CN102281704A - 配线基板 - Google Patents

配线基板 Download PDF

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Publication number
CN102281704A
CN102281704A CN2011101435257A CN201110143525A CN102281704A CN 102281704 A CN102281704 A CN 102281704A CN 2011101435257 A CN2011101435257 A CN 2011101435257A CN 201110143525 A CN201110143525 A CN 201110143525A CN 102281704 A CN102281704 A CN 102281704A
Authority
CN
China
Prior art keywords
layer
wiring
insulating layer
wiring layer
wavelength
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2011101435257A
Other languages
English (en)
Chinese (zh)
Inventor
金子健太郎
近藤人资
小谷幸太郎
下平朋幸
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Co Ltd
Original Assignee
Shinko Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Co Ltd filed Critical Shinko Electric Co Ltd
Publication of CN102281704A publication Critical patent/CN102281704A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/161—Using chemical substances, e.g. colored or fluorescent, for facilitating optical or visual inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
CN2011101435257A 2010-06-01 2011-05-31 配线基板 Pending CN102281704A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010126238A JP2011253911A (ja) 2010-06-01 2010-06-01 配線基板
JP2010-126238 2010-06-01

Publications (1)

Publication Number Publication Date
CN102281704A true CN102281704A (zh) 2011-12-14

Family

ID=45021139

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2011101435257A Pending CN102281704A (zh) 2010-06-01 2011-05-31 配线基板

Country Status (3)

Country Link
US (1) US20110290536A1 (https=)
JP (1) JP2011253911A (https=)
CN (1) CN102281704A (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104349571B (zh) * 2013-07-29 2017-06-06 富葵精密组件(深圳)有限公司 柔性电路板及其制作方法

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2713316B1 (en) * 2012-09-28 2017-07-19 Cartamundi Turnhout N.V. Card and method for manufacturing a card
DE102023209201B3 (de) 2023-09-21 2025-02-13 Vitesco Technologies GmbH Schaltungsträger und Verfahren

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040151882A1 (en) * 2002-09-26 2004-08-05 Fujitsu Limited Wiring board with core layer containing inorganic filler
CN101303528A (zh) * 2007-05-08 2008-11-12 太阳油墨制造株式会社 光固化性树脂组合物及其固化物、干膜、印刷电路板
JP2010021473A (ja) * 2008-07-14 2010-01-28 Shinko Electric Ind Co Ltd 配線基板の製造方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4189205A (en) * 1978-02-21 1980-02-19 Infrared Industries, Inc. Coated copper reflector
EP1990832A3 (en) * 2000-02-25 2010-09-29 Ibiden Co., Ltd. Multilayer printed circuit board and multilayer printed circuit board manufacturing method
JP2001354885A (ja) * 2000-06-15 2001-12-25 Tokushu Shikiryo Kogyo Kk プリント配線板用青色インキ組成物
ES2244381T3 (es) * 2000-10-11 2005-12-16 D. SWAROVSKI & CO. Elementos de marcaje para calzadas.
JP3926141B2 (ja) * 2000-12-27 2007-06-06 日本特殊陶業株式会社 配線基板
JP3910379B2 (ja) * 2001-06-12 2007-04-25 インターナショナル・ビジネス・マシーンズ・コーポレーション ボール・グリッド・アレイ・モジュール用の多層基板の製造方法
JP5267987B2 (ja) * 2006-11-06 2013-08-21 日本電気株式会社 半導体装置およびその製造方法
JP4975564B2 (ja) * 2007-08-31 2012-07-11 日東電工株式会社 半導体装置製造用の接着シート、及びそれを用いた半導体装置の製造方法
JP2009117424A (ja) * 2007-11-01 2009-05-28 Nitto Denko Corp 配線回路基板の製造方法
JP4510066B2 (ja) * 2007-11-06 2010-07-21 日東電工株式会社 配線回路基板の製造方法および検査方法
JP5339928B2 (ja) * 2009-01-15 2013-11-13 新光電気工業株式会社 配線基板及びその製造方法
JP5244020B2 (ja) * 2009-04-15 2013-07-24 日東電工株式会社 配線回路基板の製造方法
JP5406800B2 (ja) * 2010-07-30 2014-02-05 日東電工株式会社 配線回路基板およびその製造方法
JP5547594B2 (ja) * 2010-09-28 2014-07-16 新光電気工業株式会社 配線基板、半導体装置及び配線基板の製造方法
JP2012151191A (ja) * 2011-01-17 2012-08-09 Ibiden Co Ltd Ｌｅｄ用配線基板、発光モジュール、ｌｅｄ用配線基板の製造方法、及び発光モジュールの製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040151882A1 (en) * 2002-09-26 2004-08-05 Fujitsu Limited Wiring board with core layer containing inorganic filler
CN101303528A (zh) * 2007-05-08 2008-11-12 太阳油墨制造株式会社 光固化性树脂组合物及其固化物、干膜、印刷电路板
JP2010021473A (ja) * 2008-07-14 2010-01-28 Shinko Electric Ind Co Ltd 配線基板の製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104349571B (zh) * 2013-07-29 2017-06-06 富葵精密组件(深圳)有限公司 柔性电路板及其制作方法

Also Published As

Publication number Publication date
JP2011253911A (ja) 2011-12-15
US20110290536A1 (en) 2011-12-01

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PB01 Publication
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SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20111214