CN102208410B - 半导体装置 - Google Patents

半导体装置 Download PDF

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Publication number
CN102208410B
CN102208410B CN201110077707.9A CN201110077707A CN102208410B CN 102208410 B CN102208410 B CN 102208410B CN 201110077707 A CN201110077707 A CN 201110077707A CN 102208410 B CN102208410 B CN 102208410B
Authority
CN
China
Prior art keywords
region
mos transistor
esd protection
distance
salicide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201110077707.9A
Other languages
English (en)
Chinese (zh)
Other versions
CN102208410A (zh
Inventor
山本祐广
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ablic Inc
Original Assignee
Seiko Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Instruments Inc filed Critical Seiko Instruments Inc
Publication of CN102208410A publication Critical patent/CN102208410A/zh
Application granted granted Critical
Publication of CN102208410B publication Critical patent/CN102208410B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D89/00—Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
    • H10D89/60—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD]
    • H10D89/601—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD] for devices having insulated gate electrodes, e.g. for IGFETs or IGBTs
    • H10D89/811—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD] for devices having insulated gate electrodes, e.g. for IGFETs or IGBTs using FETs as protective elements
    • H10D89/813—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD] for devices having insulated gate electrodes, e.g. for IGFETs or IGBTs using FETs as protective elements specially adapted to provide an electrical current path other than the field-effect induced current path
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/60—Protection against electrostatic charges or discharges, e.g. Faraday shields
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00—Electrodes of devices having potential barriers
    • H10D64/20—Electrodes characterised by their shapes, relative sizes or dispositions 
    • H10D64/23—Electrodes carrying the current to be rectified, amplified, oscillated or switched, e.g. sources, drains, anodes or cathodes
    • H10D64/251—Source or drain electrodes for field-effect devices
    • H10D64/254—Source or drain electrodes for field-effect devices for lateral devices wherein the source or drain electrodes extend entirely through the semiconductor bodies, e.g. via-holes for back side contacts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00—Electrodes of devices having potential barriers
    • H10D64/20—Electrodes characterised by their shapes, relative sizes or dispositions 
    • H10D64/23—Electrodes carrying the current to be rectified, amplified, oscillated or switched, e.g. sources, drains, anodes or cathodes
    • H10D64/251—Source or drain electrodes for field-effect devices
    • H10D64/257—Source or drain electrodes for field-effect devices for lateral devices wherein the source or drain electrodes are characterised by top-view geometrical layouts, e.g. interdigitated, semi-circular, annular or L-shaped electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00—Electrodes of devices having potential barriers
    • H10D64/20—Electrodes characterised by their shapes, relative sizes or dispositions 
    • H10D64/27—Electrodes not carrying the current to be rectified, amplified, oscillated or switched, e.g. gates
    • H10D64/311—Gate electrodes for field-effect devices
    • H10D64/411—Gate electrodes for field-effect devices for FETs
    • H10D64/511—Gate electrodes for field-effect devices for FETs for IGFETs
    • H10D64/517—Gate electrodes for field-effect devices for FETs for IGFETs characterised by the conducting layers
    • H10D64/519—Gate electrodes for field-effect devices for FETs for IGFETs characterised by the conducting layers characterised by their top-view geometrical layouts

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
CN201110077707.9A 2010-03-29 2011-03-29 半导体装置 Expired - Fee Related CN102208410B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010-076373 2010-03-29
JP2010076373A JP5529607B2 (ja) 2010-03-29 2010-03-29 半導体装置

Publications (2)

Publication Number Publication Date
CN102208410A CN102208410A (zh) 2011-10-05
CN102208410B true CN102208410B (zh) 2015-05-20

Family

ID=44655394

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201110077707.9A Expired - Fee Related CN102208410B (zh) 2010-03-29 2011-03-29 半导体装置

Country Status (5)

