JP2016058650A - 発光装置、照明用光源、及び照明装置 - Google Patents
発光装置、照明用光源、及び照明装置 Download PDFInfo
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- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S8/00—Lighting devices intended for fixed installation
- F21S8/02—Lighting devices intended for fixed installation of recess-mounted type, e.g. downlighters
- F21S8/026—Lighting devices intended for fixed installation of recess-mounted type, e.g. downlighters intended to be recessed in a ceiling or like overhead structure, e.g. suspended ceiling
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2113/00—Combination of light sources
- F21Y2113/10—Combination of light sources of different colours
- F21Y2113/13—Combination of light sources of different colours comprising an assembly of point-like light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission in a repetitive configuration, e.g. LED bars
- H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
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- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
- H01L33/504—Elements with two or more wavelength conversion materials
Abstract
【解決手段】発光装置100は、基板10と、基板10上に実装された赤色LEDチップ20rと、赤色LEDチップ20rと直列接続され、かつ、赤色LEDチップ20rと発光色が異なる、基板10上に実装された青色LEDチップ20bと、緑色蛍光体60g及び黄色蛍光体60yを含み、少なくとも青色LEDチップ20bを封止する第二封止部材30bとを備え、赤色LEDチップ20r、青色LEDチップ20b、緑色蛍光体60g、及び黄色蛍光体60yが発光することにより白色光を発する。
【選択図】図3
Description
[発光装置の全体構成]
以下、実施の形態1に係る発光装置の全体構成について図面を用いて説明する。図1は、実施の形態1に係る発光装置の外観斜視図である。図2は、実施の形態1に係る発光装置100の平面図である。図3は、図2のA−A線における発光装置の断面図である。なお、図1ではボンディングワイヤの図示は省略されており、図2と図3とでは、説明のためにボンディングワイヤの配置が異なっている。
基板10は、例えば、メタルベース基板またはセラミック基板である。また、基板10は、樹脂を基材とする樹脂基板であってもよい。
上述のように、基板10上には、複数の赤色LEDチップ20rと複数の青色LEDチップ20bとが実装される。
発光装置100では、第二封止部材30bが、発光スペクトルのピークが異なる蛍光体を2種類以上含むことが特徴である。これにより、発光装置100の色度を目標の色度に容易に合わせこむことができる。以下、この効果について図4を用いて説明する。図4は、発光装置100における色度調整を説明するための色度座標図である。なお、図4の例では、緑色蛍光体60gは、中心波長が約563nmの緑色光を発し、黄色蛍光体60yは、中心波長が約572nmの黄色光を発する。
発光装置100では、第二封止部材30bは、赤色LEDチップ20r及び青色LEDチップ20bのうち青色LEDチップ20bのみを封止した。しかしながら、発光装置100においては、第二封止部材30bのみが封止部材として用いられてもよい。つまり、第二封止部材30bは、赤色LEDチップ20r及び青色LEDチップ20bの両方を封止してもよい。図6は、第二封止部材30bによって、赤色LEDチップ20r及び青色LEDチップ20bの両方が封止された発光装置の平面図である。
次に、実施の形態2に係る電球形ランプの構成について、図7を用いて説明する。図7は、実施の形態2に係る電球形ランプ150の構成概要を示す図である。
次に、実施の形態3に係る照明装置200について、図8及び図9を用いて説明する。図8は、実施の形態3に係る照明装置200の断面図である。図9は、実施の形態3に係る照明装置200及びその周辺部材の外観斜視図である。
以上、実施の形態に係る発光装置、照明用光源、及び照明装置について説明したが、本発明は、上記実施の形態に限定されるものではない。
20r 赤色LEDチップ(第一発光素子)
20b 青色LEDチップ(第二発光素子)
21、22、23、24、25 発光素子列
30b 第二封止部材(封止部材)
60g 緑色蛍光体
60y 黄色蛍光体
100、100a 発光装置
150 電球形ランプ(照明用光源)
200 照明装置
Claims (9)
- 基板と、
前記基板上に実装された第一発光素子と、
前記第一発光素子と直列接続され、かつ、前記第一発光素子と発光色が異なる、前記基板上に実装された第二発光素子と、
2種類以上の蛍光体を含み、少なくとも前記第二発光素子を封止する封止部材とを備え、
前記2種類以上の蛍光体は、所定の波長領域内に発光スペクトルのピークを有し、種類ごとに発光スペクトルのピークが異なり、
前記第一発光素子、前記第二発光素子、及び前記2種類以上の蛍光体が発光することにより白色光を発する
発光装置。 - 前記発光装置は、前記第一発光素子及び前記第二発光素子を含む発光素子列を複数備え、
複数の前記発光素子列は、並列接続されている
請求項1に記載の発光装置。 - 前記第一発光素子は、赤色の光を発し、
前記第二発光素子は、青色の光を発し、
前記所定の波長領域は、緑色から黄色の波長領域である
請求項1または2に記載の発光装置。 - 前記2種類以上の蛍光体には、緑色の光を発する蛍光体、及び、黄色の光を発する蛍光体が含まれる
請求項3に記載の発光装置。 - 前記第一発光素子は、発光スペクトルのピーク波長が600nm以上660nm以下の赤色LEDであり、
前記第二発光素子は、発光スペクトルのピーク波長が430nm以上480nm以下の青色LEDであり、
前記所定の波長領域は、500nm以上600nm以下の波長領域である
請求項3または4に記載の発光装置。 - 前記封止部材は、前記第一発光素子及び前記第二発光素子のうち前記第二発光素子のみを封止する
