TWI499106B - 防水封裝方法 - Google Patents
防水封裝方法 Download PDFInfo
- Publication number
- TWI499106B TWI499106B TW098107931A TW98107931A TWI499106B TW I499106 B TWI499106 B TW I499106B TW 098107931 A TW098107931 A TW 098107931A TW 98107931 A TW98107931 A TW 98107931A TW I499106 B TWI499106 B TW I499106B
- Authority
- TW
- Taiwan
- Prior art keywords
- layer
- emitting diode
- light emitting
- organic light
- organic
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims description 11
- 238000004806 packaging method and process Methods 0.000 title claims 4
- 239000010410 layer Substances 0.000 claims description 205
- 238000005538 encapsulation Methods 0.000 claims description 57
- 239000000758 substrate Substances 0.000 claims description 48
- 238000002347 injection Methods 0.000 claims description 26
- 239000007924 injection Substances 0.000 claims description 26
- 230000005525 hole transport Effects 0.000 claims description 18
- 238000000151 deposition Methods 0.000 claims description 13
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 claims description 11
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 10
- 229910052799 carbon Inorganic materials 0.000 claims description 10
- 239000000203 mixture Substances 0.000 claims description 10
- 239000012044 organic layer Substances 0.000 claims description 7
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 6
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 claims description 6
- 229910052732 germanium Inorganic materials 0.000 claims description 6
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 claims description 6
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 5
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 claims description 4
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 claims 4
- 229910052707 ruthenium Inorganic materials 0.000 claims 4
- 210000003298 dental enamel Anatomy 0.000 claims 1
- 230000005611 electricity Effects 0.000 claims 1
- XJHCXCQVJFPJIK-UHFFFAOYSA-M caesium fluoride Chemical compound [F-].[Cs+] XJHCXCQVJFPJIK-UHFFFAOYSA-M 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 5
- 230000007547 defect Effects 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 229910052760 oxygen Inorganic materials 0.000 description 5
- 239000001301 oxygen Substances 0.000 description 5
- 239000002245 particle Substances 0.000 description 5
- 230000008021 deposition Effects 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- TVIVIEFSHFOWTE-UHFFFAOYSA-K tri(quinolin-8-yloxy)alumane Chemical compound [Al+3].C1=CN=C2C([O-])=CC=CC2=C1.C1=CN=C2C([O-])=CC=CC2=C1.C1=CN=C2C([O-])=CC=CC2=C1 TVIVIEFSHFOWTE-UHFFFAOYSA-K 0.000 description 3
- GEYOCULIXLDCMW-UHFFFAOYSA-N 1,2-phenylenediamine Chemical group NC1=CC=CC=C1N GEYOCULIXLDCMW-UHFFFAOYSA-N 0.000 description 2
- SMWDFEZZVXVKRB-UHFFFAOYSA-N Quinoline Chemical compound N1=CC=CC2=CC=CC=C21 SMWDFEZZVXVKRB-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 229910001508 alkali metal halide Inorganic materials 0.000 description 2
- 150000008045 alkali metal halides Chemical class 0.000 description 2
- 229910001615 alkaline earth metal halide Inorganic materials 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 239000013522 chelant Substances 0.000 description 2
- 238000006731 degradation reaction Methods 0.000 description 2
