CN102300926A - 用于喷墨打印头的密封剂 - Google Patents

用于喷墨打印头的密封剂 Download PDF

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CN102300926A
CN102300926A CN2010800064662A CN201080006466A CN102300926A CN 102300926 A CN102300926 A CN 102300926A CN 2010800064662 A CN2010800064662 A CN 2010800064662A CN 201080006466 A CN201080006466 A CN 201080006466A CN 102300926 A CN102300926 A CN 102300926A
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S·L·克拉维克
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Abstract

本发明涉及适于用作密封剂以保护数字打印头上的硅半导体模头和它们的电连接的可UV固化的组合物，其包含丙烯酸酯和/或甲基丙基酸酯((甲基)丙烯酸酯)低聚物，优选双官能低聚物；稀释剂，优选(甲基)丙烯酸酯；三官能硫醇或四官能硫醇；聚氧化丙烯/氧化丁烯嵌段共聚物；和光引发剂。

Description

用于喷墨打印头的密封剂
相关申请的交叉引用
本申请要求2009年2月3日提交的美国临时专利申请第61/149,366号的权益，将其内容援引加入本文。
技术领域
本发明涉及用于保护喷墨打印头中硅半导体模头(die)微流体设备上的接头(tab)和线连接免受机械和流体损害的密封剂。
背景技术
打印头是以液滴的形式喷射流体的设备，所述液滴在接受介质上构成期望的字符或图案。打印头安装在打印装置上，打印头相对于打印接受介质移动或打印接受介质相对于打印头移动，使得打印接受介质被打印头扫描。打印头包括多个可选择性地操作的流体喷射设备，通常成直线设置。一些元件包括硅半导体模头、模头的表面、模头和基片之间的电连接、以及塑料基片。硅模头和连接被包封在物质中，以保护它们免受墨水的化学作用和打印头移动的机械应力。目前使用的密封剂不具有对于墨水的最优化的耐受性，最优化密封剂的墨水耐受性在工业上是有益的。
发明内容
本发明涉及适于用作密封剂以保护打印头上的硅半导体模头和它们的电连接的可UV固化的组合物。所述密封剂包含丙烯酸酯和/或甲基丙基酸酯(下文称为“(甲基)丙烯酸酯”)低聚物，优选双官能低聚物；稀释剂，优选(甲基)丙烯酸酯；三官能硫醇或四官能硫醇；聚氧化(丙烯)/聚氧化(丁烯)嵌段共聚物；和光引发剂。所述密封剂还可以包含一种或多种硅烷以进一步增强墨水耐受性，以及任选存在的一种或多种稳定剂、抑制剂、增黏剂、填充剂、过氧化物和消泡剂。
具体实施方式
适合的丙烯酸酯或甲基丙烯酸酯低聚物包括氨基甲酸酯、丙烯酸酯、或丙烯酸酯或甲基丙烯酸酯封端的环氧低聚物。在一个实施方案中，所述低聚物是芳香族氨基甲酸酯甲基丙烯酸酯。丙烯酸酯和/或甲基丙烯酸酯低聚物的存在量将为全部组合物的22-60重量％。
适合的稀释剂选自单官能丙烯酸酯和双官能丙烯酸酯，在一个实施方案中，稀释剂是甲基丙烯酸异冰片酯。其他稀释剂包括2-苯氧基乙基丙烯酸酯和三环癸烷二甲醇二丙烯酸酯。稀释剂的存在量将为全部组合物的30-55重量％。
在一些情况中，半导体组件位于柔性基片上，这要求密封剂配制物具有足够的机械韧性。适合的增韧剂包括三官能硫醇和四官能硫醇。在一个实施方案中，硫醇为三羟甲基丙烷三(3-巯基丙酸酯)。其他适合的硫醇包括季戊四醇四-3-巯基丙酸酯。硫醇的存在量将为全部组合物的2.5-8.8重量％。
其他适合的增韧剂是嵌段共聚物。在一个实施方案中，嵌段共聚物是氧化乙烯与氧化丁烯的摩尔比为1∶1的聚氧化(乙烯)/聚氧化(丁烯)嵌段共聚物。实际上，所述比例可以与1∶1略有差异，比例上的不显著的差异也表示为1∶1的摩尔比。嵌段共聚物的存在量将为全部组合物的1-25重量％。
在一个实施方案中，密封剂将进一步包含硅烷。适合的硅烷包括2-(3，4-环氧环己基)乙基三甲氧基硅烷、2-(氨基乙基)3-氨基-丙基三乙氧基硅烷、2-(3，4-环氧环己基)乙基三乙氧基硅烷、(3-缩水甘油氧基-丙基)三甲氧基硅烷、(3-缩水甘油氧基丙基)三乙氧基硅烷、5，6-环氧己基三乙氧基-硅烷、3-缩水甘油氧基丙基)甲基二乙氧基硅烷、(3-缩水甘油氧基丙基)二甲基乙氧基-硅烷、3-巯基丙基三甲氧基硅烷、3-氨基丙基三乙氧基硅烷、3-脲基-丙基三乙氧基硅烷、2-(二苯基膦)乙基三乙氧基硅烷、3-异氰酸酯基-丙基三乙氧基硅烷、甲基三乙氧基硅烷、异丁基三甲氧基硅烷、乙烯基三甲氧基硅烷、3-甲基丙烯酰氧基丙基三甲氧基硅烷、3-[2-(乙烯基苄基-氨基)-乙基氨基]丙基三甲氧基硅烷盐酸盐(dydrochloride)、3-缩水甘油氧基丙基三甲氧基-硅烷。硅烷的存在量将为全部组合物的0.5-2.0重量％。
适合的光引发剂包括由Ciba Specialty Chemicals以商标Irgacure出售的那些。其他适合的光引发剂包括羟基-环己基-苯基酮；苯基双(2，3，6三甲基苯甲酰基)氧化膦；和α，α-二甲氧基α苯基苯乙酮。光引发剂的存在量将为全部组合物的0.8-5.0重量％。
除了上述组分以外，密封剂组合物任选地还可以包含稳定剂、增黏剂、填充剂、消泡剂和已知用于密封剂组合物中的其他添加剂。
实施例
实施例1：此实施例显示包含各种增韧剂的密封剂组合物的性能，所述性能通过化学耐受性的水平和固化的密封剂的储能模量(storage modulus)而度量。
如下测量化学耐受性。制备包含下表中所示的组分的配制物。将液体配制物倾入尺寸相同的碟形模中，并使用300瓦/英寸的紫外线(UV)源通过UV曝光而固化。从模中取出固化的密封剂，固化的密封剂形成尺寸相同的碟。将这些碟称重并在60℃或90℃下浸入水性青色墨水中。相隔7、14和28天，将碟从流体中取出，用纸巾拍干，并重新称重。将之后的重量与初始重量相比较，并计算百分比重量变化。在未经浸渍实验的固化试样上测量动态机械分析(DMA)储能模量。将以重量百分比表示的配制物的组分、百分比重量变化和DMA记录于下表中，并且显示与比较配制物B、C和D相比较，包含聚氧化(丙烯)/聚氧化(丁烯)嵌段共聚物的配制物A具有最低的增重，并因此具有对墨水的最强耐受性。配制物A还具有低的动态机械分析(DMA)储能模量(表明高柔性)。
Figure BPA00001409194900041
实施例2
根据实施例1制备并实验了其他样品。配制物和结果报告于下表中。
Figure BPA00001409194900051
配制物实施例的比较：
配制物F包含聚氧化(乙烯)/聚氧化(丁烯)嵌段共聚物并且具有低的模量和低Tg，表明高柔性。配制物E不包含聚氧化(乙烯)/聚氧化(丁烯)嵌段共聚物并且具有高模量和高Tg，表明低柔性。配制物G不包含聚氧化(乙烯)/聚氧化(丁烯)嵌段共聚物并且具有高模量和高Tg，表明低柔性(与配制物E相似)。配制物H包含聚氧化(乙烯)/聚氧化(丁烯)嵌段共聚物并且具有低模量和低Tg，表明高柔性(与配制物F相似)。这些结果支持了以下事实：嵌段共聚物的存在使得配制物具有柔性。
配制物E(不包含嵌段共聚物)包含非气相二氧化硅并且不包含硅烷，在浸渍后具有低的百分比重量变化，表明良好的墨水耐受性。配制物F(包含嵌段共聚物)不包含非气相二氧化硅并且不包含硅烷，在浸渍后具有高的百分比重量变化，表明低的墨水耐受性。这些结果支持了以下事实：非气相二氧化硅的存在在浸渍中起对流体的障碍作用，并因此有助于良好的墨水耐受性。
配制物G(不包含嵌段共聚物)包含非气相的二氧化硅和硅烷，在浸渍后具有低的百分比重量变化，表明良好的墨水耐受性，甚至比配制物E(包含嵌段共聚物且包含非气相二氧化硅)还要低，配制物E不包含这种水平的硅烷。这些结果支持了以下事实：硅烷的存在改善了墨水耐受性。
配制物H包含嵌段共聚物、非气相二氧化硅以及硅烷，在浸渍后有中度的重量变化，表明比配制物F更高的墨水耐受性，但小于不包含嵌段共聚物的G的墨水耐受性。
这些结果表明对于柔性而言需要嵌段共聚物的存在，而对于墨水耐受性而言需要非气相二氧化硅的存在。结果还表明硅烷的存在进一步改善了墨水耐受性。
实施例3
如实施例1所述制备和实验了其他配制物。所述配制物的组分和实验结果报告于下表中，并且显示嵌段共聚物的水平对于降低储能模量有很大影响，但对于浸渍重量变化的影响较小。
Figure BPA00001409194900071

