CN102012634A - 感光性树脂组合物,感光性元件,光致抗蚀图形的形成方法及印刷电路板的制造方法 - Google Patents

感光性树脂组合物,感光性元件,光致抗蚀图形的形成方法及印刷电路板的制造方法 Download PDF

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Publication number
CN102012634A
CN102012634A CN2010105396454A CN201010539645A CN102012634A CN 102012634 A CN102012634 A CN 102012634A CN 2010105396454 A CN2010105396454 A CN 2010105396454A CN 201010539645 A CN201010539645 A CN 201010539645A CN 102012634 A CN102012634 A CN 102012634A
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polymer combination
photosensitive polymer
composition
phenyl
photographic layer
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Pending
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CN2010105396454A
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English (en)
Chinese (zh)
Inventor
宫坂昌宏
熊木尚
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Resonac Corp
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Hitachi Chemical Co Ltd
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Priority claimed from JP2006105416A external-priority patent/JP4525626B2/ja
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of CN102012634A publication Critical patent/CN102012634A/zh
Pending legal-status Critical Current

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055—Radiation sensitive composition or product or process of making
    • Y10S430/106—Binder containing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055—Radiation sensitive composition or product or process of making
    • Y10S430/114—Initiator containing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055—Radiation sensitive composition or product or process of making
    • Y10S430/114—Initiator containing
    • Y10S430/116—Redox or dye sensitizer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055—Radiation sensitive composition or product or process of making
    • Y10S430/114—Initiator containing
    • Y10S430/12—Nitrogen compound containing
    • Y10S430/121—Nitrogen in heterocyclic ring
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/146—Laser beam

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  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Medicinal Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Materials For Photolithography (AREA)
  • Polymerisation Methods In General (AREA)
  • Graft Or Block Polymers (AREA)
CN2010105396454A 2005-05-23 2006-05-22 感光性树脂组合物,感光性元件,光致抗蚀图形的形成方法及印刷电路板的制造方法 Pending CN102012634A (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2005150133 2005-05-23
JP2005-150133 2005-05-23
JP2006-105416 2006-04-06
JP2006105416A JP4525626B2 (ja) 2006-04-06 2006-04-06 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法

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CN2010105396454A Pending CN102012634A (zh) 2005-05-23 2006-05-22 感光性树脂组合物,感光性元件,光致抗蚀图形的形成方法及印刷电路板的制造方法
CN201410381648.8A Expired - Fee Related CN104133343B (zh) 2005-05-23 2006-05-22 感光性树脂组合物，感光性元件，光致抗蚀图形的形成方法及印刷电路板的制造方法
CNA200680017652XA Pending CN101180578A (zh) 2005-05-23 2006-05-22 感光性树脂组合物，感光性元件，光致抗蚀图形的形成方法及印刷电路板的制造方法
CN201410381347.5A Active CN104111583B (zh) 2005-05-23 2006-05-22 感光性树脂组合物，感光性元件，光致抗蚀图形的形成方法及印刷电路板的制造方法
CN201410381593.0A Active CN104133342B (zh) 2005-05-23 2006-05-22 感光性树脂组合物，感光性元件，光致抗蚀图形的形成方法及印刷电路板的制造方法

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CNA200680017652XA Pending CN101180578A (zh) 2005-05-23 2006-05-22 感光性树脂组合物，感光性元件，光致抗蚀图形的形成方法及印刷电路板的制造方法
CN201410381347.5A Active CN104111583B (zh) 2005-05-23 2006-05-22 感光性树脂组合物，感光性元件，光致抗蚀图形的形成方法及印刷电路板的制造方法
CN201410381593.0A Active CN104133342B (zh) 2005-05-23 2006-05-22 感光性树脂组合物，感光性元件，光致抗蚀图形的形成方法及印刷电路板的制造方法

Country Status (6)

