TW524965B - Flatness detecting method and device - Google Patents

Abstract

The present invention provides a flatness detecting method and device, which includes a base, an eddy current sensor, and a measuring arm. The measuring arm is arranged on the base. The eddy current sensor has a sensing head. The sensing head is arranged at the end edge of the measuring arm. The sensing head of the measuring arm first performs a sensitive standard measurement to a metal object. The sensitive standard status is taken as the base of standard for resetting the distance of the measuring arm. Then, the sensing head of the measuring arm performs a measurement on the plane of an object to be tested with a number of dots same as the sensitive standard status. The distance numbers obtained from measuring the number of dots on the plane to be tested by the measuring arm are compared, so as to achieve the effect of measuring the horizontal or vertical co-plane flatness status of the plane to be tested.

Description

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MK 90120834 V. Description of the invention (1) [Scope of the invention] This description relates to a kind of flatness inspection by setting an eddy current sensor on the measuring arm, :: and; f, especially a flatness and verticality. Flatness detection method = water of the relevant plane to be tested [Background of the invention] According to the recent years, due to the increasing demand for thin and short electronic products in the electronics-related industry, the importance of semiconductor manufacturing processes has become increasingly important. Before being jealous of the integrated circuit (ic) used for the integrated circuit base, the I-body wafer must be passed through such as diffusion, engraving, and within the rest of the time; =; the number of the engraving number, etc. Hundreds of processes, so ... use, two at, 4: two wafers (casfer bot or wafer) to carry wafers in mterbay storage cabinet workstations or wafers Cas ^ tte stations ^ Qrter) to move and transfer work, to advance the process in the production steps ... like wafer transfer box ΐ = Ϊ Ϊ a plurality of brackets arranged up and down, and each-layer relative to Γ Two wafers are called wafers. When a wafer is placed on the wafer transfer wafer with multiple layers, the level of the wafer and the distance between the wafers must be quite accurate. * Enter the wafer transfer box. During the operation, the wafer will be damaged if touched. Before the wafer transfer box is used, the bracket that supports the wafer must be two = level measurement to ensure that the level of the wafer is accurately and accurately after the wafer is placed = Choose to use. When the wafer transfer box is used for a period of time, it must be treated with / month β, that is, it is cleaned and dried, and the cleaned wafer transfer box is in the

Page 4 524965 Λ_η Revision No. 90120834 V. Description of the invention (2) _ When entering 2 uses, the level measurement must be repeated to ensure safety during the process. The wafer is processed, and the wafer transfer box is mainly measured by laser. The Dou will be flat A: transferred into the wafer μ, and dried for the wafer transfer; the head fulcrum is horizontally coplanar. Degree measurement. Of course, this; the second is how to develop-a kind closer to the wafer = the key direction of breakthrough. The wind fruit industry should work hard. [Overview of the invention] The main purpose of setting tf is to provide a flatness detection method and jealousy as columns: :: The distance of eddy currents generated by contact induction is used as the measurement standard, and then the same Measuring datum to a level to be measured? ： = Flatness detection, to achieve accurate detection of horizontal or vertical flatness = Measurement, for… = Second and second place is to provide-a kind of flatness detection method and equipment. The plane is an automatic measurer of water righteousness. And ten degrees ϊ ^ βΙΗ p. 5 524965

In order to further understand the purpose, technical features and other functions of the present invention, the detailed description with the illustrations is as follows: [Implementation Notes]

