TW201133687A - Substrate transfer apparatus, substrate transfer method and storage medium - Google Patents

Substrate transfer apparatus, substrate transfer method and storage medium Download PDF

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Publication number
TW201133687A
TW201133687A TW099142821A TW99142821A TW201133687A TW 201133687 A TW201133687 A TW 201133687A TW 099142821 A TW099142821 A TW 099142821A TW 99142821 A TW99142821 A TW 99142821A TW 201133687 A TW201133687 A TW 201133687A
Authority
TW
Taiwan
Prior art keywords
substrate
wafer
holding
strain
transfer
Prior art date
Application number
TW099142821A
Other languages
English (en)
Chinese (zh)
Inventor
Yuichi Douki
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW201133687A publication Critical patent/TW201133687A/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Program-controlled manipulators
    • B25J9/16—Program controls
    • B25J9/1628—Program controls characterised by the control loop
    • B25J9/1633—Program controls characterised by the control loop compliant, force, torque control, e.g. combined with position control
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Program-controlled manipulators
    • B25J9/16—Program controls
    • B25J9/1656—Program controls characterised by programming, planning systems for manipulators
    • B25J9/1664—Program controls characterised by programming, planning systems for manipulators characterised by motion, path, trajectory planning
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F7/00—Methods or arrangements for processing data by operating upon the order or content of the data handled
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • H10P72/0608—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0616—Monitoring of warpages, curvatures, damages, defects or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3402—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
TW099142821A 2010-02-04 2010-12-08 Substrate transfer apparatus, substrate transfer method and storage medium TW201133687A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010023502A JP5083339B2 (ja) 2010-02-04 2010-02-04 基板搬送装置及び基板搬送方法並びに記憶媒体

Publications (1)

Publication Number Publication Date
TW201133687A true TW201133687A (en) 2011-10-01

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
TW099142821A TW201133687A (en) 2010-02-04 2010-12-08 Substrate transfer apparatus, substrate transfer method and storage medium

Country Status (5)

Country Link
US (1) US20110190927A1 (https=)
JP (1) JP5083339B2 (https=)
KR (1) KR20110090753A (https=)
CN (1) CN102163571A (https=)
TW (1) TW201133687A (https=)

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TWI628733B (zh) * 2016-03-04 2018-07-01 川崎重工業股份有限公司 基板搬送裝置及基板搬送機器人之教示方法

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JP5609856B2 (ja) * 2011-12-20 2014-10-22 株式会社安川電機 搬送ロボット
CN102569142B (zh) * 2012-02-03 2017-04-26 上海华虹宏力半导体制造有限公司 硅片转移装置、转移托环、半导体工艺反应设备
JP5884624B2 (ja) * 2012-05-02 2016-03-15 東京エレクトロン株式会社 基板処理装置、調整方法及び記憶媒体
KR102098596B1 (ko) * 2013-01-11 2020-04-09 삼성디스플레이 주식회사 기판 이송 장치 및 그 구동 방법
WO2014165406A1 (en) * 2013-04-01 2014-10-09 Brewer Science Inc. Apparatus and method for thin wafer transfer
JP6190692B2 (ja) * 2013-10-22 2017-08-30 日本電産サンキョー株式会社 産業用ロボット
KR102050149B1 (ko) * 2015-02-13 2019-11-28 가와사끼 쥬고교 가부시끼 가이샤 기판 반송 로봇 및 그것의 운전 방법
WO2016167706A1 (en) * 2015-04-13 2016-10-20 Brunkeberg Systems Ab A lifting jig for lifting elements along the fagade of a building
KR102093825B1 (ko) * 2015-12-30 2020-03-27 맷슨 테크놀로지, 인크. 밀리세컨드 어닐 시스템 내의 기판 지지체
JP6671993B2 (ja) 2016-02-01 2020-03-25 東京エレクトロン株式会社 基板受け渡し位置の教示方法及び基板処理システム
JP2017183665A (ja) * 2016-03-31 2017-10-05 芝浦メカトロニクス株式会社 基板搬送装置、基板処理装置及び基板処理方法
US10115687B2 (en) * 2017-02-03 2018-10-30 Applied Materials, Inc. Method of pattern placement correction
JP6440757B2 (ja) * 2017-03-16 2018-12-19 キヤノン株式会社 基板搬送システム、リソグラフィ装置、および物品の製造方法
CN106826927B (zh) * 2017-03-28 2019-09-13 芯导精密(北京)设备有限公司 一种半导体机械手机架
CN110462809B (zh) * 2017-04-06 2023-07-25 东京毅力科创株式会社 基片处理装置和基片输送方法
TWI622777B (zh) * 2017-07-07 2018-05-01 Electronic component picking test classification equipment
CN109273391B (zh) * 2017-07-17 2021-10-26 台湾积体电路制造股份有限公司 晶圆传递模块及传递晶圆的方法
JP7064885B2 (ja) * 2018-01-05 2022-05-11 東京エレクトロン株式会社 基板把持機構、基板搬送装置及び基板処理システム
CN113169090B (zh) * 2018-12-03 2025-06-03 朗姆研究公司 销升降器测试衬底
CN114446843B (zh) * 2020-11-02 2025-05-27 上海华力集成电路制造有限公司 晶圆传送模块及其传送预传送的晶圆的方法
JP7607395B2 (ja) * 2020-12-09 2024-12-27 川崎重工業株式会社 基板搬送ロボット
KR102721980B1 (ko) 2022-02-24 2024-10-25 삼성전자주식회사 기판 정렬 장치 및 이를 이용한 기판 정렬 방법
JP2024035688A (ja) * 2022-09-02 2024-03-14 東京エレクトロン株式会社 基板処理装置、基板形状特定方法、搬送装置、及びエンドエフェクタ
KR102767876B1 (ko) * 2022-10-27 2025-02-19 세메스 주식회사 티칭 방법, 티칭 방법을 실행하는 매체에 저장된 프로그램 및 반송 시스템

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI628733B (zh) * 2016-03-04 2018-07-01 川崎重工業股份有限公司 基板搬送裝置及基板搬送機器人之教示方法

Also Published As

Publication number Publication date
CN102163571A (zh) 2011-08-24
US20110190927A1 (en) 2011-08-04
KR20110090753A (ko) 2011-08-10
JP5083339B2 (ja) 2012-11-28
JP2011161521A (ja) 2011-08-25

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