CN104752626A - 防水封装方法 - Google Patents
防水封装方法 Download PDFInfo
- Publication number
- CN104752626A CN104752626A CN201510108961.9A CN201510108961A CN104752626A CN 104752626 A CN104752626 A CN 104752626A CN 201510108961 A CN201510108961 A CN 201510108961A CN 104752626 A CN104752626 A CN 104752626A
- Authority
- CN
- China
- Prior art keywords
- layer
- containing layers
- silicon
- light emitting
- oled
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005538 encapsulation Methods 0.000 title claims abstract description 71
- 238000000034 method Methods 0.000 title claims abstract description 16
- 238000004519 manufacturing process Methods 0.000 claims abstract description 7
- 239000000758 substrate Substances 0.000 claims description 38
- 238000002347 injection Methods 0.000 claims description 17
- 239000007924 injection Substances 0.000 claims description 17
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 16
- 229910052710 silicon Inorganic materials 0.000 claims description 16
- 239000010703 silicon Substances 0.000 claims description 16
- 230000005525 hole transport Effects 0.000 claims description 12
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 11
- 229910052799 carbon Inorganic materials 0.000 claims description 11
- 238000000151 deposition Methods 0.000 claims description 11
- 239000000203 mixture Substances 0.000 claims description 10
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 6
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 6
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 4
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 claims description 4
- 238000004806 packaging method and process Methods 0.000 claims 3
- 150000001252 acrylic acid derivatives Chemical class 0.000 claims 1
- 150000002734 metacrylic acid derivatives Chemical class 0.000 claims 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 abstract description 6
- 230000008021 deposition Effects 0.000 abstract description 6
- 229910052760 oxygen Inorganic materials 0.000 abstract description 6
- 239000001301 oxygen Substances 0.000 abstract description 6
- 230000035515 penetration Effects 0.000 abstract description 3
- 239000010410 layer Substances 0.000 description 130
- 239000000463 material Substances 0.000 description 6
- 230000007547 defect Effects 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 239000012044 organic layer Substances 0.000 description 5
- 239000002245 particle Substances 0.000 description 5
- TVIVIEFSHFOWTE-UHFFFAOYSA-K tri(quinolin-8-yloxy)alumane Chemical compound [Al+3].C1=CN=C2C([O-])=CC=CC2=C1.C1=CN=C2C([O-])=CC=CC2=C1.C1=CN=C2C([O-])=CC=CC2=C1 TVIVIEFSHFOWTE-UHFFFAOYSA-K 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 239000011368 organic material Substances 0.000 description 3
- GEYOCULIXLDCMW-UHFFFAOYSA-N 1,2-phenylenediamine Chemical group NC1=CC=CC=C1N GEYOCULIXLDCMW-UHFFFAOYSA-N 0.000 description 2
- SMWDFEZZVXVKRB-UHFFFAOYSA-N Quinoline Chemical compound N1=CC=CC2=CC=CC=C21 SMWDFEZZVXVKRB-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 229910001508 alkali metal halide Inorganic materials 0.000 description 2
- 150000008045 alkali metal halides Chemical class 0.000 description 2