Claims (6)

1.密封剂组合物，其包含：
丙烯酸酯和/或甲基丙烯酸酯低聚物；
单官能(甲基)丙烯酸酯稀释剂；
三官能硫醇或四官能硫醇；
聚氧化丙烯/氧化丁烯嵌段共聚物；和
光引发剂。
2.如权利要求1所述的密封剂组合物，其中所述(甲基)丙烯酸酯低聚物为芳香族氨基甲酸酯聚合物。
3.如权利要求1所述的密封剂组合物，其还包含硅烷。
4.如权利要求3所述的密封剂组合物，其中所述硅烷的存在量为全部组合物的0.5-20重量％。
5.如权利要求3所述的密封剂组合物，其中所述(甲基)丙烯酸酯低聚物为芳香族氨基甲酸酯聚合物。
6.如权利要求1所述的密封剂组合物，其中：
所述丙烯酸酯和/或甲基丙烯酸酯低聚物的存在量为全部组合物的22重量％-60重量％；
所述单官能(甲基)丙烯酸酯稀释剂的存在量为全部组合物的30重量％-55重量％；
所述三官能硫醇或四官能硫醇的存在量为全部组合物的2.5重量％-8.8重量％；
所述聚氧化丙烯/氧化丁烯嵌段共聚物的存在量为全部组合物的1重量％-25重量％；
所述光引发剂的存在量为全部组合物的0.8重量％-5.0重量％。
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