# 清 ί ^ The first and second figures are the first embodiment of the flatness detection method and device of the present invention, which includes a height gauge, eddy current sensor, 2 o, and circle detection sheet, 3 0 'This The height gauge 1 〇 includes a base 丨 丨, a support bar 丨 2, a slide base 13 and a turntable 1 4 ′, wherein the slide base 13 is pivotally arranged on the support bar 12 and is connected to the turntable 14, and the turntable 14 is borrowed. The slide 13 can be moved above and below the support 1 12 in the forward and reverse directions. The slide 13 is opposite to the turntable 14 and a height indicator 1 3 1 is provided on the other seat plate. It is provided with an on-off key, a zero key, a digital display window, etc. (not shown), and the slide base 13 is pivotally extended to protrude with a measuring arm 15 ′ and the free end of the measuring arm 15 is provided with a Combining hole 16; The eddy current sensing Is (Digital Displacement Sensor) 20 includes a sensing base 21, electrical leads 22, and a sensing head 23. The panel of the sensing base 21 is provided with digital display windows and control keys. The lead 22 is connected between the sensing base 21 and the sensing head 23 for transmission of signals. The sensing head 23 is arranged at the junction of the measuring arm 15 Hole 16 is used to perform eddy current sensing operation with the displacement of measuring arm 15; the wafer detection sheet 30 is coated with a metal film 3 1 on the wafer sheet (it can also be attached at an appropriate detection point) A metal diaphragm) to enable inductive measurement of metal materials corresponding to the sensor head 23, and the 30 series of the wafer detection sheet is placed on the brackets 101 on both sides of a wafer transfer box 100. Please refer to the third and fourth figures below. When the flatness detection method and device of the present invention are used to measure the horizontal coplanarity of a wafer, the south degree gauge 10 is first set as the reference for zeroing the distance, that is, by borrowing the measurement. Induction on the arm 1 5_head 2 3 in one

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The metal gauge 50 is used for sensing. Because the sensor is non-contact distance sensing, the signal can be transmitted back to the electric wire 22 by the magnetic field. The eddy current signal 23 is close to the metal reference gauge 50 hours. The number on the digital display window of the turntable 14 is gradually approaching ί3. When the number goes to zero (take 100,000 small animals, the feeling should be accurate and recorded, and then the height will be adjusted to 10 slide / Induced eddy current induction is 2 0, its induction reference and ▽ Todo people ’s gauge 10 distance 0 turntable 1 4 transfer box 100 near the wafer gauge 1 0 in the same way each measured height number box 1 0 0 The delivery box is in the state and level, and more in the present invention and the method, the surface measurement is measured. The entire measurement is performed on the test piece. 3 0 Slide 1 3 The measured crystal point is measured when it is the same as the word. The measurement is based on the measurement, and the measurement is carried out, and the film 30 is advanced into the base display window to distance the other measurement sensors from the wafer. When the wafer is set, the vertical plane is applied to the mold or other When the wafer sensing head is in the state of 2 or 3, the number is high. And the state shown in the wafer transfer is more precise when the wafer transfer box is inside the wafer transfer box. The height of the vertical co-planar vertical co-planar arm 15 with the same measuring principle is detected by the wafer to the sensor. Digital display circle detection sheet 3 0 Induction head 2 3 at that time means horizontal coplanarity but for crystal plane measurement. The operating condition of the arm 15 is to rotate the nine-head head 2 3 to a metal object. The distance A on the sensing head 21 of the sensing head 21 should be zeroed, that is, the zero setting measuring arm 15 is used for deep sensing. When the sensing of the quasi A shows a height measuring point (three points away from The reference test piece A of 30 is not used in the present invention. It can also be used to measure the number of metal planes on the wafer.

Case No. 90120834 _Year B. 5. Description of the invention (5) Referring to the fifth figure, it is the first embodiment of the flatness detection method and device of the present invention, which includes a main base 7 1, a support rod 7 2 and a measurement. Arm 7 3,. Hai host base 7 1 integrates the electronic control and sensing parts of the South metric gauge 10 and thirst current sensor 20, and has functions of calculation and instruction. It has a number display 7 7 and control. Key 7 1 2 'Of course, the main computer base 71 related to its electronic control, calculation and display and other device parts can also be set on a computer control mainframe to facilitate the overall automation of the control link; the support rod 72 is connected The main base 7 1 is provided with a pivoting device 7 2 1 at its proper position. The pivoting device 721 enables the support rod 72 to be operated horizontally and vertically. The measuring arm 7 3 pivot is not The support rod 72 can be moved upward, downward, and azimuthally. The support rod 72 is provided with a retractable structure to facilitate its access to the wafer transfer box 100, and the measurement arm 73 An end is provided with an induction head 731, and the induction head 73i is provided with an electric wire connected to the host base 7 丨. The height and induction of the measuring arm 73 and the sensing distance of the head 731 are displayed by the digital display window 711 of the mainframe 71, and the pivoting device 721, the lifting displacement of the measuring arm μ, swinging and telescopic operation It is protected by the control key 712 to achieve the effect of automatic detection. In addition, the measurement arm 73 can also be set on the support rod 72 in a supporting manner, so that the measurement of the Fu Zhao point can be performed at one time. a. Entering multiple planes to be measured. In summary, the present invention has indeed met the J patent application for invention patents. However, the above is only a copy of this: = Faculties who are familiar with the skills of this case rely on the invention of the present invention ^ ΐ K examples, modifications or changes should be covered in this book ^: God made etc. [Schematic symbols Explanation] Inside the journal. 524965 Case number 90120834_year _ ^ _ Θ_Amended

