CN101971699A - 防水封装方法 - Google Patents

防水封装方法 Download PDF

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Publication number
CN101971699A
CN101971699A CN2009801086295A CN200980108629A CN101971699A CN 101971699 A CN101971699 A CN 101971699A CN 2009801086295 A CN2009801086295 A CN 2009801086295A CN 200980108629 A CN200980108629 A CN 200980108629A CN 101971699 A CN101971699 A CN 101971699A
Authority
CN
China
Prior art keywords
layer
organic
light emitting
emitting diode
organic light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2009801086295A
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English (en)
Chinese (zh)
Inventor
元泰景
乔斯·曼纽尔·迭格斯-坎波
桑杰伊·D·雅达夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Priority to CN201510108961.9A priority Critical patent/CN104752626A/zh
Publication of CN101971699A publication Critical patent/CN101971699A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/14—Carrier transporting layers
    • H10K50/15—Hole transporting layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/14—Carrier transporting layers
    • H10K50/16—Electron transporting layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H10K50/8445—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H10K59/8731—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)
CN2009801086295A 2008-03-13 2009-02-17 防水封装方法 Pending CN101971699A (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201510108961.9A CN104752626A (zh) 2008-03-13 2009-02-17 防水封装方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US3623008P 2008-03-13 2008-03-13
US61/036,230 2008-03-13
PCT/US2009/034266 WO2009114242A1 (en) 2008-03-13 2009-02-17 Water-barrier encapsulation method

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CN201510108961.9A Division CN104752626A (zh) 2008-03-13 2009-02-17 防水封装方法

Publications (1)

Publication Number Publication Date
CN101971699A true CN101971699A (zh) 2011-02-09

Family

ID=41062054

Family Applications (2)

Application Number Title Priority Date Filing Date
CN2009801086295A Pending CN101971699A (zh) 2008-03-13 2009-02-17 防水封装方法
CN201510108961.9A Pending CN104752626A (zh) 2008-03-13 2009-02-17 防水封装方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN201510108961.9A Pending CN104752626A (zh) 2008-03-13 2009-02-17 防水封装方法

Country Status (6)

Country Link
US (2) US7951620B2 (enExample)
JP (1) JP2011513944A (enExample)
KR (1) KR101455047B1 (enExample)
CN (2) CN101971699A (enExample)
TW (1) TWI499106B (enExample)
WO (1) WO2009114242A1 (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102751307A (zh) * 2012-06-29 2012-10-24 昆山工研院新型平板显示技术中心有限公司 一种可进行透明不透明转换的显示器
CN105219285A (zh) * 2014-07-01 2016-01-06 利诺士有限公司 有机电子装置用粘合膜及包含该粘合膜的有机电子装置用封装材料
CN109390496A (zh) * 2011-02-07 2019-02-26 应用材料公司 用于封装有机发光二极管的方法

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7951620B2 (en) * 2008-03-13 2011-05-31 Applied Materials, Inc. Water-barrier encapsulation method
WO2011006018A2 (en) 2009-07-08 2011-01-13 Plasmasi, Inc. Apparatus and method for plasma processing
US8765232B2 (en) 2011-01-10 2014-07-01 Plasmasi, Inc. Apparatus and method for dielectric deposition
KR101844557B1 (ko) 2011-02-08 2018-04-02 어플라이드 머티어리얼스, 인코포레이티드 유기 발광 다이오드의 하이브리드 캡슐화를 위한 방법
US9299956B2 (en) 2012-06-13 2016-03-29 Aixtron, Inc. Method for deposition of high-performance coatings and encapsulated electronic devices
US10526708B2 (en) 2012-06-19 2020-01-07 Aixtron Se Methods for forming thin protective and optical layers on substrates
US9397318B2 (en) 2012-09-04 2016-07-19 Applied Materials, Inc. Method for hybrid encapsulation of an organic light emitting diode
WO2014082306A1 (zh) * 2012-11-30 2014-06-05 海洋王照明科技股份有限公司 一种有机电致发光器件及其制备方法
US9385342B2 (en) 2013-07-30 2016-07-05 Global Oled Technology Llc Local seal for encapsulation of electro-optical element on a flexible substrate
US9287522B2 (en) 2013-07-30 2016-03-15 Global Oled Technology Llc Local seal for encapsulation of electro-optical element on a flexible substrate
US9494792B2 (en) 2013-07-30 2016-11-15 Global Oled Technology Llc Local seal for encapsulation of electro-optical element on a flexible substrate
WO2016114373A1 (ja) 2015-01-16 2016-07-21 シャープ株式会社 表示装置、その表示装置を作製するために用いる貼り合わせ治具、貼り合わせ装置、伸ばし治具、及び表示装置の製造方法
JP6757363B2 (ja) * 2017-10-06 2020-09-16 株式会社Ｊｏｌｅｄ 有機ｅｌ表示パネルの製造方法及び封止層形成装置
CN114203927A (zh) * 2021-12-02 2022-03-18 长春若水科技发展有限公司 一种柔性黄光有机发光二极管及其制备方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1675058A (zh) * 2002-08-07 2005-09-28 株式会社丰田中央研究所 具有粘合层的层压产品和具有保护膜的层压产品
CN1799153A (zh) * 2003-05-30 2006-07-05 奥斯兰姆奥普托半导体有限责任公司 有机电子器件
CN1992371A (zh) * 2005-12-30 2007-07-04 三星Sdi株式会社 有机发光装置及其制造方法