- 229910001615 alkaline earth metal halide Inorganic materials 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- XJHCXCQVJFPJIK-UHFFFAOYSA-M caesium fluoride Chemical compound [F-].[Cs+] XJHCXCQVJFPJIK-UHFFFAOYSA-M 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 239000013522 chelant Substances 0.000 description 2
- 238000006731 degradation reaction Methods 0.000 description 2
- 238000007641 inkjet printing Methods 0.000 description 2
- PQXKHYXIUOZZFA-UHFFFAOYSA-M lithium fluoride Chemical compound [Li+].[F-] PQXKHYXIUOZZFA-UHFFFAOYSA-M 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 229960003540 oxyquinoline Drugs 0.000 description 2
- 239000002861 polymer material Substances 0.000 description 2
- NROKBHXJSPEDAR-UHFFFAOYSA-M potassium fluoride Chemical compound [F-].[K+] NROKBHXJSPEDAR-UHFFFAOYSA-M 0.000 description 2
- MCJGNVYPOGVAJF-UHFFFAOYSA-N quinolin-8-ol Chemical compound C1=CN=C2C(O)=CC=CC2=C1 MCJGNVYPOGVAJF-UHFFFAOYSA-N 0.000 description 2
- AHLATJUETSFVIM-UHFFFAOYSA-M rubidium fluoride Chemical compound [F-].[Rb+] AHLATJUETSFVIM-UHFFFAOYSA-M 0.000 description 2
- PUZPDOWCWNUUKD-UHFFFAOYSA-M sodium fluoride Chemical compound [F-].[Na+] PUZPDOWCWNUUKD-UHFFFAOYSA-M 0.000 description 2
- OGGKVJMNFFSDEV-UHFFFAOYSA-N 3-methyl-n-[4-[4-(n-(3-methylphenyl)anilino)phenyl]phenyl]-n-phenylaniline Chemical compound CC1=CC=CC(N(C=2C=CC=CC=2)C=2C=CC(=CC=2)C=2C=CC(=CC=2)N(C=2C=CC=CC=2)C=2C=C(C)C=CC=2)=C1 OGGKVJMNFFSDEV-UHFFFAOYSA-N 0.000 description 1
- 239000005725 8-Hydroxyquinoline Substances 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000861 Mg alloy Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- UGEZMJYWJZPNGX-UHFFFAOYSA-N barium(2+) oxygen(2-) hydrofluoride Chemical compound [O-2].F.[Ba+2] UGEZMJYWJZPNGX-UHFFFAOYSA-N 0.000 description 1
- HFACYLZERDEVSX-UHFFFAOYSA-N benzidine Chemical class C1=CC(N)=CC=C1C1=CC=C(N)C=C1 HFACYLZERDEVSX-UHFFFAOYSA-N 0.000 description 1
- WUKWITHWXAAZEY-UHFFFAOYSA-L calcium difluoride Chemical compound [F-].[F-].[Ca+2] WUKWITHWXAAZEY-UHFFFAOYSA-L 0.000 description 1
- 229910001634 calcium fluoride Inorganic materials 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 150000004985 diamines Chemical class 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- ORUIBWPALBXDOA-UHFFFAOYSA-L magnesium fluoride Chemical compound [F-].[F-].[Mg+2] ORUIBWPALBXDOA-UHFFFAOYSA-L 0.000 description 1
- 229910001635 magnesium fluoride Inorganic materials 0.000 description 1
- 238000005297 material degradation process Methods 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000005022 packaging material Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000011698 potassium fluoride Substances 0.000 description 1
- 235000003270 potassium fluoride Nutrition 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 150000003384 small molecules Chemical class 0.000 description 1
- 239000005361 soda-lime glass Substances 0.000 description 1
- 239000011775 sodium fluoride Substances 0.000 description 1
- 235000013024 sodium fluoride Nutrition 0.000 description 1
- FVRNDBHWWSPNOM-UHFFFAOYSA-L strontium fluoride Chemical compound [F-].[F-].[Sr+2] FVRNDBHWWSPNOM-UHFFFAOYSA-L 0.000 description 1
- 229910001637 strontium fluoride Inorganic materials 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/04—Sealing arrangements, e.g. against humidity
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
- H10K50/14—Carrier transporting layers
- H10K50/15—Hole transporting layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
