KR20110090753A - 기판 반송 장치 및 기판 반송 방법과 기억 매체 - Google Patents

기판 반송 장치 및 기판 반송 방법과 기억 매체 Download PDF

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Publication number
KR20110090753A
KR20110090753A KR1020100125400A KR20100125400A KR20110090753A KR 20110090753 A KR20110090753 A KR 20110090753A KR 1020100125400 A KR1020100125400 A KR 1020100125400A KR 20100125400 A KR20100125400 A KR 20100125400A KR 20110090753 A KR20110090753 A KR 20110090753A
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KR
South Korea
Prior art keywords
substrate
wafer
holding
board
deformation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020100125400A
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English (en)
Korean (ko)
Inventor
유우이찌 도오끼
Original Assignee
도쿄엘렉트론가부시키가이샤
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Publication date
Application filed by 도쿄엘렉트론가부시키가이샤 filed Critical 도쿄엘렉트론가부시키가이샤
Publication of KR20110090753A publication Critical patent/KR20110090753A/ko
Withdrawn legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Program-controlled manipulators
    • B25J9/16—Program controls
    • B25J9/1628—Program controls characterised by the control loop
    • B25J9/1633—Program controls characterised by the control loop compliant, force, torque control, e.g. combined with position control
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Program-controlled manipulators
    • B25J9/16—Program controls
    • B25J9/1656—Program controls characterised by programming, planning systems for manipulators
    • B25J9/1664—Program controls characterised by programming, planning systems for manipulators characterised by motion, path, trajectory planning
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F7/00—Methods or arrangements for processing data by operating upon the order or content of the data handled
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • H10P72/0608—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0616—Monitoring of warpages, curvatures, damages, defects or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3402—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
KR1020100125400A 2010-02-04 2010-12-09 기판 반송 장치 및 기판 반송 방법과 기억 매체 Withdrawn KR20110090753A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010023502A JP5083339B2 (ja) 2010-02-04 2010-02-04 基板搬送装置及び基板搬送方法並びに記憶媒体
JPJP-P-2010-023502 2010-02-04

Publications (1)

Publication Number Publication Date
KR20110090753A true KR20110090753A (ko) 2011-08-10

Family

ID=44342330

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020100125400A Withdrawn KR20110090753A (ko) 2010-02-04 2010-12-09 기판 반송 장치 및 기판 반송 방법과 기억 매체

Country Status (5)

Country Link
US (1) US20110190927A1 (https=)
JP (1) JP5083339B2 (https=)
KR (1) KR20110090753A (https=)
CN (1) CN102163571A (https=)
TW (1) TW201133687A (https=)

Cited By (1)

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KR20140091366A (ko) * 2013-01-11 2014-07-21 삼성디스플레이 주식회사 기판 이송 장치 및 그 구동 방법

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JP5566669B2 (ja) * 2009-11-19 2014-08-06 昭和電工株式会社 インライン式成膜装置及び磁気記録媒体の製造方法
JP5609856B2 (ja) * 2011-12-20 2014-10-22 株式会社安川電機 搬送ロボット
CN102569142B (zh) * 2012-02-03 2017-04-26 上海华虹宏力半导体制造有限公司 硅片转移装置、转移托环、半导体工艺反应设备
JP5884624B2 (ja) * 2012-05-02 2016-03-15 東京エレクトロン株式会社 基板処理装置、調整方法及び記憶媒体
WO2014165406A1 (en) * 2013-04-01 2014-10-09 Brewer Science Inc. Apparatus and method for thin wafer transfer
JP6190692B2 (ja) * 2013-10-22 2017-08-30 日本電産サンキョー株式会社 産業用ロボット
KR102050149B1 (ko) * 2015-02-13 2019-11-28 가와사끼 쥬고교 가부시끼 가이샤 기판 반송 로봇 및 그것의 운전 방법
WO2016167706A1 (en) * 2015-04-13 2016-10-20 Brunkeberg Systems Ab A lifting jig for lifting elements along the fagade of a building
KR102093825B1 (ko) * 2015-12-30 2020-03-27 맷슨 테크놀로지, 인크. 밀리세컨드 어닐 시스템 내의 기판 지지체
JP6671993B2 (ja) 2016-02-01 2020-03-25 東京エレクトロン株式会社 基板受け渡し位置の教示方法及び基板処理システム
CN108780770B (zh) * 2016-03-04 2022-12-06 川崎重工业株式会社 基板搬送装置及基板搬送机器人的示教方法
JP2017183665A (ja) * 2016-03-31 2017-10-05 芝浦メカトロニクス株式会社 基板搬送装置、基板処理装置及び基板処理方法
US10115687B2 (en) * 2017-02-03 2018-10-30 Applied Materials, Inc. Method of pattern placement correction
JP6440757B2 (ja) * 2017-03-16 2018-12-19 キヤノン株式会社 基板搬送システム、リソグラフィ装置、および物品の製造方法
CN106826927B (zh) * 2017-03-28 2019-09-13 芯导精密(北京)设备有限公司 一种半导体机械手机架
CN110462809B (zh) * 2017-04-06 2023-07-25 东京毅力科创株式会社 基片处理装置和基片输送方法
TWI622777B (zh) * 2017-07-07 2018-05-01 Electronic component picking test classification equipment
CN109273391B (zh) * 2017-07-17 2021-10-26 台湾积体电路制造股份有限公司 晶圆传递模块及传递晶圆的方法
JP7064885B2 (ja) * 2018-01-05 2022-05-11 東京エレクトロン株式会社 基板把持機構、基板搬送装置及び基板処理システム
CN113169090B (zh) * 2018-12-03 2025-06-03 朗姆研究公司 销升降器测试衬底
CN114446843B (zh) * 2020-11-02 2025-05-27 上海华力集成电路制造有限公司 晶圆传送模块及其传送预传送的晶圆的方法
JP7607395B2 (ja) * 2020-12-09 2024-12-27 川崎重工業株式会社 基板搬送ロボット
KR102721980B1 (ko) 2022-02-24 2024-10-25 삼성전자주식회사 기판 정렬 장치 및 이를 이용한 기판 정렬 방법
JP2024035688A (ja) * 2022-09-02 2024-03-14 東京エレクトロン株式会社 基板処理装置、基板形状特定方法、搬送装置、及びエンドエフェクタ
KR102767876B1 (ko) * 2022-10-27 2025-02-19 세메스 주식회사 티칭 방법, 티칭 방법을 실행하는 매체에 저장된 프로그램 및 반송 시스템

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Publication number Priority date Publication date Assignee Title
KR20140091366A (ko) * 2013-01-11 2014-07-21 삼성디스플레이 주식회사 기판 이송 장치 및 그 구동 방법

Also Published As

Publication number Publication date
CN102163571A (zh) 2011-08-24
US20110190927A1 (en) 2011-08-04
JP5083339B2 (ja) 2012-11-28
JP2011161521A (ja) 2011-08-25
TW201133687A (en) 2011-10-01

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