CN102163571A - 基板输送装置和基板输送方法 - Google Patents

基板输送装置和基板输送方法 Download PDF

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Publication number
CN102163571A
CN102163571A CN201110035364XA CN201110035364A CN102163571A CN 102163571 A CN102163571 A CN 102163571A CN 201110035364X A CN201110035364X A CN 201110035364XA CN 201110035364 A CN201110035364 A CN 201110035364A CN 102163571 A CN102163571 A CN 102163571A
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CN
China
Prior art keywords
substrate
wafer
deformation
holding
posture
Prior art date
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Pending
Application number
CN201110035364XA
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English (en)
Chinese (zh)
Inventor
道木裕一
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of CN102163571A publication Critical patent/CN102163571A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Program-controlled manipulators
    • B25J9/16—Program controls
    • B25J9/1628—Program controls characterised by the control loop
    • B25J9/1633—Program controls characterised by the control loop compliant, force, torque control, e.g. combined with position control
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Program-controlled manipulators
    • B25J9/16—Program controls
    • B25J9/1656—Program controls characterised by programming, planning systems for manipulators
    • B25J9/1664—Program controls characterised by programming, planning systems for manipulators characterised by motion, path, trajectory planning
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F7/00—Methods or arrangements for processing data by operating upon the order or content of the data handled
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • H10P72/0608—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0616—Monitoring of warpages, curvatures, damages, defects or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3402—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
CN201110035364XA 2010-02-04 2011-01-31 基板输送装置和基板输送方法 Pending CN102163571A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010023502A JP5083339B2 (ja) 2010-02-04 2010-02-04 基板搬送装置及び基板搬送方法並びに記憶媒体
JP2010-023502 2010-02-04

Publications (1)

Publication Number Publication Date
CN102163571A true CN102163571A (zh) 2011-08-24

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201110035364XA Pending CN102163571A (zh) 2010-02-04 2011-01-31 基板输送装置和基板输送方法

Country Status (5)

Country Link
US (1) US20110190927A1 (https=)
JP (1) JP5083339B2 (https=)
KR (1) KR20110090753A (https=)
CN (1) CN102163571A (https=)
TW (1) TW201133687A (https=)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102569142A (zh) * 2012-02-03 2012-07-11 上海宏力半导体制造有限公司 硅片转移装置、转移托环、半导体工艺反应设备
CN104552301A (zh) * 2013-10-22 2015-04-29 日本电产三协株式会社 工业用机器人
CN107251211A (zh) * 2015-02-13 2017-10-13 川崎重工业株式会社 衬底搬送机械手及其运转方法
CN107275270A (zh) * 2016-03-31 2017-10-20 芝浦机械电子株式会社 基板输送装置、基板处理装置以及基板处理方法
CN109273391A (zh) * 2017-07-17 2019-01-25 台湾积体电路制造股份有限公司 晶圆传递模块及传递晶圆的方法
CN110034047A (zh) * 2018-01-05 2019-07-19 东京毅力科创株式会社 基片抓持机构、基片输送装置和基片处理系统
CN110268512A (zh) * 2017-02-03 2019-09-20 应用材料公司 图案放置校正的方法
CN110462809A (zh) * 2017-04-06 2019-11-15 东京毅力科创株式会社 基片处理装置和基片输送方法

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* Cited by examiner, † Cited by third party
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JP5566669B2 (ja) * 2009-11-19 2014-08-06 昭和電工株式会社 インライン式成膜装置及び磁気記録媒体の製造方法
JP5609856B2 (ja) * 2011-12-20 2014-10-22 株式会社安川電機 搬送ロボット
JP5884624B2 (ja) * 2012-05-02 2016-03-15 東京エレクトロン株式会社 基板処理装置、調整方法及び記憶媒体
KR102098596B1 (ko) * 2013-01-11 2020-04-09 삼성디스플레이 주식회사 기판 이송 장치 및 그 구동 방법
WO2014165406A1 (en) * 2013-04-01 2014-10-09 Brewer Science Inc. Apparatus and method for thin wafer transfer
WO2016167706A1 (en) * 2015-04-13 2016-10-20 Brunkeberg Systems Ab A lifting jig for lifting elements along the fagade of a building
KR102093825B1 (ko) * 2015-12-30 2020-03-27 맷슨 테크놀로지, 인크. 밀리세컨드 어닐 시스템 내의 기판 지지체
JP6671993B2 (ja) 2016-02-01 2020-03-25 東京エレクトロン株式会社 基板受け渡し位置の教示方法及び基板処理システム
CN108780770B (zh) * 2016-03-04 2022-12-06 川崎重工业株式会社 基板搬送装置及基板搬送机器人的示教方法
JP6440757B2 (ja) * 2017-03-16 2018-12-19 キヤノン株式会社 基板搬送システム、リソグラフィ装置、および物品の製造方法
CN106826927B (zh) * 2017-03-28 2019-09-13 芯导精密(北京)设备有限公司 一种半导体机械手机架
TWI622777B (zh) * 2017-07-07 2018-05-01 Electronic component picking test classification equipment
CN113169090B (zh) * 2018-12-03 2025-06-03 朗姆研究公司 销升降器测试衬底
CN114446843B (zh) * 2020-11-02 2025-05-27 上海华力集成电路制造有限公司 晶圆传送模块及其传送预传送的晶圆的方法
JP7607395B2 (ja) * 2020-12-09 2024-12-27 川崎重工業株式会社 基板搬送ロボット
KR102721980B1 (ko) 2022-02-24 2024-10-25 삼성전자주식회사 기판 정렬 장치 및 이를 이용한 기판 정렬 방법
JP2024035688A (ja) * 2022-09-02 2024-03-14 東京エレクトロン株式会社 基板処理装置、基板形状特定方法、搬送装置、及びエンドエフェクタ
KR102767876B1 (ko) * 2022-10-27 2025-02-19 세메스 주식회사 티칭 방법, 티칭 방법을 실행하는 매체에 저장된 프로그램 및 반송 시스템

