CN102034727B - 基板处理装置 - Google Patents
基板处理装置 Download PDFInfo
- Publication number
- CN102034727B CN102034727B CN201010501399.3A CN201010501399A CN102034727B CN 102034727 B CN102034727 B CN 102034727B CN 201010501399 A CN201010501399 A CN 201010501399A CN 102034727 B CN102034727 B CN 102034727B
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- CN
- China
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- mentioned
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- platform
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000012545 processing Methods 0.000 title claims abstract description 212
- 239000000758 substrate Substances 0.000 title claims abstract description 154
- 230000007246 mechanism Effects 0.000 claims abstract description 145
- 238000011282 treatment Methods 0.000 claims description 400
- 238000005304 joining Methods 0.000 claims description 4
- 238000012546 transfer Methods 0.000 abstract description 6
- 235000012431 wafers Nutrition 0.000 description 235
- 239000007788 liquid Substances 0.000 description 167
- 238000000034 method Methods 0.000 description 36
- 230000008569 process Effects 0.000 description 33
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 30
- 239000000243 solution Substances 0.000 description 8
- 229910021641 deionized water Inorganic materials 0.000 description 7
- 230000000694 effects Effects 0.000 description 7
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 6
- 239000012530 fluid Substances 0.000 description 6
- 238000013459 approach Methods 0.000 description 5
- 230000000452 restraining effect Effects 0.000 description 5
- 238000003860 storage Methods 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- 238000011010 flushing procedure Methods 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 229960002050 hydrofluoric acid Drugs 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 239000008367 deionised water Substances 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- FFUAGWLWBBFQJT-UHFFFAOYSA-N hexamethyldisilazane Chemical compound C[Si](C)(C)N[Si](C)(C)C FFUAGWLWBBFQJT-UHFFFAOYSA-N 0.000 description 2
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000010790 dilution Methods 0.000 description 1
- 239000012895 dilution Substances 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 238000010079 rubber tapping Methods 0.000 description 1
- 238000009987 spinning Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67184—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the presence of more than one transfer chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67178—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers vertical arrangement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/53313—Means to interrelatedly feed plural work parts from plural sources without manual intervention
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/53313—Means to interrelatedly feed plural work parts from plural sources without manual intervention
- Y10T29/53365—Multiple station assembly apparatus
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/534—Multiple station assembly or disassembly apparatus
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009232769 | 2009-10-06 | ||
| JP2009-232769 | 2009-10-06 | ||
| JP2010-180921 | 2010-08-12 | ||
| JP2010180921A JP5736687B2 (ja) | 2009-10-06 | 2010-08-12 | 基板処理装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102034727A CN102034727A (zh) | 2011-04-27 |
| CN102034727B true CN102034727B (zh) | 2014-07-09 |
Family
ID=43822051
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201010501399.3A Active CN102034727B (zh) | 2009-10-06 | 2010-09-29 | 基板处理装置 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US8443513B2 (enExample) |
| JP (1) | JP5736687B2 (enExample) |
| KR (1) | KR101590648B1 (enExample) |
| CN (1) | CN102034727B (enExample) |
| TW (1) | TWI467686B (enExample) |
