TW200702916A - Photosensitive resin composition, photosensitive element, method for forming resist pattern and method for producing printed wiring board - Google Patents
Photosensitive resin composition, photosensitive element, method for forming resist pattern and method for producing printed wiring boardInfo
- Publication number
- TW200702916A TW200702916A TW095118300A TW95118300A TW200702916A TW 200702916 A TW200702916 A TW 200702916A TW 095118300 A TW095118300 A TW 095118300A TW 95118300 A TW95118300 A TW 95118300A TW 200702916 A TW200702916 A TW 200702916A
- Authority
- TW
- Taiwan
- Prior art keywords
- resin composition
- wiring board
- printed wiring
- resist pattern
- photosensitive resin
- Prior art date
Links
- 239000011342 resin composition Substances 0.000 title abstract 2
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- 125000004432 carbon atom Chemical group C* 0.000 abstract 2
- 150000001875 compounds Chemical class 0.000 abstract 2
- 125000003545 alkoxy group Chemical group 0.000 abstract 1
- 125000000217 alkyl group Chemical group 0.000 abstract 1
- 239000011230 binding agent Substances 0.000 abstract 1
- 229920000642 polymer Polymers 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/46—Polymerisation initiated by wave energy or particle radiation
- C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
- C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
- G03F7/031—Organic compounds not covered by group G03F7/029
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
- Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
- Y10S430/1055—Radiation sensitive composition or product or process of making
- Y10S430/106—Binder containing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
- Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
- Y10S430/1055—Radiation sensitive composition or product or process of making
- Y10S430/114—Initiator containing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
- Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
- Y10S430/1055—Radiation sensitive composition or product or process of making
- Y10S430/114—Initiator containing
- Y10S430/116—Redox or dye sensitizer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
- Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
- Y10S430/1055—Radiation sensitive composition or product or process of making
- Y10S430/114—Initiator containing
- Y10S430/12—Nitrogen compound containing
- Y10S430/121—Nitrogen in heterocyclic ring
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
- Y10S430/146—Laser beam
Landscapes
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Medicinal Chemistry (AREA)
- Organic Chemistry (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Materials For Photolithography (AREA)
- Polymerisation Methods In General (AREA)
- Graft Or Block Polymers (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005150133 | 2005-05-23 | ||
| JP2006105416A JP4525626B2 (ja) | 2006-04-06 | 2006-04-06 | 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200702916A true TW200702916A (en) | 2007-01-16 |
| TWI334965B TWI334965B (enExample) | 2010-12-21 |
Family
ID=37451906
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW095118300A TW200702916A (en) | 2005-05-23 | 2006-05-23 | Photosensitive resin composition, photosensitive element, method for forming resist pattern and method for producing printed wiring board |
| TW099125240A TWI417663B (zh) | 2005-05-23 | 2006-05-23 | A photosensitive resin composition, a photosensitive member, a method for forming a photoresist pattern, and a method for manufacturing a printed wiring board |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW099125240A TWI417663B (zh) | 2005-05-23 | 2006-05-23 | A photosensitive resin composition, a photosensitive member, a method for forming a photoresist pattern, and a method for manufacturing a printed wiring board |