- H10K50/14—Carrier transporting layers
- H10K50/16—Electron transporting layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
- H10K50/8445—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/873—Encapsulations
- H10K59/8731—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US3623008P | 2008-03-13 | 2008-03-13 | |
| US61/036,230 | 2008-03-13 | ||
| CN2009801086295A CN101971699A (zh) | 2008-03-13 | 2009-02-17 | 防水封装方法 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009801086295A Division CN101971699A (zh) | 2008-03-13 | 2009-02-17 | 防水封装方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104752626A true CN104752626A (zh) | 2015-07-01 |
Family
ID=41062054
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510108961.9A Pending CN104752626A (zh) | 2008-03-13 | 2009-02-17 | 防水封装方法 |
| CN2009801086295A Pending CN101971699A (zh) | 2008-03-13 | 2009-02-17 | 防水封装方法 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009801086295A Pending CN101971699A (zh) | 2008-03-13 | 2009-02-17 | 防水封装方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US7951620B2 (enExample) |
| JP (1) | JP2011513944A (enExample) |
| KR (1) | KR101455047B1 (enExample) |
| CN (2) | CN104752626A (enExample) |
| TW (1) | TWI499106B (enExample) |
| WO (1) | WO2009114242A1 (enExample) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7951620B2 (en) * | 2008-03-13 | 2011-05-31 | Applied Materials, Inc. | Water-barrier encapsulation method |
| KR101842675B1 (ko) | 2009-07-08 | 2018-03-27 | 플라즈마시, 인크. | 플라즈마 처리를 위한 장치 및 방법 |
| US8765232B2 (en) | 2011-01-10 | 2014-07-01 | Plasmasi, Inc. | Apparatus and method for dielectric deposition |
| KR101698462B1 (ko) * | 2011-02-07 | 2017-01-20 | 어플라이드 머티어리얼스, 인코포레이티드 | 유기 발광 다이오드를 캡슐화하기 위한 방법 |
| TWI577066B (zh) | 2011-02-08 | 2017-04-01 | 應用材料股份有限公司 | 有機發光二極體的混合式封裝方法 |
| US9299956B2 (en) | 2012-06-13 | 2016-03-29 | Aixtron, Inc. | Method for deposition of high-performance coatings and encapsulated electronic devices |
| US10526708B2 (en) | 2012-06-19 | 2020-01-07 | Aixtron Se | Methods for forming thin protective and optical layers on substrates |
| CN102751307A (zh) * | 2012-06-29 | 2012-10-24 | 昆山工研院新型平板显示技术中心有限公司 | 一种可进行透明不透明转换的显示器 |
| US9397318B2 (en) | 2012-09-04 | 2016-07-19 | Applied Materials, Inc. | Method for hybrid encapsulation of an organic light emitting diode |
| WO2014082306A1 (zh) * | 2012-11-30 | 2014-06-05 | 海洋王照明科技股份有限公司 | 一种有机电致发光器件及其制备方法 |
| US9385342B2 (en) | 2013-07-30 | 2016-07-05 | Global Oled Technology Llc | Local seal for encapsulation of electro-optical element on a flexible substrate |
| US9494792B2 (en) | 2013-07-30 | 2016-11-15 | Global Oled Technology Llc | Local seal for encapsulation of electro-optical element on a flexible substrate |
| US9287522B2 (en) | 2013-07-30 | 2016-03-15 | Global Oled Technology Llc | Local seal for encapsulation of electro-optical element on a flexible substrate |
| KR101561102B1 (ko) * | 2014-07-01 | 2015-10-19 | 주식회사 이녹스 | 유기전자장치용 접착필름 및 이를 포함하는 유기전자장치용 봉지재 |
| CN107113926B (zh) | 2015-01-16 | 2019-02-05 | 夏普株式会社 | 显示装置、用于制作该显示装置的贴合治具、贴合装置、拉伸治具以及显示装置的制造方法 |
| JP6757363B2 (ja) * | 2017-10-06 | 2020-09-16 | 株式会社Ｊｏｌｅｄ | 有機ｅｌ表示パネルの製造方法及び封止層形成装置 |
| CN114203927A (zh) * | 2021-12-02 | 2022-03-18 | 长春若水科技发展有限公司 | 一种柔性黄光有机发光二极管及其制备方法 |