- 238000007641 inkjet printing Methods 0.000 description 2
- PQXKHYXIUOZZFA-UHFFFAOYSA-M lithium fluoride Chemical compound [Li+].[F-] PQXKHYXIUOZZFA-UHFFFAOYSA-M 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- 229960003540 oxyquinoline Drugs 0.000 description 2
- 239000005022 packaging material Substances 0.000 description 2
- 230000035515 penetration Effects 0.000 description 2
- NROKBHXJSPEDAR-UHFFFAOYSA-M potassium fluoride Chemical compound [F-].[K+] NROKBHXJSPEDAR-UHFFFAOYSA-M 0.000 description 2
- MCJGNVYPOGVAJF-UHFFFAOYSA-N quinolin-8-ol Chemical compound C1=CN=C2C(O)=CC=CC2=C1 MCJGNVYPOGVAJF-UHFFFAOYSA-N 0.000 description 2
- PUZPDOWCWNUUKD-UHFFFAOYSA-M sodium fluoride Chemical compound [F-].[Na+] PUZPDOWCWNUUKD-UHFFFAOYSA-M 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- OGGKVJMNFFSDEV-UHFFFAOYSA-N 3-methyl-n-[4-[4-(n-(3-methylphenyl)anilino)phenyl]phenyl]-n-phenylaniline Chemical compound CC1=CC=CC(N(C=2C=CC=CC=2)C=2C=CC(=CC=2)C=2C=CC(=CC=2)N(C=2C=CC=CC=2)C=2C=C(C)C=CC=2)=C1 OGGKVJMNFFSDEV-UHFFFAOYSA-N 0.000 description 1
- 239000005725 8-Hydroxyquinoline Substances 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 1
- 206010062717 Increased upper airway secretion Diseases 0.000 description 1
- 229910000861 Mg alloy Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- HFACYLZERDEVSX-UHFFFAOYSA-N benzidine Chemical class C1=CC(N)=CC=C1C1=CC=C(N)C=C1 HFACYLZERDEVSX-UHFFFAOYSA-N 0.000 description 1
- WUKWITHWXAAZEY-UHFFFAOYSA-L calcium difluoride Chemical compound [F-].[F-].[Ca+2] WUKWITHWXAAZEY-UHFFFAOYSA-L 0.000 description 1
- 229910001634 calcium fluoride Inorganic materials 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 150000004985 diamines Chemical class 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- ORUIBWPALBXDOA-UHFFFAOYSA-L magnesium fluoride Chemical compound [F-].[F-].[Mg+2] ORUIBWPALBXDOA-UHFFFAOYSA-L 0.000 description 1
- 229910001635 magnesium fluoride Inorganic materials 0.000 description 1
- 238000005297 material degradation process Methods 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 208000026435 phlegm Diseases 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 239000011698 potassium fluoride Substances 0.000 description 1
- 235000003270 potassium fluoride Nutrition 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 150000003384 small molecules Chemical class 0.000 description 1
- 239000005361 soda-lime glass Substances 0.000 description 1
- 239000011775 sodium fluoride Substances 0.000 description 1
- 235000013024 sodium fluoride Nutrition 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/04—Sealing arrangements, e.g. against humidity
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
- H10K50/14—Carrier transporting layers
- H10K50/15—Hole transporting layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
- H10K50/14—Carrier transporting layers
- H10K50/16—Electron transporting layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
- H10K50/8445—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/873—Encapsulations
- H10K59/8731—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US3623008P | 2008-03-13 | 2008-03-13 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200950173A TW200950173A (en) | 2009-12-01 |
| TWI499106B true TWI499106B (zh) | 2015-09-01 |