Country Link
US (1) US8610214B2 (enExample)
JP (1) JP5529607B2 (enExample)
KR (1) KR101761922B1 (enExample)
CN (1) CN102208410B (enExample)
TW (1) TWI525785B (enExample)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013008715A (ja) * 2011-06-22 2013-01-10 Semiconductor Components Industries Llc 半導体装置
JP6013876B2 (ja) 2012-10-30 2016-10-25 エスアイアイ・セミコンダクタ株式会社 半導体装置
JP6033054B2 (ja) 2012-11-22 2016-11-30 エスアイアイ・セミコンダクタ株式会社 半導体装置
JP5923046B2 (ja) * 2013-01-11 2016-05-24 株式会社東芝 半導体装置の製造方法
CN103400841B (zh) * 2013-07-12 2016-04-13 西安电子科技大学 基于SiGe BiCMOS的宽带射频芯片静电保护电路
CN104952866B (zh) * 2014-03-27 2019-07-12 恩智浦美国有限公司 集成电路电气保护装置
TWI575756B (zh) * 2015-01-13 2017-03-21 群創光電股份有限公司 顯示面板
JP5989264B1 (ja) * 2015-02-04 2016-09-07 三菱電機株式会社 半導体装置
JP6640049B2 (ja) * 2016-08-02 2020-02-05 日立オートモティブシステムズ株式会社 電子装置
CN108735727B (zh) * 2017-04-14 2021-01-01 中芯国际集成电路制造(上海)有限公司 晶体管版图结构、晶体管及制作方法
US11430749B2 (en) * 2018-10-31 2022-08-30 Infineon Technologies Ag ESD protection in an electronic device
CN110060997B (zh) * 2019-04-15 2020-04-17 长江存储科技有限责任公司 一种静电放电保护结构及其制作方法
US11574854B2 (en) * 2020-04-08 2023-02-07 National Research Council Of Canada Distributed inductance integrated field effect transistor structure
KR20220001812A (ko) * 2020-06-30 2022-01-06 삼성전기주식회사 Rf 스위치
CN116805623A (zh) * 2022-03-18 2023-09-26 联华电子股份有限公司 静电放电保护装置
CN115692406B (zh) * 2022-06-10 2025-09-02 珠海鸿芯科技有限公司 一种单双排pad和esd搭配使用的版图布局结构及方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101022106A (zh) * 2006-02-15 2007-08-22 冲电气工业株式会社 半导体装置
CN101373766A (zh) * 2007-08-22 2009-02-25 精工电子有限公司 半导体器件

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0745829A (ja) * 1993-07-28 1995-02-14 Ricoh Co Ltd 半導体集積回路装置
KR0164496B1 (ko) * 1995-12-02 1998-12-15 김광호 정전기보호소자
JP3472911B2 (ja) * 1997-10-31 2003-12-02 セイコーエプソン株式会社 半導体装置
JP2002280459A (ja) * 2001-03-21 2002-09-27 Kawasaki Microelectronics Kk 集積回路の製造方法
JP4790166B2 (ja) * 2001-07-05 2011-10-12 Ｏｋｉセミコンダクタ株式会社 保護トランジスタ
US6611025B2 (en) * 2001-09-05 2003-08-26 Winbond Electronics Corp. Apparatus and method for improved power bus ESD protection
JP4854934B2 (ja) * 2004-06-14 2012-01-18 ルネサスエレクトロニクス株式会社 静電気放電保護素子
JP2007116049A (ja) * 2005-10-24 2007-05-10 Toshiba Corp 半導体装置
JP2008098276A (ja) * 2006-10-10 2008-04-24 Sony Corp 半導体装置及びその製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101022106A (zh) * 2006-02-15 2007-08-22 冲电气工业株式会社 半导体装置
CN101373766A (zh) * 2007-08-22 2009-02-25 精工电子有限公司 半导体器件

Also Published As

Publication number Publication date
US20110233677A1 (en) 2011-09-29
CN102208410A (zh) 2011-10-05
KR101761922B1 (ko) 2017-07-26
KR20110109947A (ko) 2011-10-06
JP2011210904A (ja) 2011-10-20
US8610214B2 (en) 2013-12-17
TW201203494A (en) 2012-01-16
TWI525785B (zh) 2016-03-11
JP5529607B2 (ja) 2014-06-25

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Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
C41 Transfer of patent application or patent right or utility model
TR01 Transfer of patent right

Effective date of registration: 20160322

Address after: Chiba County, Japan

Patentee after: SEIKO INSTR INC

Address before: Chiba County, Japan

Patentee before: Seiko Instruments Inc.

CP01 Change in the name or title of a patent holder

Address after: Chiba County, Japan

Patentee after: EPPs Lingke Co. Ltd.

Address before: Chiba County, Japan

Patentee before: SEIKO INSTR INC

CP01 Change in the name or title of a patent holder
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20150520

Termination date: 20210329

CF01 Termination of patent right due to non-payment of annual fee