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US (3) US7993809B2 (enExample)
KR (4) KR100934046B1 (enExample)
CN (5) CN102012634A (enExample)
SG (1) SG160355A1 (enExample)
TW (2) TW200702916A (enExample)
WO (1) WO2006126480A1 (enExample)

Cited By (2)

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Publication number Priority date Publication date Assignee Title
CN103988154A (zh) * 2011-12-05 2014-08-13 日立化成株式会社 树脂固化膜图案的形成方法、感光性树脂组合物、感光性元件、触摸面板的制造方法及树脂固化膜
US10042254B2 (en) 2011-12-05 2018-08-07 Hitachi Chemical Company, Ltd. Method of forming protective film for touch panel electrode photosensitive resin composition and photosensitive element, and method of manufacturing touch panel

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JP4586919B2 (ja) * 2006-04-18 2010-11-24 日立化成工業株式会社 感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
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CN101978321B (zh) * 2008-03-21 2013-06-12 旭化成电子材料株式会社 感光性树脂组合物、感光性树脂层压体、抗蚀图案形成方法、以及印刷线路板、引线框、半导体封装体和凹凸基板的制造方法
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CN103543608A (zh) * 2009-02-26 2014-01-29 日立化成工业株式会社 感光性树脂组合物、以及使用了该组合物的感光性元件、抗蚀剂图案的形成方法和印刷线路板的制造方法
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JP6229256B2 (ja) * 2011-10-31 2017-11-15 日立化成株式会社 感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
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KR102582577B1 (ko) * 2014-05-23 2023-09-25 가부시끼가이샤 레조낙 레지스트 패턴의 형성 방법, 프린트 배선판의 제조 방법, 투영 노광용 감광성 수지 조성물 및 감광성 엘리먼트
WO2016184429A1 (zh) * 2015-05-21 2016-11-24 常州强力先端电子材料有限公司 吡唑啉类增感剂及其制备方法和应用
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KR20220084015A (ko) * 2019-10-16 2022-06-21 쇼와덴코머티리얼즈가부시끼가이샤 감광성 수지 필름, 레지스트 패턴의 형성 방법, 및 배선 패턴의 형성 방법
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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103988154A (zh) * 2011-12-05 2014-08-13 日立化成株式会社 树脂固化膜图案的形成方法、感光性树脂组合物、感光性元件、触摸面板的制造方法及树脂固化膜
CN103988154B (zh) * 2011-12-05 2017-07-11 日立化成株式会社 树脂固化膜图案的形成方法、感光性树脂组合物、感光性元件、触摸面板的制造方法及树脂固化膜
US9964849B2 (en) 2011-12-05 2018-05-08 Hitachi Chemical Company, Ltd. Method for forming resin cured film pattern, photosensitive resin composition, photosensitive element, method for producing touch panel, and resin cured film
US10042254B2 (en) 2011-12-05 2018-08-07 Hitachi Chemical Company, Ltd. Method of forming protective film for touch panel electrode photosensitive resin composition and photosensitive element, and method of manufacturing touch panel
US10386719B2 (en) 2011-12-05 2019-08-20 Hitachi Chemical Company, Ltd. Method for forming resin cured film pattern, photosensitive resin composition, photosensitive element, method for producing touch panel, and resin cured film
US10663861B2 (en) 2011-12-05 2020-05-26 Hitachi Chemical Company, Ltd. Method for forming resin cured film pattern, photosensitive resin composition, photosensitive element, method for producing touch panel, and resin cured film

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Publication number Publication date
CN104133343B (zh) 2016-11-16
CN104133342B (zh) 2018-01-23
CN104111583A (zh) 2014-10-22
CN104111583B (zh) 2019-01-01
WO2006126480A1 (ja) 2006-11-30
CN104133343A (zh) 2014-11-05
TW200702916A (en) 2007-01-16
KR100932581B1 (ko) 2009-12-17
TW201100961A (en) 2011-01-01
KR20070110937A (ko) 2007-11-20
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