CN102077291B - 基于电阻的存储器电路的受控值参考信号 - Google Patents

基于电阻的存储器电路的受控值参考信号 Download PDF

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Publication number
CN102077291B
CN102077291B CN200980124863.7A CN200980124863A CN102077291B CN 102077291 B CN102077291 B CN 102077291B CN 200980124863 A CN200980124863 A CN 200980124863A CN 102077291 B CN102077291 B CN 102077291B
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China
Prior art keywords
resistance
signal
mram
load
coupled
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CN200980124863.7A
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English (en)
Chinese (zh)
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CN102077291A (zh
Inventor
金圣克
金吉苏
宋哲焕
升·H·康
杨赛森
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Qualcomm Inc
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Qualcomm Inc
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    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/02—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
    • G11C11/16—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect
    • G11C11/165—Auxiliary circuits
    • G11C11/1673—Reading or sensing circuits or methods
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/02—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
    • G11C11/14—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using thin-film elements
    • G11C11/15—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using thin-film elements using multiple magnetic layers
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/0002—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/0002—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
    • G11C13/0021—Auxiliary circuits
    • G11C13/004—Reading or sensing circuits or methods
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C16/00—Erasable programmable read-only memories
    • G11C16/02—Erasable programmable read-only memories electrically programmable
    • G11C16/06—Auxiliary circuits, e.g. for writing into memory
    • G11C16/26—Sensing or reading circuits; Data output circuits
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C16/00—Erasable programmable read-only memories
    • G11C16/02—Erasable programmable read-only memories electrically programmable
    • G11C16/06—Auxiliary circuits, e.g. for writing into memory
    • G11C16/30—Power supply circuits
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C7/00—Arrangements for writing information into, or reading information out from, a digital store
    • G11C7/14—Dummy cell management; Sense reference voltage generators
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/0002—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
    • G11C13/0021—Auxiliary circuits
    • G11C13/004—Reading or sensing circuits or methods
    • G11C2013/0054—Read is performed on a reference element, e.g. cell, and the reference sensed value is used to compare the sensed value of the selected cell

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Mram Or Spin Memory Techniques (AREA)
  • Hall/Mr Elements (AREA)
  • Semiconductor Memories (AREA)
CN200980124863.7A 2008-06-30 2009-06-23 基于电阻的存储器电路的受控值参考信号 Active CN102077291B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/164,436 2008-06-30
US12/164,436 US7813166B2 (en) 2008-06-30 2008-06-30 Controlled value reference signal of resistance based memory circuit
PCT/US2009/048301 WO2010002637A1 (en) 2008-06-30 2009-06-23 Controlled value reference signal of resistance based memory circuit

Publications (2)

Publication Number Publication Date
CN102077291A CN102077291A (zh) 2011-05-25
CN102077291B true CN102077291B (zh) 2014-08-06

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CN200980124863.7A Active CN102077291B (zh) 2008-06-30 2009-06-23 基于电阻的存储器电路的受控值参考信号

Country Status (7)

Country Link
US (1) US7813166B2 (ja)
EP (2) EP2311038B1 (ja)
JP (2) JP5579712B2 (ja)
KR (1) KR101294573B1 (ja)
CN (1) CN102077291B (ja)
TW (1) TW201007731A (ja)
WO (1) WO2010002637A1 (ja)