Citations (4)

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WO2000019521A1 (en) * 1998-09-29 2000-04-06 Applied Materials, Inc. Chuck with integrated piezoelectric sensors for wafer detection
US6546307B1 (en) * 1999-08-20 2003-04-08 Taiwan Semiconductor Manufacturing Co., Ltd. Method and apparatus for detecting proper orientation of a semiconductor wafer in a wafer transfer system
US20060234178A1 (en) * 2005-04-19 2006-10-19 Tokyo Electron Limited Apparatus and method for heating substrate and coating and developing system
CN101573708A (zh) * 2005-02-08 2009-11-04 朗姆研究公司 晶片移动控制宏指令

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JP4055200B2 (ja) * 2002-03-15 2008-03-05 株式会社安川電機 基板搬送用フォーク
KR101015778B1 (ko) * 2003-06-03 2011-02-22 도쿄엘렉트론가부시키가이샤 기판 처리장치 및 기판 수수 위치의 조정 방법
JP4403841B2 (ja) * 2004-03-19 2010-01-27 株式会社安川電機 ウェハ有無検出装置およびこれを用いた搬送ロボット装置
JP4809594B2 (ja) * 2004-08-02 2011-11-09 東京エレクトロン株式会社 検査装置
US7766566B2 (en) * 2005-08-03 2010-08-03 Tokyo Electron Limited Developing treatment apparatus and developing treatment method
JP4684805B2 (ja) * 2005-08-25 2011-05-18 東京エレクトロン株式会社 プローブ装置及び被検査体とプローブとの接触圧の調整方法
US8057153B2 (en) * 2006-09-05 2011-11-15 Tokyo Electron Limited Substrate transfer device, substrate processing apparatus and substrate transfer method
JP5003315B2 (ja) * 2007-07-03 2012-08-15 東京エレクトロン株式会社 基板処理装置及び基板処理方法並びに記憶媒体

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000019521A1 (en) * 1998-09-29 2000-04-06 Applied Materials, Inc. Chuck with integrated piezoelectric sensors for wafer detection
US6546307B1 (en) * 1999-08-20 2003-04-08 Taiwan Semiconductor Manufacturing Co., Ltd. Method and apparatus for detecting proper orientation of a semiconductor wafer in a wafer transfer system
CN101573708A (zh) * 2005-02-08 2009-11-04 朗姆研究公司 晶片移动控制宏指令
US20060234178A1 (en) * 2005-04-19 2006-10-19 Tokyo Electron Limited Apparatus and method for heating substrate and coating and developing system

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102569142A (zh) * 2012-02-03 2012-07-11 上海宏力半导体制造有限公司 硅片转移装置、转移托环、半导体工艺反应设备
CN104552301A (zh) * 2013-10-22 2015-04-29 日本电产三协株式会社 工业用机器人
TWI562873B (https=) * 2013-10-22 2016-12-21 Nidec Sankyo Corp
CN107251211B (zh) * 2015-02-13 2020-10-23 川崎重工业株式会社 衬底搬送机械手及其运转方法
CN107251211A (zh) * 2015-02-13 2017-10-13 川崎重工业株式会社 衬底搬送机械手及其运转方法
CN107275270A (zh) * 2016-03-31 2017-10-20 芝浦机械电子株式会社 基板输送装置、基板处理装置以及基板处理方法
CN107275270B (zh) * 2016-03-31 2021-03-09 芝浦机械电子株式会社 基板输送装置、基板处理装置以及基板处理方法
CN110268512A (zh) * 2017-02-03 2019-09-20 应用材料公司 图案放置校正的方法
CN110268512B (zh) * 2017-02-03 2023-07-04 应用材料公司 图案放置校正的方法
CN110462809A (zh) * 2017-04-06 2019-11-15 东京毅力科创株式会社 基片处理装置和基片输送方法
CN109273391A (zh) * 2017-07-17 2019-01-25 台湾积体电路制造股份有限公司 晶圆传递模块及传递晶圆的方法
CN109273391B (zh) * 2017-07-17 2021-10-26 台湾积体电路制造股份有限公司 晶圆传递模块及传递晶圆的方法
CN110034047A (zh) * 2018-01-05 2019-07-19 东京毅力科创株式会社 基片抓持机构、基片输送装置和基片处理系统
CN110034047B (zh) * 2018-01-05 2023-05-05 东京毅力科创株式会社 基片抓持机构、基片输送装置和基片处理系统

Also Published As

Publication number Publication date
US20110190927A1 (en) 2011-08-04
KR20110090753A (ko) 2011-08-10
JP5083339B2 (ja) 2012-11-28
JP2011161521A (ja) 2011-08-25
TW201133687A (en) 2011-10-01

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Application publication date: 20110824