示素子および表示装置 |
JP2007294991A (ja) | 2001-09-03 | 2007-11-08 | Matsushita Electric Ind Co Ltd | 半導体発光デバイス |
TW595012B (en) | 2001-09-03 | 2004-06-21 | Matsushita Electric Ind Co Ltd | Semiconductor light-emitting device, light-emitting apparatus and manufacturing method of semiconductor light-emitting device |
EP1553638B1 (en) | 2002-06-21 | 2008-12-10 | Kyosemi Corporation | Light receiving or light emitting device and its production method |
JP4195979B2 (ja) | 2003-02-19 | 2008-12-17 | パナソニック株式会社 | 光通信用光電気変換モジュール |
JP2005252219A (ja) | 2004-02-06 | 2005-09-15 | Toyoda Gosei Co Ltd | 発光装置及び封止部材 |
US20050285926A1 (en) * | 2004-06-29 | 2005-12-29 | Fuji Photo Film Co., Ltd. | Light source assembly, method of producing light source assembly, and color thermal printer |
JP2006049857A (ja) * | 2004-06-29 | 2006-02-16 | Fuji Photo Film Co Ltd | 光源、および光源の作製方法、並びにカラー感熱プリンタ |
TWI419375B (zh) | 2005-02-18 | 2013-12-11 | Nichia Corp | 具備控制配光特性用之透鏡之發光裝置 |
JP5123466B2 (ja) | 2005-02-18 | 2013-01-23 | 日亜化学工業株式会社 | 発光装置 |
DE102005011722B4 (de) | 2005-03-15 | 2010-04-08 | Clariant Produkte (Deutschland) Gmbh | Verfahren zur chemischen Reinigung von Textilmaterial |
JP2006351708A (ja) | 2005-06-14 | 2006-12-28 | Toyoda Gosei Co Ltd | 発光ダイオードランプ及び光源装置 |
CN100429227C (zh) | 2005-06-29 | 2008-10-29 | 常州制药厂有限公司 | Exendin4多肽片段 |
JP5214128B2 (ja) | 2005-11-22 | 2013-06-19 | シャープ株式会社 | 発光素子及び発光素子を備えたバックライトユニット |
JP4956977B2 (ja) * | 2005-12-05 | 2012-06-20 | 日亜化学工業株式会社 | 発光装置 |
JP2008041567A (ja) * | 2006-08-09 | 2008-02-21 | Sharp Corp | 発光装置 |
EP1928026A1 (en) | 2006-11-30 | 2008-06-04 | Toshiba Lighting & Technology Corporation | Illumination device with semiconductor light-emitting elements |
JP2008244165A (ja) | 2007-03-27 | 2008-10-09 | Toshiba Lighting & Technology Corp | 照明装置 |
JP4753904B2 (ja) | 2007-03-15 | 2011-08-24 | シャープ株式会社 | 発光装置 |
JP2009010308A (ja) * | 2007-05-31 | 2009-01-15 | Toshiba Lighting & Technology Corp | 発光装置 |
JP4551948B2 (ja) | 2007-06-13 | 2010-09-29 | シャープ株式会社 | 線状光源装置、面発光装置、面状光源装置、および、液晶表示装置 |
US9273830B2 (en) * | 2007-06-14 | 2016-03-01 | Cree, Inc. | Light source with near field mixing |
JP5097471B2 (ja) | 2007-08-03 | 2012-12-12 | シャープ株式会社 | 発光装置の製造方法 |
JP4874220B2 (ja) | 2007-12-18 | 2012-02-15 | サンユレック株式会社 | 発光装置の製造方法および発光装置の製造装置 |
US8049237B2 (en) | 2007-12-28 | 2011-11-01 | Nichia Corporation | Light emitting device |
JP5119917B2 (ja) | 2007-12-28 | 2013-01-16 | 日亜化学工業株式会社 | 発光装置 |
WO2009119038A2 (en) * | 2008-03-28 | 2009-10-01 | Panasonic Corporation | Molded resin product, semiconductor light-emitting source, lighting device, and method for manufacturing molded resin product |
JP5390516B2 (ja) * | 2008-05-19 | 2014-01-15 | 株式会社東芝 | 線状白色光源ならびにそれを用いたバックライトおよび液晶表示装置 |
KR20100003321A (ko) | 2008-06-24 | 2010-01-08 | 삼성전자주식회사 | 발광 소자, 이를 포함하는 발광 장치, 상기 발광 소자 및발광 장치의 제조 방법 |
JP5345363B2 (ja) * | 2008-06-24 | 2013-11-20 | シャープ株式会社 | 発光装置 |
JP2010278266A (ja) | 2009-05-28 | 2010-12-09 | Toshiba Lighting & Technology Corp | 発光装置及び照明装置 |
US8400064B2 (en) * | 2009-09-09 | 2013-03-19 | Koninklijke Philips Electronics N.V. | Zener diode protection network in submount for LEDs connected in series |
-
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JP5203528B2 (ja) | 2013-06-05 |
US20120044669A1 (en) | 2012-02-23 |
EP2546899A4 (en) | 2013-12-25 |
EP2546899B1 (en) | 2015-06-24 |
US9261246B2 (en) | 2016-02-16 |
WO2011111399A1 (ja) | 2011-09-15 |
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