Country Status (6)
| Country | Link |
|---|---|
| US (3) | US7993809B2 (enExample) |
| KR (4) | KR100934046B1 (enExample) |
| CN (5) | CN102012634A (enExample) |
| SG (1) | SG160355A1 (enExample) |
| TW (2) | TW200702916A (enExample) |
| WO (1) | WO2006126480A1 (enExample) |
Families Citing this family (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4586919B2 (ja) * | 2006-04-18 | 2010-11-24 | 日立化成工業株式会社 | 感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法 |
| KR101128307B1 (ko) | 2007-04-04 | 2012-04-12 | 아사히 가세이 이-매터리얼즈 가부시키가이샤 | 감광성 수지 조성물 및 적층체 |
| JP5117234B2 (ja) * | 2008-03-21 | 2013-01-16 | 旭化成イーマテリアルズ株式会社 | 感光性樹脂組成物および積層体 |
| JP5117233B2 (ja) * | 2008-03-21 | 2013-01-16 | 旭化成イーマテリアルズ株式会社 | 感光性樹脂組成物および積層体 |
| CN101978321B (zh) * | 2008-03-21 | 2013-06-12 | 旭化成电子材料株式会社 | 感光性树脂组合物、感光性树脂层压体、抗蚀图案形成方法、以及印刷线路板、引线框、半导体封装体和凹凸基板的制造方法 |
| JP5117235B2 (ja) * | 2008-03-21 | 2013-01-16 | 旭化成イーマテリアルズ株式会社 | 感光性樹脂組成物および積層体 |
| CN103543608A (zh) * | 2009-02-26 | 2014-01-29 | 日立化成工业株式会社 | 感光性树脂组合物、以及使用了该组合物的感光性元件、抗蚀剂图案的形成方法和印刷线路板的制造方法 |
| CN102844709B (zh) * | 2010-04-15 | 2014-08-20 | 日合墨东株式会社 | 感光性树脂组合物、使用其的光致抗蚀膜、抗蚀图案的形成方法及印刷电路板的制造方法 |
| KR101444044B1 (ko) * | 2010-12-16 | 2014-09-23 | 히타치가세이가부시끼가이샤 | 감광성 엘리먼트, 레지스트 패턴의 형성 방법 및 프린트 배선판의 제조 방법 |
| CN103076717A (zh) * | 2011-10-26 | 2013-05-01 | 日立化成工业株式会社 | 感光性树脂组合物、感光性元件、抗蚀图案的形成方法及印刷配线板的制造方法 |
| JP6229256B2 (ja) * | 2011-10-31 | 2017-11-15 | 日立化成株式会社 | 感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法 |
| WO2013084282A1 (ja) * | 2011-12-05 | 2013-06-13 | 日立化成株式会社 | 樹脂硬化膜パターンの形成方法、感光性樹脂組成物及び感光性エレメント |
| WO2013084283A1 (ja) | 2011-12-05 | 2013-06-13 | 日立化成株式会社 | タッチパネル用電極の保護膜の形成方法、感光性樹脂組成物及び感光性エレメント |
| US9341946B2 (en) * | 2012-05-25 | 2016-05-17 | Lg Chem, Ltd. | Photosensitive resin composition, pattern formed using same and display panel comprising same |
| WO2014196464A1 (ja) * | 2013-06-07 | 2014-12-11 | 株式会社Adeka | 着色感光性組成物及び新規化合物 |
| KR102582577B1 (ko) * | 2014-05-23 | 2023-09-25 | 가부시끼가이샤 레조낙 | 레지스트 패턴의 형성 방법, 프린트 배선판의 제조 방법, 투영 노광용 감광성 수지 조성물 및 감광성 엘리먼트 |
| WO2016184429A1 (zh) * | 2015-05-21 | 2016-11-24 | 常州强力先端电子材料有限公司 | 吡唑啉类增感剂及其制备方法和应用 |
| JP6911369B2 (ja) * | 2017-02-15 | 2021-07-28 | Tdk株式会社 | 積層コイル部品の製造方法 |
| KR20220084015A (ko) * | 2019-10-16 | 2022-06-21 | 쇼와덴코머티리얼즈가부시끼가이샤 | 감광성 수지 필름, 레지스트 패턴의 형성 방법, 및 배선 패턴의 형성 방법 |
| CN113929624A (zh) * | 2020-07-13 | 2022-01-14 | 常州强力电子新材料股份有限公司 | 一种吡唑啉类化合物、感光性树脂组合物及图形化方法 |
| CN120271511A (zh) * | 2025-06-09 | 2025-07-08 | 杭州福斯特电子材料有限公司 | 增感剂、感光树脂组合物、感光干膜及其制备方法 |
Family Cites Families (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5575405A (en) | 1978-11-30 | 1980-06-06 | Fuji Photo Film Co Ltd | Photopolymerizable composition |
| JPS62100756A (ja) * | 1985-10-29 | 1987-05-11 | Matsushita Electric Ind Co Ltd | 電子写真感光体 |
| US4845011A (en) * | 1987-10-23 | 1989-07-04 | Hoechst Celanese Corporation | Visible light photoinitiation compositions |
| US5236812A (en) * | 1989-12-29 | 1993-08-17 | E. I. Du Pont De Nemours And Company | Solid imaging method and apparatus |
| DE4009700A1 (de) * | 1990-03-27 | 1991-10-02 | Hoechst Ag | Photopolymerisierbares gemisch und daraus hergestelltes aufzeichnungsmaterial |
| JP2931693B2 (ja) * | 1991-05-07 | 1999-08-09 | 株式会社日本化学工業所 | 光線遮蔽剤 |
| KR0150344B1 (ko) * | 1995-12-21 | 1998-10-01 | 이웅열 | 감광성 수지 조성물 |
| WO1998004407A1 (en) * | 1996-07-30 | 1998-02-05 | Hitachi Chemical Co., Ltd. | Manufacture of laminated film and printed wiring board |
| US5938761A (en) * | 1997-11-24 | 1999-08-17 | Sun Microsystems | Method and apparatus for branch target prediction |
