JPS60153788U - 位置検知センサ付ロボツトハンド - Google Patents

位置検知センサ付ロボツトハンド

Info

Publication number
JPS60153788U
JPS60153788U JP1984041039U JP4103984U JPS60153788U JP S60153788 U JPS60153788 U JP S60153788U JP 1984041039 U JP1984041039 U JP 1984041039U JP 4103984 U JP4103984 U JP 4103984U JP S60153788 U JPS60153788 U JP S60153788U
Authority
JP
Japan
Prior art keywords
position detection
detection sensor
robot hand
semiconductor wafer
hand
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1984041039U
Other languages
English (en)
Inventor
安藤　幸師
Original Assignee
シャープ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by シャープ株式会社 filed Critical シャープ株式会社
Priority to JP1984041039U priority Critical patent/JPS60153788U/ja
Publication of JPS60153788U publication Critical patent/JPS60153788U/ja
Priority to US07/004,844 priority patent/US4720130A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
    • B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J19/00—Accessories fitted to manipulators, e.g. for monitoring, for viewing; Safety devices combined with or specially adapted for use in connection with manipulators
    • B25J19/02—Sensing devices
    • B25J19/021—Optical sensing devices
    • B25J19/025—Optical sensing devices including optical fibres
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S294/00—Handling: hand and hoist-line implements
    • Y10S294/907—Sensor controlled device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
    • Y10S414/138—Wafers positioned vertically within cassette
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図ａ、ｂは、従来のロボットハンドを示し、第１図
ａは分解斜視図、第１図すは組立斜視図、第２図、本考
案のロボットハンドの斜視図、第３図ａ、　　ｂは、本
考案のロボットハンドの作用説明図、第４図は、本考案
の他の実施例を示す作用説明図である。 １・・・ハンド本体、？？　７ｔ　ｔ　７２・・・反射
型フォトセンサ。

Claims (1)

    【実用新案登録請求の範囲】
  1. 吸着孔を介して表面所定部位に半導体ウェハーを吸着支
    持する産業用ロボットの作業ハンドの表面所定部位に、
    半導体ウェハーの位置ずれ検知センサを設けたことを特
    徴とする位置検知センサ付ロボットハンド。
JP1984041039U 1984-03-21 1984-03-21 位置検知センサ付ロボツトハンド Pending JPS60153788U (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP1984041039U JPS60153788U (ja) 1984-03-21 1984-03-21 位置検知センサ付ロボツトハンド
US07/004,844 US4720130A (en) 1984-03-21 1987-01-12 Industrial robot hand with position sensor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984041039U JPS60153788U (ja) 1984-03-21 1984-03-21 位置検知センサ付ロボツトハンド

Publications (1)

Publication Number Publication Date
JPS60153788U true JPS60153788U (ja) 1985-10-14

Family

ID=12597259

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984041039U Pending JPS60153788U (ja) 1984-03-21 1984-03-21 位置検知センサ付ロボツトハンド

Country Status (2)

Country Link
US (1) US4720130A (ja)
JP (1) JPS60153788U (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH045393U (ja) * 1990-04-26 1992-01-17
JP2011161521A (ja) * 2010-02-04 2011-08-25 Tokyo Electron Ltd 基板搬送装置及び基板搬送方法並びに記憶媒体

