CN102395924B - 感光性树脂组合物、使用其的感光性元件、抗蚀图形的形成方法和印刷线路板的制造方法 - Google Patents

感光性树脂组合物、使用其的感光性元件、抗蚀图形的形成方法和印刷线路板的制造方法 Download PDF

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CN102395924B
CN102395924B CN2010800171698A CN201080017169A CN102395924B CN 102395924 B CN102395924 B CN 102395924B CN 2010800171698 A CN2010800171698 A CN 2010800171698A CN 201080017169 A CN201080017169 A CN 201080017169A CN 102395924 B CN102395924 B CN 102395924B
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photosensitive polymer
polymer combination
combination according
formula
compound
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English (en)
Chinese (zh)
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CN102395924A (zh
Inventor
宫坂昌宏
锻治诚
印杰
姜学松
孙利达
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Shanghai Jiaotong University
Resonac Corp
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Shanghai Jiaotong University
Hitachi Chemical Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D241/00—Heterocyclic compounds containing 1,4-diazine or hydrogenated 1,4-diazine rings
    • C07D241/36—Heterocyclic compounds containing 1,4-diazine or hydrogenated 1,4-diazine rings condensed with carbocyclic rings or ring systems
    • C07D241/38—Heterocyclic compounds containing 1,4-diazine or hydrogenated 1,4-diazine rings condensed with carbocyclic rings or ring systems with only hydrogen or carbon atoms directly attached to the ring nitrogen atoms
    • C07D241/40—Benzopyrazines
    • C07D241/42—Benzopyrazines with only hydrogen atoms, hydrocarbon or substituted hydrocarbon radicals, directly attached to carbon atoms of the hetero ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/04—Acids; Metal salts or ammonium salts thereof
    • C08F220/06—Acrylic acid; Methacrylic acid; Metal salts or ammonium salts thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029

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  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Materials For Photolithography (AREA)
  • Polymerisation Methods In General (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Nitrogen Condensed Heterocyclic Rings (AREA)
CN2010800171698A 2009-04-30 2010-04-26 感光性树脂组合物、使用其的感光性元件、抗蚀图形的形成方法和印刷线路板的制造方法 Expired - Fee Related CN102395924B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2009-111076 2009-04-30
JP2009111076 2009-04-30
PCT/JP2010/057367 WO2010126006A1 (ja) 2009-04-30 2010-04-26 感光性樹脂組成物、これを用いた感光性エレメント、レジストパターンの形成方法、及びプリント配線板の製造方法

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CN102395924A CN102395924A (zh) 2012-03-28
CN102395924B true CN102395924B (zh) 2013-11-06

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JP (1) JP4756112B2 (ja)
KR (1) KR101350547B1 (ja)
CN (1) CN102395924B (ja)
TW (1) TWI530755B (ja)
WO (1) WO2010126006A1 (ja)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6064480B2 (ja) * 2011-10-26 2017-01-25 日立化成株式会社 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
JP6380907B2 (ja) * 2014-03-25 2018-08-29 川崎化成工業株式会社 エネルギー線重合性組成物
CN105111199B (zh) * 2015-07-30 2017-11-28 哈尔滨工程大学 单酚‑单胺型喹喔啉基苯并噁嗪及其制备方法
CN105153144B (zh) * 2015-09-01 2017-11-28 哈尔滨工程大学 主链双胺型喹喔啉基苯并噁嗪及其制备方法
CN116300314A (zh) * 2017-03-01 2023-06-23 旭化成株式会社 感光性树脂组合物
CN107445963B (zh) * 2017-06-23 2019-11-05 中山大学 一种喹喔啉类衍生物及其制备方法和应用
AT522210B1 (de) * 2019-02-27 2024-04-15 Univ Wien Tech Herstellungsverfahren für Chinoxaline
CN112650024B (zh) * 2020-12-17 2023-08-01 江苏艾森半导体材料股份有限公司 一种应用于芯片封装工艺的高膜厚负性光刻胶
WO2023238202A1 (ja) * 2022-06-06 2023-12-14 株式会社レゾナック 感光性エレメント、及び、レジストパターンの形成方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH599569A5 (en) * 1970-08-11 1978-05-31 Hoechst Ag Photoinitiators
CN1596386A (zh) * 2001-11-12 2005-03-16 旭化成电子材料元件株式会社 感光性树脂组合物及其用途

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003183253A (ja) * 2001-12-20 2003-07-03 Nippon Soda Co Ltd Ｎ−オニウム塩化合物および酸発生剤およびそれらを含有する硬化性組成物
JP4306319B2 (ja) * 2003-04-25 2009-07-29 コニカミノルタエムジー株式会社 感光性組成物および感光性平版印刷版
KR100998459B1 (ko) * 2003-09-25 2010-12-06 미쓰비시 가가꾸 가부시키가이샤 네가티브형 청자색 레이저 감광성 조성물, 화상 형성 재료,화상 형성재, 및 화상 형성 방법
JP2008129132A (ja) * 2006-11-17 2008-06-05 Konica Minolta Medical & Graphic Inc 感光性平版印刷版材料
JP2009031778A (ja) * 2007-06-27 2009-02-12 Mitsubishi Chemicals Corp 感光性組成物、方法、硬化物及び液晶表示装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH599569A5 (en) * 1970-08-11 1978-05-31 Hoechst Ag Photoinitiators
CN1596386A (zh) * 2001-11-12 2005-03-16 旭化成电子材料元件株式会社 感光性树脂组合物及其用途

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Publication number Publication date
KR101350547B1 (ko) 2014-01-10
WO2010126006A1 (ja) 2010-11-04
KR20120026027A (ko) 2012-03-16
JP4756112B2 (ja) 2011-08-24
TWI530755B (zh) 2016-04-21
TW201115268A (en) 2011-05-01
JPWO2010126006A1 (ja) 2012-11-01
CN102395924A (zh) 2012-03-28

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Address after: Japan Tokyo Chiyoda Marunouchi yidingmu 9 No. 2

Applicant after: Hitachi Chemical Co., Ltd.

Applicant after: Shanghai Jiao Tong University

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Termination date: 20200426