CN102027591B - 半导体模块、半导体模块的制造方法及便携式设备 - Google Patents

半导体模块、半导体模块的制造方法及便携式设备 Download PDF

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Publication number
CN102027591B
CN102027591B CN2009801172074A CN200980117207A CN102027591B CN 102027591 B CN102027591 B CN 102027591B CN 2009801172074 A CN2009801172074 A CN 2009801172074A CN 200980117207 A CN200980117207 A CN 200980117207A CN 102027591 B CN102027591 B CN 102027591B
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resin layer
insulating resin
semiconductor
electrode
layer
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CN102027591A (zh
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臼井良辅
井上恭典
中里真弓
伊藤克实
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Sanyo Electric Co Ltd
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Sanyo Electric Co Ltd
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    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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