| JP4050370B2 (ja) | 1998-01-07 | 2008-02-20 | 株式会社Ｋｒｉ | 無機質含有感光性樹脂組成物および無機パターン形成方法 |
| JP4305695B2 (ja) | 1999-05-28 | 2009-07-29 | 日立化成工業株式会社 | 感光性樹脂組成物、これを用いた感光性エレメント、レジストパターンの製造法及びプリント配線板の製造法 |
| DE06121351T1 (de) | 2000-04-19 | 2009-01-29 | Agfa Graphics N.V. | Lichtempfindliche lithografische Druckplatte und Verfahren zur Herstellung einer Druckplatte |
| JP4685259B2 (ja) | 2000-04-19 | 2011-05-18 | コダック株式会社 | 感光性平版印刷版及び印刷版の製版方法 |
| JP3503640B2 (ja) * | 2000-09-27 | 2004-03-08 | 日立化成工業株式会社 | 感光性樹脂組成物 |
| TW562997B (en) | 2000-09-27 | 2003-11-21 | Hitachi Chemical Co Ltd | Photoresist mask pattern, and preparing method and use thereof |
| TWI296738B (enExample) * | 2001-03-29 | 2008-05-11 | Hitachi Chemical Co Ltd | |
| US6855480B2 (en) * | 2001-04-19 | 2005-02-15 | Shipley Company, L.L.C. | Photoresist composition |
| JP2002351070A (ja) | 2001-05-30 | 2002-12-04 | Hitachi Chem Co Ltd | 感光性樹脂組成物、これを用いた感光性エレメント、レジストパターンの製造方法及びプリント配線板の製造方法 |
| JP4043870B2 (ja) | 2002-07-10 | 2008-02-06 | 関西ペイント株式会社 | 半導体レーザー用硬化型樹脂組成物及びその組成を使用したレジストパターン形成方法 |
| US6979615B2 (en) * | 2002-09-12 | 2005-12-27 | Texas Instruments Incorporated | System and method for forming a semiconductor with an analog capacitor using fewer structure steps |
| JP2005128508A (ja) * | 2003-10-02 | 2005-05-19 | Mitsubishi Chemicals Corp | ネガ型青紫色レーザー感光性組成物、並びにそれを用いた画像形成材料、画像形成材、及び画像形成方法 |
| JP4395384B2 (ja) | 2004-01-28 | 2010-01-06 | 旭化成イーマテリアルズ株式会社 | 感光性樹脂組成物及び積層体 |
| JP4223470B2 (ja) | 2004-12-03 | 2009-02-12 | 株式会社半導体エネルギー研究所 | ピッチｘの決定方法、半導体装置の作製方法 |
-
2006
- 2006-05-22 KR KR1020087028775A patent/KR100934046B1/ko active Active
- 2006-05-22 CN CN2010105396454A patent/CN102012634A/zh active Pending
- 2006-05-22 WO PCT/JP2006/310134 patent/WO2006126480A1/ja not_active Ceased
- 2006-05-22 KR KR1020087028774A patent/KR100932581B1/ko active Active
- 2006-05-22 KR KR1020097021746A patent/KR100953245B1/ko active Active
- 2006-05-22 CN CN201410381648.8A patent/CN104133343B/zh not_active Expired - Fee Related
- 2006-05-22 US US11/915,169 patent/US7993809B2/en active Active
- 2006-05-22 CN CNA200680017652XA patent/CN101180578A/zh active Pending
- 2006-05-22 CN CN201410381347.5A patent/CN104111583B/zh active Active
- 2006-05-22 CN CN201410381593.0A patent/CN104133342B/zh active Active
- 2006-05-22 SG SG201001486-8A patent/SG160355A1/en unknown
- 2006-05-22 KR KR1020077023383A patent/KR100935779B1/ko active Active
- 2006-05-23 TW TW095118300A patent/TW200702916A/zh unknown
- 2006-05-23 TW TW099125240A patent/TWI417663B/zh not_active IP Right Cessation
-
2010
- 2010-07-16 US US12/838,025 patent/US8198008B2/en active Active
- 2010-07-16 US US12/837,998 patent/US8192916B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN104133343B (zh) | 2016-11-16 |
| CN104133342B (zh) | 2018-01-23 |
| CN104111583A (zh) | 2014-10-22 |
| CN104111583B (zh) | 2019-01-01 |
| WO2006126480A1 (ja) | 2006-11-30 |
| CN104133343A (zh) | 2014-11-05 |
| KR100932581B1 (ko) | 2009-12-17 |
| TW201100961A (en) | 2011-01-01 |
| KR20070110937A (ko) | 2007-11-20 |
| US8198008B2 (en) | 2012-06-12 |
| KR100934046B1 (ko) | 2009-12-24 |
| US20100285408A1 (en) | 2010-11-11 |
| KR20100009547A (ko) | 2010-01-27 |
| US7993809B2 (en) | 2011-08-09 |
| CN104133342A (zh) | 2014-11-05 |
| US20100279229A1 (en) | 2010-11-04 |
| US8192916B2 (en) | 2012-06-05 |
| KR20080108623A (ko) | 2008-12-15 |
| CN102012634A (zh) | 2011-04-13 |
| US20090029289A1 (en) | 2009-01-29 |
| KR100935779B1 (ko) | 2010-01-06 |
| TWI417663B (zh) | 2013-12-01 |
| SG160355A1 (en) | 2010-04-29 |
| CN101180578A (zh) | 2008-05-14 |
| KR20080108624A (ko) | 2008-12-15 |
| TWI334965B (enExample) | 2010-12-21 |
| KR100953245B1 (ko) | 2010-04-16 |
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