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| US20010015620A1 (en) * | 1998-12-16 | 2001-08-23 | Affinito John D. | Environmental barrier material for organic light emitting device and method of making |
| CN1442872A (zh) * | 2003-04-17 | 2003-09-17 | 上海交通大学 | 多层纳米透明导电膜及其制备方法 |
| CN1675058A (zh) * | 2002-08-07 | 2005-09-28 | 株式会社丰田中央研究所 | 具有粘合层的层压产品和具有保护膜的层压产品 |
| CN1707787A (zh) * | 2004-05-26 | 2005-12-14 | 台湾积体电路制造股份有限公司 | 半导体装置 |
| CN1748006A (zh) * | 2003-02-13 | 2006-03-15 | Jds尤尼弗思公司 | 坚固的多层磁性颜料和箔 |
| CN1799153A (zh) * | 2003-05-30 | 2006-07-05 | 奥斯兰姆奥普托半导体有限责任公司 | 有机电子器件 |
| CN1992371A (zh) * | 2005-12-30 | 2007-07-04 | 三星Sdi株式会社 | 有机发光装置及其制造方法 |
| CN101128402A (zh) * | 2004-12-17 | 2008-02-20 | 肖特股份公司 | 薄片的阻挡保护层 |
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| US5686360A (en) * | 1995-11-30 | 1997-11-11 | Motorola | Passivation of organic devices |
| EP1145338B1 (en) * | 1998-12-16 | 2012-12-05 | Samsung Display Co., Ltd. | Environmental barrier material for organic light emitting device and method of making |
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| JP4303011B2 (ja) | 2003-03-14 | 2009-07-29 | オプトレックス株式会社 | 上面発光型有機エレクトロルミネセンス表示素子およびその製造方法 |
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| JP2006278139A (ja) * | 2005-03-29 | 2006-10-12 | Tohoku Pioneer Corp | 自発光パネル及びその製造方法 |
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| US7560747B2 (en) * | 2007-05-01 | 2009-07-14 | Eastman Kodak Company | Light-emitting device having improved light output |
| US7951620B2 (en) * | 2008-03-13 | 2011-05-31 | Applied Materials, Inc. | Water-barrier encapsulation method |
-
2009
- 2009-02-13 US US12/371,171 patent/US7951620B2/en active Active
- 2009-02-17 JP JP2010550721A patent/JP2011513944A/ja active Pending
- 2009-02-17 CN CN201510108961.9A patent/CN104752626A/zh active Pending
- 2009-02-17 CN CN2009801086295A patent/CN101971699A/zh active Pending
- 2009-02-17 KR KR1020107022767A patent/KR101455047B1/ko active Active
- 2009-02-17 WO PCT/US2009/034266 patent/WO2009114242A1/en not_active Ceased
- 2009-03-11 TW TW098107931A patent/TWI499106B/zh not_active IP Right Cessation
-
2011
- 2011-05-27 US US13/117,947 patent/US8404502B2/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20010015620A1 (en) * | 1998-12-16 | 2001-08-23 | Affinito John D. | Environmental barrier material for organic light emitting device and method of making |
| CN1675058A (zh) * | 2002-08-07 | 2005-09-28 | 株式会社丰田中央研究所 | 具有粘合层的层压产品和具有保护膜的层压产品 |
| CN1748006A (zh) * | 2003-02-13 | 2006-03-15 | Jds尤尼弗思公司 | 坚固的多层磁性颜料和箔 |
| CN1442872A (zh) * | 2003-04-17 | 2003-09-17 | 上海交通大学 | 多层纳米透明导电膜及其制备方法 |
| CN1799153A (zh) * | 2003-05-30 | 2006-07-05 | 奥斯兰姆奥普托半导体有限责任公司 | 有机电子器件 |
| CN1707787A (zh) * | 2004-05-26 | 2005-12-14 | 台湾积体电路制造股份有限公司 | 半导体装置 |
| CN101128402A (zh) * | 2004-12-17 | 2008-02-20 | 肖特股份公司 | 薄片的阻挡保护层 |
| CN1992371A (zh) * | 2005-12-30 | 2007-07-04 | 三星Sdi株式会社 | 有机发光装置及其制造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI499106B (zh) | 2015-09-01 |
| CN101971699A (zh) | 2011-02-09 |
| US20090230425A1 (en) | 2009-09-17 |
| US8404502B2 (en) | 2013-03-26 |
| JP2011513944A (ja) | 2011-04-28 |
| TW200950173A (en) | 2009-12-01 |
| US7951620B2 (en) | 2011-05-31 |
| WO2009114242A1 (en) | 2009-09-17 |
| KR101455047B1 (ko) | 2014-10-27 |
| US20110297921A1 (en) | 2011-12-08 |
| KR20110007128A (ko) | 2011-01-21 |
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