Families Citing this family (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5006122B2 (ja) | 2007-06-29 | 2012-08-22 | 株式会社Ｓｏｋｕｄｏ | 基板処理装置 |
| JP5160204B2 (ja) * | 2007-11-30 | 2013-03-13 | 株式会社Ｓｏｋｕｄｏ | 基板処理装置 |
| JP5128918B2 (ja) * | 2007-11-30 | 2013-01-23 | 株式会社Ｓｏｋｕｄｏ | 基板処理装置 |
| JP5001828B2 (ja) | 2007-12-28 | 2012-08-15 | 株式会社Ｓｏｋｕｄｏ | 基板処理装置 |
| JP5179170B2 (ja) | 2007-12-28 | 2013-04-10 | 株式会社Ｓｏｋｕｄｏ | 基板処理装置 |
| KR20110050558A (ko) * | 2008-10-07 | 2011-05-13 | 가와사키 쥬코교 가부시키가이샤 | 기판 반송 로봇 및 시스템 |
| JP6006643B2 (ja) * | 2011-01-20 | 2016-10-12 | 東京エレクトロン株式会社 | 真空処理装置 |
| US9153464B2 (en) * | 2011-05-31 | 2015-10-06 | Semes Co., Ltd. | Substrate processing apparatus and substrate processing method |
| JP2013033963A (ja) * | 2011-07-29 | 2013-02-14 | Semes Co Ltd | 基板処理装置及び基板処理方法 |
| CN106373911B (zh) * | 2011-09-22 | 2019-04-09 | 东京毅力科创株式会社 | 基板处理装置及基板处理方法 |
| US9048271B2 (en) | 2011-09-29 | 2015-06-02 | Asm International N.V. | Modular semiconductor processing system |
| JP6058999B2 (ja) | 2012-12-11 | 2017-01-11 | 株式会社Ｓｃｒｅｅｎセミコンダクターソリューションズ | 基板処理装置および基板処理方法 |
| KR101527901B1 (ko) * | 2013-10-10 | 2015-06-10 | 피에스케이 주식회사 | 기판 처리 장치 및 기판 반송 방법 |
| US10236196B2 (en) * | 2013-11-14 | 2019-03-19 | Tokyo Electron Limited | Substrate processing system |
| JP5977728B2 (ja) * | 2013-11-14 | 2016-08-24 | 東京エレクトロン株式会社 | 基板処理システム |
| JP5977729B2 (ja) * | 2013-11-14 | 2016-08-24 | 東京エレクトロン株式会社 | 基板処理システム |
| DK178352B1 (da) * | 2015-02-27 | 2016-01-04 | Intelligent Systems As | Transport- og lagersystem til servicering af et antal behandlings og plejeområder på et hospital, samt fremgangsmåde til drift heraf. |
| JP6292155B2 (ja) * | 2015-03-19 | 2018-03-14 | 東京エレクトロン株式会社 | 基板処理装置、基板処理方法及び記憶媒体 |
| KR102478317B1 (ko) * | 2015-04-08 | 2022-12-16 | 도쿄엘렉트론가부시키가이샤 | 기판 처리 시스템 |
| KR102168381B1 (ko) * | 2018-06-07 | 2020-10-21 | 세메스 주식회사 | 기판 처리 방법 및 기판 처리 장치 |
| US12276027B2 (en) * | 2019-03-28 | 2025-04-15 | Tokyo Electron Limited | Substrate processing apparatus and substrate processing method |
| JP7718161B2 (ja) * | 2021-08-17 | 2025-08-05 | 東京エレクトロン株式会社 | 基板処理装置及び基板処理方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6377329B1 (en) * | 1999-05-24 | 2002-04-23 | Tokyo Electron Limited | Substrate processing apparatus |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3442669B2 (ja) * | 1998-10-20 | 2003-09-02 | 東京エレクトロン株式会社 | 基板処理装置 |
| JP4381909B2 (ja) * | 2004-07-06 | 2009-12-09 | 大日本スクリーン製造株式会社 | 基板処理装置および基板処理方法 |
| JP4685584B2 (ja) * | 2005-03-11 | 2011-05-18 | 東京エレクトロン株式会社 | 塗布、現像装置 |
| JP4816217B2 (ja) * | 2006-04-14 | 2011-11-16 | 東京エレクトロン株式会社 | 塗布、現像装置、塗布、現像方法及び記憶媒体 |
| JP4767783B2 (ja) | 2006-07-26 | 2011-09-07 | 東京エレクトロン株式会社 | 液処理装置 |
| JP4687682B2 (ja) * | 2007-03-30 | 2011-05-25 | 東京エレクトロン株式会社 | 塗布、現像装置及びその方法並びに記憶媒体 |
| TW200919117A (en) * | 2007-08-28 | 2009-05-01 | Tokyo Electron Ltd | Coating-developing apparatus, coating-developing method and storage medium |
| JP5362232B2 (ja) * | 2008-02-13 | 2013-12-11 | 大日本スクリーン製造株式会社 | 基板処理装置 |
| JP5050018B2 (ja) * | 2009-08-24 | 2012-10-17 | 東京エレクトロン株式会社 | 塗布現像装置及び塗布現像方法 |
-
2010
- 2010-08-12 JP JP2010180921A patent/JP5736687B2/ja active Active
- 2010-09-29 CN CN201010501399.3A patent/CN102034727B/zh active Active
- 2010-09-30 US US12/895,576 patent/US8443513B2/en not_active Expired - Fee Related
- 2010-09-30 KR KR1020100095308A patent/KR101590648B1/ko active Active
- 2010-10-04 TW TW99133727A patent/TWI467686B/zh active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6377329B1 (en) * | 1999-05-24 | 2002-04-23 | Tokyo Electron Limited | Substrate processing apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102034727A (zh) | 2011-04-27 |
| TWI467686B (zh) | 2015-01-01 |
| JP2011100970A (ja) | 2011-05-19 |
| US20110078898A1 (en) | 2011-04-07 |
| JP5736687B2 (ja) | 2015-06-17 |
| TW201133682A (en) | 2011-10-01 |
| US8443513B2 (en) | 2013-05-21 |
| KR20110037865A (ko) | 2011-04-13 |
| KR101590648B1 (ko) | 2016-02-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |