CN102203187A - 包含超支化芳族聚酰胺的热塑性组合物 - Google Patents

包含超支化芳族聚酰胺的热塑性组合物 Download PDF

Info

Publication number
CN102203187A
CN102203187A CN200980143835XA CN200980143835A CN102203187A CN 102203187 A CN102203187 A CN 102203187A CN 200980143835X A CN200980143835X A CN 200980143835XA CN 200980143835 A CN200980143835 A CN 200980143835A CN 102203187 A CN102203187 A CN 102203187A
Authority
CN
China
Prior art keywords
thermoplastic compounds
weight
hexamethylene
terephthalamide
poly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN200980143835XA
Other languages
English (en)
Chinese (zh)
Inventor
Y·萨加
W·W·张
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EIDP Inc
Original Assignee
EI Du Pont de Nemours and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EI Du Pont de Nemours and Co filed Critical EI Du Pont de Nemours and Co
Publication of CN102203187A publication Critical patent/CN102203187A/zh
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C08L101/005—Dendritic macromolecules
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/16—Halogen-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C08L77/06—Polyamides derived from polyamines and polycarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
CN200980143835XA 2008-10-30 2009-10-27 包含超支化芳族聚酰胺的热塑性组合物 Pending CN102203187A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US19777808P 2008-10-30 2008-10-30
US61/197778 2008-10-30
PCT/US2009/062140 WO2010056503A1 (en) 2008-10-30 2009-10-27 Thermoplastic composition including hyperbranched aromatic polyamide

Publications (1)

Publication Number Publication Date
CN102203187A true CN102203187A (zh) 2011-09-28

Family

ID=41528659

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200980143835XA Pending CN102203187A (zh) 2008-10-30 2009-10-27 包含超支化芳族聚酰胺的热塑性组合物

Country Status (6)

Country Link
US (1) US20100113669A1 (enExample)
EP (1) EP2350192A1 (enExample)
JP (1) JP2012507602A (enExample)
KR (1) KR20110084972A (enExample)
CN (1) CN102203187A (enExample)
WO (1) WO2010056503A1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112724667A (zh) * 2020-12-16 2021-04-30 金发科技股份有限公司 一种聚酰胺模塑组合物及其制备方法和应用
CN112745672A (zh) * 2020-12-16 2021-05-04 金发科技股份有限公司 一种聚酰胺模塑组合物及其制备方法和应用

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8293831B2 (en) * 2008-10-30 2012-10-23 E I Du Pont De Nemours And Company Thermoplastic composition including thermally conductive filler and hyperbranched polyesteramide
BR112013007553B1 (pt) 2010-09-30 2020-01-07 Ube Industries, Ltd. Composição de resina de poliamida e artigo moldado compreendendo a mesma
WO2013160454A2 (en) * 2012-04-27 2013-10-31 Dsm Ip Assets B.V. Electrically conductive polyamide substrate
CN115418100A (zh) * 2022-09-01 2022-12-02 浙江元盛塑业股份有限公司 一种利用超支化聚酰胺制备高导热pa66复合材料的方法
CN115975378B (zh) * 2022-12-14 2023-11-28 苏州优利金新材料有限公司 一种耐高温的二氧化硅改性尼龙材料的制备方法和应用

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0994157A1 (en) * 1998-10-12 2000-04-19 Dsm N.V. Molecular reinforced polymeric composition
FR2793252B1 (fr) * 1999-05-05 2001-07-20 Rhodianyl Copolyamide hyperbranche, composition a base de ce copolyamide hyperbranche et procede d'obtention de ce dernier
FR2807051B1 (fr) * 2000-03-29 2002-12-06 Rhodianyl Materiau composite a base de polyamide et particules minerales submicroniques
FR2833604B1 (fr) * 2001-12-17 2004-03-12 Rhodianyl Composition polymere thermoplastique comprenant un copolyamide hyperbranche, et articles realises a partir de cette composition
WO2003051993A1 (fr) * 2001-12-17 2003-06-26 Rhodianyl Composition thermoplastique comprenant un additif polymere hyperbranche, articles realises a partir de ce materiau
FR2856693B1 (fr) * 2003-06-26 2005-08-26 Rhodia Eng Plastics Srl Composition a base de matrice polyamide et/ou polyester et articles realises a partir de cette composition
US20060293427A1 (en) * 2005-06-10 2006-12-28 Martens Marvin M Thermally conductive polyamide-based components used in light emitting diode reflector applications

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112724667A (zh) * 2020-12-16 2021-04-30 金发科技股份有限公司 一种聚酰胺模塑组合物及其制备方法和应用
CN112745672A (zh) * 2020-12-16 2021-05-04 金发科技股份有限公司 一种聚酰胺模塑组合物及其制备方法和应用
WO2022127248A1 (zh) * 2020-12-16 2022-06-23 金发科技股份有限公司 一种聚酰胺模塑组合物及其制备方法和应用

Also Published As

Publication number Publication date
WO2010056503A1 (en) 2010-05-20
EP2350192A1 (en) 2011-08-03
KR20110084972A (ko) 2011-07-26
JP2012507602A (ja) 2012-03-29
US20100113669A1 (en) 2010-05-06

Similar Documents

Publication Publication Date Title
CN102203188B (zh) 包含导热填料和超支化聚酯酰胺的热塑性组合物
JP5337692B2 (ja) ポリアミドおよびセピオライト型粘土のナノ複合材料組成物
CN102203187A (zh) 包含超支化芳族聚酰胺的热塑性组合物
KR20190083365A (ko) 폴리페닐렌 설파이드(pps) 및 폴리아미드 6(pa6)을 함유하는 충전된 조성물
KR101408420B1 (ko) 폴리아미드 공중합체 및 성형품
JP2005162821A (ja) ポリアミド樹脂組成物
JP2000313803A (ja) ポリアミド樹脂組成物
JP5669627B2 (ja) ポリアミド樹脂組成物及び成形品
JP4045797B2 (ja) ポリアミド樹脂組成物の製造方法
JP5593788B2 (ja) 導電性ポリアミド樹脂組成物及び導電性ポリアミドフィルム
JP5959190B2 (ja) ポリアミド樹脂組成物及び成形品
JP2024010978A (ja) ポリアミド組成物、及び成形体
JP2012184284A (ja) ポリアミド樹脂組成物及び成形品
KR102473867B1 (ko) 폴리페닐렌 설파이드(pps)를 포함하는 중합체 조성물 중의 열-노화 안정화제로서의 폴리아미드 6(pa6)의 용도
JP4753487B2 (ja) ポリアミド樹脂組成物
JP4235878B2 (ja) 耐熱ポリアミド樹脂組成物の製造方法
JP2012184277A (ja) ポリアミド樹脂組成物及び成形品
JP2013124268A (ja) ポリアミド樹脂組成物を含む溶着成形品
JPH11302533A (ja) 難燃ポリアミド樹脂成形品
JP2013122001A (ja) 自動車外装部品用ポリアミド樹脂組成物及び当該ポリアミド樹脂組成物を含む自動車外装部品
JP2013122004A (ja) 携帯電子機器部品用ポリアミド樹脂組成物及び当該ポリアミド樹脂組成物を含む携帯電子機器部品
JP2013116967A (ja) ポリアミド樹脂組成物及び成形品

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20110928