請求項1〜5のいずれか1項に記載の発光装置。 - 前記封止部材は、前記第一発光素子及び前記第二発光素子の両方を封止する
請求項1〜5のいずれか1項に記載の発光装置。 - 請求項1〜7のいずれか1項に記載の発光装置を備える
照明用光源。 - 請求項1〜7のいずれか1項に記載の発光装置を備える
照明装置。
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JP2014185622A JP2016058650A (ja) | 2014-09-11 | 2014-09-11 | 発光装置、照明用光源、及び照明装置 |
DE102015113743.7A DE102015113743A1 (de) | 2014-09-11 | 2015-08-19 | Lichtemittierende Vorrichtung, Beleuchtungslichtquelle und Beleuchtungsvorrichtung |
US14/829,715 US20160076712A1 (en) | 2014-09-11 | 2015-08-19 | Light emitting apparatus, lighting light source, and lighting apparatus |
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JP2014185622A JP2016058650A (ja) | 2014-09-11 | 2014-09-11 | 発光装置、照明用光源、及び照明装置 |
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JP (1) | JP2016058650A (ja) |
DE (1) | DE102015113743A1 (ja) |
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CN108488642A (zh) * | 2018-05-25 | 2018-09-04 | 深圳市明微电子股份有限公司 | 一种发光二极管照明装置和发光二极管单元 |
CN110993772A (zh) * | 2019-12-17 | 2020-04-10 | 宁波升谱光电股份有限公司 | 一种混光led光源及led照明设备 |
Citations (4)
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JP2007088248A (ja) * | 2005-09-22 | 2007-04-05 | Fujikura Ltd | 有色発光ダイオードランプ、装飾用照明装置及びカラーディスプレイサイン装置 |
JP2011192703A (ja) * | 2010-03-12 | 2011-09-29 | Toshiba Lighting & Technology Corp | 発光装置及び照明装置 |
US20130258653A1 (en) * | 2012-03-28 | 2013-10-03 | Edison Opto Corporation | Light device and its light emitting diode module |
JP2015050207A (ja) * | 2013-08-29 | 2015-03-16 | 東芝ライテック株式会社 | 発光モジュールおよび照明装置 |
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JP2011146640A (ja) | 2010-01-18 | 2011-07-28 | Fujikom Corp | Led光源 |
US9261246B2 (en) * | 2010-03-11 | 2016-02-16 | Panasonic Intellectual Property Management Co., Ltd. | Light-emitting module, light source device, liquid crystal display device, and method of manufacturing light-emitting module |
US8820950B2 (en) * | 2010-03-12 | 2014-09-02 | Toshiba Lighting & Technology Corporation | Light emitting device and illumination apparatus |
JP6075146B2 (ja) * | 2013-03-25 | 2017-02-08 | 東芝ライテック株式会社 | 発光モジュール及び照明装置 |
KR101580739B1 (ko) * | 2014-06-05 | 2015-12-28 | 엘지전자 주식회사 | 발광 장치 |
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- 2014-09-11 JP JP2014185622A patent/JP2016058650A/ja active Pending
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- 2015-08-19 DE DE102015113743.7A patent/DE102015113743A1/de not_active Withdrawn
- 2015-08-19 US US14/829,715 patent/US20160076712A1/en not_active Abandoned
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Publication number | Priority date | Publication date | Assignee | Title |
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JP2007088248A (ja) * | 2005-09-22 | 2007-04-05 | Fujikura Ltd | 有色発光ダイオードランプ、装飾用照明装置及びカラーディスプレイサイン装置 |
JP2011192703A (ja) * | 2010-03-12 | 2011-09-29 | Toshiba Lighting & Technology Corp | 発光装置及び照明装置 |
US20130258653A1 (en) * | 2012-03-28 | 2013-10-03 | Edison Opto Corporation | Light device and its light emitting diode module |
JP2015050207A (ja) * | 2013-08-29 | 2015-03-16 | 東芝ライテック株式会社 | 発光モジュールおよび照明装置 |
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US20160076712A1 (en) | 2016-03-17 |
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