Family
ID=41062054
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW098107931A TWI499106B (zh) | 2008-03-13 | 2009-03-11 | 防水封裝方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US7951620B2 (enExample) |
| JP (1) | JP2011513944A (enExample) |
| KR (1) | KR101455047B1 (enExample) |
| CN (2) | CN104752626A (enExample) |
| TW (1) | TWI499106B (enExample) |
| WO (1) | WO2009114242A1 (enExample) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7951620B2 (en) * | 2008-03-13 | 2011-05-31 | Applied Materials, Inc. | Water-barrier encapsulation method |
| KR101842675B1 (ko) | 2009-07-08 | 2018-03-27 | 플라즈마시, 인크. | 플라즈마 처리를 위한 장치 및 방법 |
| US8765232B2 (en) | 2011-01-10 | 2014-07-01 | Plasmasi, Inc. | Apparatus and method for dielectric deposition |
| KR101698462B1 (ko) * | 2011-02-07 | 2017-01-20 | 어플라이드 머티어리얼스, 인코포레이티드 | 유기 발광 다이오드를 캡슐화하기 위한 방법 |
| TWI577066B (zh) | 2011-02-08 | 2017-04-01 | 應用材料股份有限公司 | 有機發光二極體的混合式封裝方法 |
| US9299956B2 (en) | 2012-06-13 | 2016-03-29 | Aixtron, Inc. | Method for deposition of high-performance coatings and encapsulated electronic devices |
| US10526708B2 (en) | 2012-06-19 | 2020-01-07 | Aixtron Se | Methods for forming thin protective and optical layers on substrates |
| CN102751307A (zh) * | 2012-06-29 | 2012-10-24 | 昆山工研院新型平板显示技术中心有限公司 | 一种可进行透明不透明转换的显示器 |
| US9397318B2 (en) | 2012-09-04 | 2016-07-19 | Applied Materials, Inc. | Method for hybrid encapsulation of an organic light emitting diode |
| WO2014082306A1 (zh) * | 2012-11-30 | 2014-06-05 | 海洋王照明科技股份有限公司 | 一种有机电致发光器件及其制备方法 |
| US9385342B2 (en) | 2013-07-30 | 2016-07-05 | Global Oled Technology Llc | Local seal for encapsulation of electro-optical element on a flexible substrate |
| US9494792B2 (en) | 2013-07-30 | 2016-11-15 | Global Oled Technology Llc | Local seal for encapsulation of electro-optical element on a flexible substrate |
| US9287522B2 (en) | 2013-07-30 | 2016-03-15 | Global Oled Technology Llc | Local seal for encapsulation of electro-optical element on a flexible substrate |
| KR101561102B1 (ko) * | 2014-07-01 | 2015-10-19 | 주식회사 이녹스 | 유기전자장치용 접착필름 및 이를 포함하는 유기전자장치용 봉지재 |
| CN107113926B (zh) | 2015-01-16 | 2019-02-05 | 夏普株式会社 | 显示装置、用于制作该显示装置的贴合治具、贴合装置、拉伸治具以及显示装置的制造方法 |
| JP6757363B2 (ja) * | 2017-10-06 | 2020-09-16 | 株式会社Ｊｏｌｅｄ | 有機ｅｌ表示パネルの製造方法及び封止層形成装置 |
| CN114203927A (zh) * | 2021-12-02 | 2022-03-18 | 长春若水科技发展有限公司 | 一种柔性黄光有机发光二极管及其制备方法 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW439308B (en) * | 1998-12-16 | 2001-06-07 | Battelle Memorial Institute | Environmental barrier material for organic light emitting device and method of making |
| TW200635426A (en) * | 2005-03-29 | 2006-10-01 | Pioneer Tohoku Corp | Self-light emitting panel and method for fabricating the same |
| CN1317421C (zh) * | 2001-08-20 | 2007-05-23 | 诺华等离子公司 | 气体和蒸气低渗透性的涂层 |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| ATE218398T1 (de) * | 1993-10-04 | 2002-06-15 | 3M Innovative Properties Co | Verfahren zur herstellung einer acrylatbeschichtung |
| US5686360A (en) * | 1995-11-30 | 1997-11-11 | Motorola | Passivation of organic devices |
| US6268695B1 (en) * | 1998-12-16 | 2001-07-31 | Battelle Memorial Institute | Environmental barrier material for organic light emitting device and method of making |