V. Description of the invention (6) 10 Altitude gauge 20 Eddy current sensor 30 Wafer detection sheet 11 Machine base 12 Support bar 13 Slide base 14 Turntable 131 Height display table 15 Measuring arm 16 Combining hole 21 Inductive base 22 Electrical lead 23 Inductive head 31 Metal film 100 Wafer transfer box 101 Bracket 71 Host base 72 Support rod 73 Measuring arm 711 Digital display window 712 Control key 721 Polar rotation device 731 Sensor head 524965 _Case No. 90120834_Year Month and Day__ Schematic description The first diagram is a schematic diagram of a first embodiment of the present invention. The second figure is a schematic view of placing a wafer inspection sheet of the present invention in a wafer transfer box. The third figure is a schematic diagram of the zero-setting reference setting of the present invention. The fourth figure is a schematic diagram of the detection operation of the present invention. The fifth diagram is a schematic view of a second embodiment of the present invention.

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Claims (1)

524965 _Case No. 90120834_ Amendment of the month of the year _ 6. The scope of patent application 1 · A flatness detection device, which mainly includes a machine base, an eddy current sensor and a measuring arm. The electrical head is connected to the eddy current sensor and the induction head. The measurement arm is provided on the machine base, and the induction head of the eddy current sensor is connected to the end of the measurement arm. 2 · The flatness detection device according to item 1 of the scope of patent application, wherein the eddy current sensor can be integrated in the machine base. 3. The flatness detection device as described in item 1 of the scope of patent application, wherein the machine base includes a height gauge. 4 · The flatness detection device according to item 1 of the scope of the patent application, wherein the base unit includes a support rod, which is used for the pivotal connection of the measurement arm, so that the measurement arm has a displacement function. 5. The flatness detecting device according to item 1 of the scope of patent application, wherein the machine base includes a turntable for pushing the displacement of the measuring arm. 6 · The flatness detection device according to item 1 of the scope of patent application, wherein the measuring arm is provided with a coupling hole at the end side for receiving the sensor head; 〇7 · As described in item 4 of the scope of patent application In the flatness detection device, a pivoting device is provided at an appropriate position of the support rod, and the pivoting device can enable the support rod to be placed horizontally and vertically. 8 The flatness detecting device according to item 4 of the scope of patent application, wherein the support rod has a telescopic structure. 9 The flatness detecting device according to item 1 of the scope of patent application, wherein the measuring arm is a plural set. ^ 24965 ^ i No. 9Q120R: U VI. Application scope of patent 1 〇 · As for the scope of patent application Ί, the plane is equipped with flatness detection device described by the right gold ... 11 12 13 14 15 16 The base is equipped with numbers & ten ^ by a main watch »table and control keys. For example, the number 2 of the base of the patent scope of claim 2; the sensing distance of the flatness detection head described in 10 items. The system can display the height of the measuring arm as described in the 7th in the scope of patent application. The fall protection of the base: the flatness detection described in item 8 above. The control key system can control the pivoting device and measure = ㈣ automation The efficacy of the test. Degree detection method, which is provided on a base with a culvert = !! and an end is connected with an eddy current sensor. The sensor head of "^ 测 1 #" is used to sense a metal object first, and the The sensing reference state is used as the reference for the distance i of the measuring arm, and then the sensing head on the measuring arm is measured at the same point as the measured object, and the ratio is measured on the measured plane. The measured distance number I is used to measure the water contention or vertical coplanarity of the plane to be measured. The flatness detection method described in item 13 of the patent application scope. The test object is on a plane to be measured. Objects with metal. The flatness detection method as described in item 13 of the scope of the patent application. The object to be measured is a wafer with metal hafnium once. The flatness inspection method as described in item 13 of the scope of the patent application. The object to be measured is a wafer with several gold shoulder films. ’Where the device, and the sensing device, the measuring arm ’s inductive reference measurement, the plane of the zero return to the measurement, and the state is obtained. , Where, where, where