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE461389B (sv) * 1986-07-10 1990-02-12 Volvo Ab Foerfarande och anordning foer oeverfoering av foeremaal
DE3707672A1 (de) * 1987-03-10 1988-09-22 Sitesa Sa Epitaxieanlage
US5004399A (en) * 1987-09-04 1991-04-02 Texas Instruments Incorporated Robot slice aligning end effector
US5069524A (en) * 1988-03-07 1991-12-03 Honda Giken Kogyo Kabushiki Kaisha Robot hand optical fiber connector coupling assembly
US4960298A (en) * 1988-12-20 1990-10-02 Texas Instruments Incorporated Semiconductor wafer pick-up device
EP0375209B1 (en) * 1988-12-20 1994-10-26 Texas Instruments Incorporated Semiconductor wafer pick-up device
FR2664525A1 (fr) * 1990-07-16 1992-01-17 Villejuif Etudes Ind Robot de manutention de tranche a capteur optique.
FR2664526A1 (fr) * 1990-07-16 1992-01-17 Villejuif Etudes Ind Systeme de manutention de tranche a protection contre les poussieres.
US5292222A (en) * 1992-03-31 1994-03-08 International Business Machines Corporation Robotic load device for outer diameter pickup of a disk
DE69402918T2 (de) * 1993-07-15 1997-08-14 Applied Materials Inc Substratfangvorrichtung und Keramikblatt für Halbleiterbearbeitungseinrichtung
US5697748A (en) * 1993-07-15 1997-12-16 Applied Materials, Inc. Wafer tray and ceramic blade for semiconductor processing apparatus
US6024393A (en) * 1996-11-04 2000-02-15 Applied Materials, Inc. Robot blade for handling of semiconductor substrate
KR100265757B1 (ko) * 1997-05-09 2000-09-15 윤종용 반도체 제조장비의 웨이퍼 오탑재 방지센서
US5988971A (en) * 1997-07-09 1999-11-23 Ade Optical Systems Corporation Wafer transfer robot
FR2778496B1 (fr) * 1998-05-05 2002-04-19 Recif Sa Procede et dispositif de changement de position d'une plaque de semi-conducteur
US6298280B1 (en) * 1998-09-28 2001-10-02 Asyst Technologies, Inc. Method for in-cassette wafer center determination
JP4230642B2 (ja) * 1999-07-08 2009-02-25 株式会社荏原製作所 基板搬送治具及び基板搬送装置
US6206441B1 (en) * 1999-08-03 2001-03-27 Taiwan Semiconductor Manufacturing Company, Ltd. Apparatus and method for transferring wafers by robot
US6467827B1 (en) * 1999-10-30 2002-10-22 Frank J. Ardezzone IC wafer handling apparatus incorporating edge-gripping and pressure or vacuum driven end-effectors
US6840421B2 (en) * 2001-12-07 2005-01-11 Hewlett-Packard Development Company, Lp. Tearing tool
FR2835337B1 (fr) * 2002-01-29 2004-08-20 Recif Sa Procede et dispositif d'identification de caracteres inscrits sur une plaque de semi-conducteur comportant au moins une marque d'orientation
DE502006004200D1 (de) * 2005-09-28 2009-08-20 Schmalz J Gmbh Unterdrucksystem
KR100763251B1 (ko) * 2006-02-01 2007-10-04 삼성전자주식회사 웨이퍼 이송 장치
KR20120063743A (ko) * 2010-12-08 2012-06-18 삼성전자주식회사 수술 로봇용 근접센서 및 그 동작 방법
US10566230B2 (en) * 2016-04-01 2020-02-18 Sunpower Corporation Gripper for semiconductor devices
JP6622775B2 (ja) * 2017-10-12 2019-12-18 ファナック株式会社 計測システム

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS492258A (ja) * 1972-04-26 1974-01-10

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1068514A (en) * 1963-05-03 1967-05-10 Headley Townsend Backhouse Improvements in or relating to suction grippers
SU423623A1 (ru) * 1971-08-10 1974-04-15 Двухпальцевый захват манипулятора
JPS534964A (en) * 1976-07-02 1978-01-18 Hitachi Ltd Handler with visual sensor
SU779068A1 (ru) * 1978-12-05 1980-11-15 Предприятие П/Я А-7631 Манипул тор
US4266905A (en) * 1979-04-20 1981-05-12 Board Of Regents For Education Of The State Of Rhode Island Apparatus for acquiring workpieces from a storage bin or the like
JPS59353B2 (ja) * 1980-07-24 1984-01-06 ファナック株式会社 把持装置
US4441817A (en) * 1980-07-29 1984-04-10 Diffracto Ltd. Electro-optical sensors with fiber optic bundles
US4463980A (en) * 1982-03-02 1984-08-07 Masaru Orii Vacuum suction apparatus
US4493606A (en) * 1982-05-24 1985-01-15 Proconics International, Inc. Wafer transfer apparatus
US4451197A (en) * 1982-07-26 1984-05-29 Advanced Semiconductor Materials Die Bonding, Inc. Object detection apparatus and method
US4603897A (en) * 1983-05-20 1986-08-05 Poconics International, Inc. Vacuum pickup apparatus

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS492258A (ja) * 1972-04-26 1974-01-10

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH045393U (ja) * 1990-04-26 1992-01-17
JP2011161521A (ja) * 2010-02-04 2011-08-25 Tokyo Electron Ltd 基板搬送装置及び基板搬送方法並びに記憶媒体

Also Published As

Publication number Publication date
US4720130A (en) 1988-01-19

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