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US7787282B2 (en) * 2008-03-21 2010-08-31 Micron Technology, Inc. Sensing resistance variable memory
JP2010049751A (ja) * 2008-08-22 2010-03-04 Toshiba Corp 抵抗変化型メモリ
US8154903B2 (en) * 2009-06-17 2012-04-10 Qualcomm Incorporated Split path sensing circuit
US8335101B2 (en) * 2010-01-21 2012-12-18 Qualcomm Incorporated Resistance-based memory with reduced voltage input/output device
US8254195B2 (en) * 2010-06-01 2012-08-28 Qualcomm Incorporated High-speed sensing for resistive memories
CN102859604B (zh) * 2011-04-13 2014-10-15 松下电器产业株式会社 参考单元电路及使用该电路的可变电阻型非易失性存储装置
US8665638B2 (en) * 2011-07-11 2014-03-04 Qualcomm Incorporated MRAM sensing with magnetically annealed reference cell
KR20140047732A (ko) 2011-08-26 2014-04-22 휴렛-팩커드 디벨롭먼트 컴퍼니, 엘.피. 어레이에서의 저항성 스위칭 소자를 판독하기 위한 회로 및 그 방법
US8902641B2 (en) * 2012-04-10 2014-12-02 Taiwan Semiconductor Manufacturing Co., Ltd. Adjusting reference resistances in determining MRAM resistance states
US9159381B2 (en) * 2012-05-04 2015-10-13 Qualcomm Incorporated Tunable reference circuit
US9082509B2 (en) * 2012-12-19 2015-07-14 Intel Corporation Method and apparatus for reading variable resistance memory elements
US9070441B2 (en) * 2012-12-21 2015-06-30 Sony Corporation Non-volatile memory system with reset verification mechanism and method of operation thereof
KR102024523B1 (ko) 2012-12-26 2019-09-24 삼성전자 주식회사 저항체를 이용한 비휘발성 메모리 장치 및 그 구동 방법
KR101470520B1 (ko) * 2013-02-12 2014-12-08 성균관대학교산학협력단 반도체 메모리 장치, 독출 방법 및 시스템
US9165629B2 (en) * 2013-03-12 2015-10-20 Taiwan Semiconductor Manufacturing Co., Ltd. Method and apparatus for MRAM sense reference trimming
US9153307B2 (en) * 2013-09-09 2015-10-06 Qualcomm Incorporated System and method to provide a reference cell
KR102111510B1 (ko) * 2014-04-10 2020-05-19 에스케이하이닉스 주식회사 전자 장치
KR102354350B1 (ko) 2015-05-18 2022-01-21 삼성전자주식회사 메모리 장치 및 이를 포함하는 메모리 시스템
WO2017176217A1 (en) * 2016-04-07 2017-10-12 Agency For Science, Technology And Research Circuit arrangement, memory column, memory array, and method of forming the same
US10319423B2 (en) * 2016-11-28 2019-06-11 Taiwan Semiconductor Manufacturing Company Limited Memory device with a low-current reference circuit
JP2018147533A (ja) * 2017-03-03 2018-09-20 ソニーセミコンダクタソリューションズ株式会社 半導体記憶装置、情報処理装置及びリファレンス電位設定方法
US10431278B2 (en) * 2017-08-14 2019-10-01 Qualcomm Incorporated Dynamically controlling voltage for access operations to magneto-resistive random access memory (MRAM) bit cells to account for ambient temperature
KR102384161B1 (ko) 2017-08-24 2022-04-08 삼성전자주식회사 비트 라인 누설 전류에 의한 읽기 페일을 방지하도록 구성되는 메모리 장치 및 그 동작 방법
US10854289B2 (en) 2018-05-14 2020-12-01 Samsung Electronics Co., Ltd. Resistive memory device providing reference calibration, and operating method thereof
TWI676933B (zh) * 2018-07-05 2019-11-11 慧榮科技股份有限公司 韌體更新方法
US11211107B1 (en) * 2020-09-01 2021-12-28 Avalanche Technology, Inc. Magnetic memory read circuit and calibration method therefor
CN115867969A (zh) * 2020-11-20 2023-03-28 华为技术有限公司 一种存储数据读取电路及存储器

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CN1319846A (zh) * 2000-02-04 2001-10-31 惠普公司 包括差分检测放大器的mram设备

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JP5019681B2 (ja) * 2001-04-26 2012-09-05 ルネサスエレクトロニクス株式会社 薄膜磁性体記憶装置
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JP5676842B2 (ja) * 2008-05-30 2015-02-25 ピーエスフォー ルクスコ エスエイアールエルＰＳ４ Ｌｕｘｃｏ Ｓ．ａ．ｒ．ｌ． 半導体装置

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CN1319846A (zh) * 2000-02-04 2001-10-31 惠普公司 包括差分检测放大器的mram设备

Also Published As

Publication number Publication date
JP2013239229A (ja) 2013-11-28
US20090323405A1 (en) 2009-12-31
EP2311038A1 (en) 2011-04-20
JP5579712B2 (ja) 2014-08-27
US7813166B2 (en) 2010-10-12
EP2515305B1 (en) 2016-01-06
JP5619963B2 (ja) 2014-11-05
KR101294573B1 (ko) 2013-08-07
KR20110025700A (ko) 2011-03-10
TW201007731A (en) 2010-02-16
JP2011527066A (ja) 2011-10-20
WO2010002637A1 (en) 2010-01-07
EP2515305A1 (en) 2012-10-24
CN102077291A (zh) 2011-05-25
EP2311038B1 (en) 2012-10-03

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