| WO2004014644A1 (ja) * | 2002-08-07 | 2004-02-19 | Kabushiki Kaisha Toyota Chuo Kenkyusho | 密着層を備える積層体及び保護膜を備える積層体 |
| US7169472B2 (en) * | 2003-02-13 | 2007-01-30 | Jds Uniphase Corporation | Robust multilayer magnetic pigments and foils |
| JP4303011B2 (ja) | 2003-03-14 | 2009-07-29 | オプトレックス株式会社 | 上面発光型有機エレクトロルミネセンス表示素子およびその製造方法 |
| CN1442872A (zh) * | 2003-04-17 | 2003-09-17 | 上海交通大学 | 多层纳米透明导电膜及其制备方法 |
| US20040238846A1 (en) * | 2003-05-30 | 2004-12-02 | Georg Wittmann | Organic electronic device |
| CN1799153A (zh) * | 2003-05-30 | 2006-07-05 | 奥斯兰姆奥普托半导体有限责任公司 | 有机电子器件 |
| US20050266679A1 (en) * | 2004-05-26 | 2005-12-01 | Jing-Cheng Lin | Barrier structure for semiconductor devices |
| US7220687B2 (en) * | 2004-06-25 | 2007-05-22 | Applied Materials, Inc. | Method to improve water-barrier performance by changing film surface morphology |
| WO2006007313A2 (en) | 2004-06-25 | 2006-01-19 | Applied Materials, Inc. | Improving water-barrier performance of an encapsulating film |
| US7214600B2 (en) * | 2004-06-25 | 2007-05-08 | Applied Materials, Inc. | Method to improve transmittance of an encapsulating film |
| DE102004061464B4 (de) * | 2004-12-17 | 2008-12-11 | Schott Ag | Substrat mit feinlaminarer Barriereschutzschicht und Verfahren zu dessen Herstellung |
| JP4600254B2 (ja) * | 2005-11-22 | 2010-12-15 | セイコーエプソン株式会社 | 発光装置および電子機器 |
| US8003999B2 (en) * | 2005-12-30 | 2011-08-23 | Samsung Mobile Display Co., Ltd. | Organic light emitting device |
| TWI328518B (en) * | 2006-03-24 | 2010-08-11 | Applied Materials Inc | Methods and apparatus for inkjet printing using multiple sets of print heads |
| US7560747B2 (en) * | 2007-05-01 | 2009-07-14 | Eastman Kodak Company | Light-emitting device having improved light output |
| US7951620B2 (en) * | 2008-03-13 | 2011-05-31 | Applied Materials, Inc. | Water-barrier encapsulation method |
-
2009
- 2009-02-13 US US12/371,171 patent/US7951620B2/en active Active
- 2009-02-17 JP JP2010550721A patent/JP2011513944A/ja active Pending
- 2009-02-17 CN CN201510108961.9A patent/CN104752626A/zh active Pending
- 2009-02-17 CN CN2009801086295A patent/CN101971699A/zh active Pending
- 2009-02-17 KR KR1020107022767A patent/KR101455047B1/ko active Active
- 2009-02-17 WO PCT/US2009/034266 patent/WO2009114242A1/en not_active Ceased
- 2009-03-11 TW TW098107931A patent/TWI499106B/zh not_active IP Right Cessation
-
2011
- 2011-05-27 US US13/117,947 patent/US8404502B2/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW439308B (en) * | 1998-12-16 | 2001-06-07 | Battelle Memorial Institute | Environmental barrier material for organic light emitting device and method of making |
| CN1317421C (zh) * | 2001-08-20 | 2007-05-23 | 诺华等离子公司 | 气体和蒸气低渗透性的涂层 |
| TW200635426A (en) * | 2005-03-29 | 2006-10-01 | Pioneer Tohoku Corp | Self-light emitting panel and method for fabricating the same |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101971699A (zh) | 2011-02-09 |
| US20090230425A1 (en) | 2009-09-17 |
| US8404502B2 (en) | 2013-03-26 |
| JP2011513944A (ja) | 2011-04-28 |
| TW200950173A (en) | 2009-12-01 |
| US7951620B2 (en) | 2011-05-31 |
| WO2009114242A1 (en) | 2009-09-17 |
| KR101455047B1 (ko) | 2014-10-27 |
| CN104752626A (zh) | 2015-07-01 |
| US20110297921A1 (en) | 2011-12-08 |
| KR20110007128A (ko) | 2011-01-21 |
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