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1995010117A1 (en) * 1993-10-04 1995-04-13 Catalina Coatings, Inc. Cross-linked acrylate coating material useful for forming capacitor dielectrics and oxygen barriers
US5686360A (en) * 1995-11-30 1997-11-11 Motorola Passivation of organic devices
EP1145338B1 (en) * 1998-12-16 2012-12-05 Samsung Display Co., Ltd. Environmental barrier material for organic light emitting device and method of making
US6268695B1 (en) * 1998-12-16 2001-07-31 Battelle Memorial Institute Environmental barrier material for organic light emitting device and method of making
KR20040027940A (ko) * 2001-08-20 2004-04-01 노바-플라즈마 인크. 기체 및 증기 침투율이 낮은 코팅층
US7169472B2 (en) * 2003-02-13 2007-01-30 Jds Uniphase Corporation Robust multilayer magnetic pigments and foils
JP4303011B2 (ja) 2003-03-14 2009-07-29 オプトレックス株式会社 上面発光型有機エレクトロルミネセンス表示素子およびその製造方法
CN1442872A (zh) * 2003-04-17 2003-09-17 上海交通大学 多层纳米透明导电膜及其制备方法
US20040238846A1 (en) * 2003-05-30 2004-12-02 Georg Wittmann Organic electronic device
US20050266679A1 (en) * 2004-05-26 2005-12-01 Jing-Cheng Lin Barrier structure for semiconductor devices
US7214600B2 (en) * 2004-06-25 2007-05-08 Applied Materials, Inc. Method to improve transmittance of an encapsulating film
US7220687B2 (en) * 2004-06-25 2007-05-22 Applied Materials, Inc. Method to improve water-barrier performance by changing film surface morphology
JP5848862B2 (ja) 2004-06-25 2016-01-27 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ カプセル化膜の遮水性能の改善
DE102004061464B4 (de) * 2004-12-17 2008-12-11 Schott Ag Substrat mit feinlaminarer Barriereschutzschicht und Verfahren zu dessen Herstellung
JP2006278139A (ja) * 2005-03-29 2006-10-12 Tohoku Pioneer Corp 自発光パネル及びその製造方法
JP4600254B2 (ja) * 2005-11-22 2010-12-15 セイコーエプソン株式会社 発光装置および電子機器
US20070222817A1 (en) * 2006-03-24 2007-09-27 Shinichi Kurita Methods and apparatus for inkjet printing using multiple sets of print heads
US7560747B2 (en) * 2007-05-01 2009-07-14 Eastman Kodak Company Light-emitting device having improved light output
US7951620B2 (en) * 2008-03-13 2011-05-31 Applied Materials, Inc. Water-barrier encapsulation method

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1675058A (zh) * 2002-08-07 2005-09-28 株式会社丰田中央研究所 具有粘合层的层压产品和具有保护膜的层压产品
CN1799153A (zh) * 2003-05-30 2006-07-05 奥斯兰姆奥普托半导体有限责任公司 有机电子器件
CN1992371A (zh) * 2005-12-30 2007-07-04 三星Sdi株式会社 有机发光装置及其制造方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109390496A (zh) * 2011-02-07 2019-02-26 应用材料公司 用于封装有机发光二极管的方法
CN109390496B (zh) * 2011-02-07 2021-06-15 应用材料公司 用于封装有机发光二极管的方法
CN102751307A (zh) * 2012-06-29 2012-10-24 昆山工研院新型平板显示技术中心有限公司 一种可进行透明不透明转换的显示器
CN105219285A (zh) * 2014-07-01 2016-01-06 利诺士有限公司 有机电子装置用粘合膜及包含该粘合膜的有机电子装置用封装材料

Also Published As

Publication number Publication date
TW200950173A (en) 2009-12-01
US8404502B2 (en) 2013-03-26
KR101455047B1 (ko) 2014-10-27
JP2011513944A (ja) 2011-04-28
KR20110007128A (ko) 2011-01-21
US7951620B2 (en) 2011-05-31
CN104752626A (zh) 2015-07-01
US20110297921A1 (en) 2011-12-08
TWI499106B (zh) 2015-09-01
US20090230425A1 (en) 2009-09-17
WO2009114242A1 (en) 2009-09-17

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C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C53 Correction of patent of invention or patent application
CB02 Change of applicant information

Address after: American California

Applicant after: Applied Materials Inc.

Address before: American California

Applicant before: Applied Materials Inc.

C12 Rejection of a patent application after its publication
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Application publication date: 20110209