JP2011253911A - 配線基板 - Google Patents

配線基板 Download PDF

Info

Publication number
JP2011253911A
JP2011253911A JP2010126238A JP2010126238A JP2011253911A JP 2011253911 A JP2011253911 A JP 2011253911A JP 2010126238 A JP2010126238 A JP 2010126238A JP 2010126238 A JP2010126238 A JP 2010126238A JP 2011253911 A JP2011253911 A JP 2011253911A
Authority
JP
Japan
Prior art keywords
layer
insulating layer
wiring
wiring layer
wavelength
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2010126238A
Other languages
English (en)
Japanese (ja)
Other versions
JP2011253911A5 (https=
Inventor
Kentaro Kaneko
健太郎 金子
Hitoshi Kondo
人資 近藤
Kotaro Kotani
幸太郎 小谷
Tomoyuki Shimohira
朋幸 下平
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2010126238A priority Critical patent/JP2011253911A/ja
Priority to US13/093,915 priority patent/US20110290536A1/en
Priority to CN2011101435257A priority patent/CN102281704A/zh
Publication of JP2011253911A publication Critical patent/JP2011253911A/ja
Publication of JP2011253911A5 publication Critical patent/JP2011253911A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/161—Using chemical substances, e.g. colored or fluorescent, for facilitating optical or visual inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
JP2010126238A 2010-06-01 2010-06-01 配線基板 Pending JP2011253911A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2010126238A JP2011253911A (ja) 2010-06-01 2010-06-01 配線基板
US13/093,915 US20110290536A1 (en) 2010-06-01 2011-04-26 Wiring substrate
CN2011101435257A CN102281704A (zh) 2010-06-01 2011-05-31 配线基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010126238A JP2011253911A (ja) 2010-06-01 2010-06-01 配線基板

Publications (2)

Publication Number Publication Date
JP2011253911A true JP2011253911A (ja) 2011-12-15
JP2011253911A5 JP2011253911A5 (https=) 2013-06-06

Family

ID=45021139

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010126238A Pending JP2011253911A (ja) 2010-06-01 2010-06-01 配線基板

Country Status (3)

Country Link
US (1) US20110290536A1 (https=)
JP (1) JP2011253911A (https=)
CN (1) CN102281704A (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2713316B1 (en) * 2012-09-28 2017-07-19 Cartamundi Turnhout N.V. Card and method for manufacturing a card
CN104349571B (zh) * 2013-07-29 2017-06-06 富葵精密组件(深圳)有限公司 柔性电路板及其制作方法
DE102023209201B3 (de) 2023-09-21 2025-02-13 Vitesco Technologies GmbH Schaltungsträger und Verfahren

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001354885A (ja) * 2000-06-15 2001-12-25 Tokushu Shikiryo Kogyo Kk プリント配線板用青色インキ組成物
JP2008281652A (ja) * 2007-05-08 2008-11-20 Taiyo Ink Mfg Ltd 光硬化性樹脂組成物およびその硬化物
JP2010021473A (ja) * 2008-07-14 2010-01-28 Shinko Electric Ind Co Ltd 配線基板の製造方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4189205A (en) * 1978-02-21 1980-02-19 Infrared Industries, Inc. Coated copper reflector
EP1990832A3 (en) * 2000-02-25 2010-09-29 Ibiden Co., Ltd. Multilayer printed circuit board and multilayer printed circuit board manufacturing method
ES2244381T3 (es) * 2000-10-11 2005-12-16 D. SWAROVSKI & CO. Elementos de marcaje para calzadas.
JP3926141B2 (ja) * 2000-12-27 2007-06-06 日本特殊陶業株式会社 配線基板
JP3910379B2 (ja) * 2001-06-12 2007-04-25 インターナショナル・ビジネス・マシーンズ・コーポレーション ボール・グリッド・アレイ・モジュール用の多層基板の製造方法
JP3822549B2 (ja) * 2002-09-26 2006-09-20 富士通株式会社 配線基板
JP5267987B2 (ja) * 2006-11-06 2013-08-21 日本電気株式会社 半導体装置およびその製造方法
JP4975564B2 (ja) * 2007-08-31 2012-07-11 日東電工株式会社 半導体装置製造用の接着シート、及びそれを用いた半導体装置の製造方法
JP2009117424A (ja) * 2007-11-01 2009-05-28 Nitto Denko Corp 配線回路基板の製造方法
JP4510066B2 (ja) * 2007-11-06 2010-07-21 日東電工株式会社 配線回路基板の製造方法および検査方法
JP5339928B2 (ja) * 2009-01-15 2013-11-13 新光電気工業株式会社 配線基板及びその製造方法
JP5244020B2 (ja) * 2009-04-15 2013-07-24 日東電工株式会社 配線回路基板の製造方法
JP5406800B2 (ja) * 2010-07-30 2014-02-05 日東電工株式会社 配線回路基板およびその製造方法
JP5547594B2 (ja) * 2010-09-28 2014-07-16 新光電気工業株式会社 配線基板、半導体装置及び配線基板の製造方法
JP2012151191A (ja) * 2011-01-17 2012-08-09 Ibiden Co Ltd Ｌｅｄ用配線基板、発光モジュール、ｌｅｄ用配線基板の製造方法、及び発光モジュールの製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001354885A (ja) * 2000-06-15 2001-12-25 Tokushu Shikiryo Kogyo Kk プリント配線板用青色インキ組成物
JP2008281652A (ja) * 2007-05-08 2008-11-20 Taiyo Ink Mfg Ltd 光硬化性樹脂組成物およびその硬化物
JP2010021473A (ja) * 2008-07-14 2010-01-28 Shinko Electric Ind Co Ltd 配線基板の製造方法

Also Published As

Publication number Publication date
CN102281704A (zh) 2011-12-14
US20110290536A1 (en) 2011-12-01

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