TWI467686B - 基板處理裝置 - Google Patents

基板處理裝置 Download PDF

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Publication number
TWI467686B
TWI467686B TW99133727A TW99133727A TWI467686B TW I467686 B TWI467686 B TW I467686B TW 99133727 A TW99133727 A TW 99133727A TW 99133727 A TW99133727 A TW 99133727A TW I467686 B TWI467686 B TW I467686B
Authority
TW
Taiwan
Prior art keywords
processing
substrate
processing block
block
transfer
Prior art date
Application number
TW99133727A
Other languages
English (en)
Chinese (zh)
Other versions
TW201133682A (en
Inventor
石田省貴
齊藤幸良
Original Assignee
東京威力科創股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 東京威力科創股份有限公司 filed Critical 東京威力科創股份有限公司
Publication of TW201133682A publication Critical patent/TW201133682A/zh
Application granted granted Critical
Publication of TWI467686B publication Critical patent/TWI467686B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0461—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the presence of two or more transfer chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H10P72/0456—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers in-line arrangement
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H10P72/0458—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers vertical arrangement
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53313—Means to interrelatedly feed plural work parts from plural sources without manual intervention
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53313—Means to interrelatedly feed plural work parts from plural sources without manual intervention
    • Y10T29/53365—Multiple station assembly apparatus
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/534—Multiple station assembly or disassembly apparatus

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
TW99133727A 2009-10-06 2010-10-04 基板處理裝置 TWI467686B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009232769 2009-10-06
JP2010180921A JP5736687B2 (ja) 2009-10-06 2010-08-12 基板処理装置

Publications (2)

Publication Number Publication Date
TW201133682A TW201133682A (en) 2011-10-01
TWI467686B true TWI467686B (zh) 2015-01-01

Family

ID=43822051

Family Applications (1)

Application Number Title Priority Date Filing Date
TW99133727A TWI467686B (zh) 2009-10-06 2010-10-04 基板處理裝置

Country Status (5)

Country Link
US (1) US8443513B2 (enExample)
JP (1) JP5736687B2 (enExample)
KR (1) KR101590648B1 (enExample)
CN (1) CN102034727B (enExample)
TW (1) TWI467686B (enExample)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5006122B2 (ja) * 2007-06-29 2012-08-22 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP5160204B2 (ja) * 2007-11-30 2013-03-13 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP5128918B2 (ja) * 2007-11-30 2013-01-23 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP5001828B2 (ja) 2007-12-28 2012-08-15 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP5179170B2 (ja) 2007-12-28 2013-04-10 株式会社Ｓｏｋｕｄｏ 基板処理装置
WO2010041562A1 (ja) * 2008-10-07 2010-04-15 川崎重工業株式会社 基板搬送ロボットおよびシステム
WO2012098871A1 (ja) * 2011-01-20 2012-07-26 東京エレクトロン株式会社 真空処理装置
US9153464B2 (en) 2011-05-31 2015-10-06 Semes Co., Ltd. Substrate processing apparatus and substrate processing method
JP2013033963A (ja) * 2011-07-29 2013-02-14 Semes Co Ltd 基板処理装置及び基板処理方法
CN103021906B (zh) * 2011-09-22 2016-10-05 东京毅力科创株式会社 基板处理装置及基板处理方法
US9048271B2 (en) 2011-09-29 2015-06-02 Asm International N.V. Modular semiconductor processing system
JP6058999B2 (ja) * 2012-12-11 2017-01-11 株式会社Ｓｃｒｅｅｎセミコンダクターソリューションズ 基板処理装置および基板処理方法
KR101527901B1 (ko) * 2013-10-10 2015-06-10 피에스케이 주식회사 기판 처리 장치 및 기판 반송 방법
US10236196B2 (en) * 2013-11-14 2019-03-19 Tokyo Electron Limited Substrate processing system
JP5977729B2 (ja) * 2013-11-14 2016-08-24 東京エレクトロン株式会社 基板処理システム
JP5977728B2 (ja) * 2013-11-14 2016-08-24 東京エレクトロン株式会社 基板処理システム
DK178352B1 (da) * 2015-02-27 2016-01-04 Intelligent Systems As Transport- og lagersystem til servicering af et antal behandlings og plejeområder på et hospital, samt fremgangsmåde til drift heraf.
JP6292155B2 (ja) * 2015-03-19 2018-03-14 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記憶媒体
KR102478317B1 (ko) * 2015-04-08 2022-12-16 도쿄엘렉트론가부시키가이샤 기판 처리 시스템
KR102168381B1 (ko) * 2018-06-07 2020-10-21 세메스 주식회사 기판 처리 방법 및 기판 처리 장치
KR102798725B1 (ko) * 2019-03-28 2025-04-23 도쿄엘렉트론가부시키가이샤 기판 처리 장치 및 기판 처리 방법
JP7718161B2 (ja) * 2021-08-17 2025-08-05 東京エレクトロン株式会社 基板処理装置及び基板処理方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6377329B1 (en) * 1999-05-24 2002-04-23 Tokyo Electron Limited Substrate processing apparatus
US20060024446A1 (en) * 2004-07-06 2006-02-02 Dainippon Screen Mfg. Co., Ltd. Substrate processing apparatus and substrate processing method

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3442669B2 (ja) * 1998-10-20 2003-09-02 東京エレクトロン株式会社 基板処理装置
JP4685584B2 (ja) * 2005-03-11 2011-05-18 東京エレクトロン株式会社 塗布、現像装置
JP4816217B2 (ja) * 2006-04-14 2011-11-16 東京エレクトロン株式会社 塗布、現像装置、塗布、現像方法及び記憶媒体
JP4767783B2 (ja) 2006-07-26 2011-09-07 東京エレクトロン株式会社 液処理装置
JP4687682B2 (ja) * 2007-03-30 2011-05-25 東京エレクトロン株式会社 塗布、現像装置及びその方法並びに記憶媒体
TW200919117A (en) * 2007-08-28 2009-05-01 Tokyo Electron Ltd Coating-developing apparatus, coating-developing method and storage medium
JP5362232B2 (ja) * 2008-02-13 2013-12-11 大日本スクリーン製造株式会社 基板処理装置
JP5050018B2 (ja) * 2009-08-24 2012-10-17 東京エレクトロン株式会社 塗布現像装置及び塗布現像方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6377329B1 (en) * 1999-05-24 2002-04-23 Tokyo Electron Limited Substrate processing apparatus
US20060024446A1 (en) * 2004-07-06 2006-02-02 Dainippon Screen Mfg. Co., Ltd. Substrate processing apparatus and substrate processing method

Also Published As

Publication number Publication date
CN102034727B (zh) 2014-07-09
TW201133682A (en) 2011-10-01
JP5736687B2 (ja) 2015-06-17
JP2011100970A (ja) 2011-05-19
US8443513B2 (en) 2013-05-21
KR101590648B1 (ko) 2016-02-01
US20110078898A1 (en) 2011-04-07
CN102034727A (zh) 2011-04-27
KR20110037865A (ko) 2011-04-13

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