JP2011513944A - 水障壁封止方法 - Google Patents
水障壁封止方法 Download PDFInfo
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- WUKWITHWXAAZEY-UHFFFAOYSA-L calcium difluoride Chemical compound [F-].[F-].[Ca+2] WUKWITHWXAAZEY-UHFFFAOYSA-L 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/04—Sealing arrangements, e.g. against humidity
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
- H10K50/14—Carrier transporting layers
- H10K50/15—Hole transporting layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
- H10K50/14—Carrier transporting layers
- H10K50/16—Electron transporting layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
- H10K50/8445—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/873—Encapsulations
- H10K59/8731—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
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- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
Description
Claims (15)
- 基板と、
前記基板の上に配置される有機発光ダイオード部分であって、ホール輸送層および発光層を含む前記有機発光ダイオード部分と、
前記有機発光ダイオード部分上に配置される封止部分であって、前記封止部分は、前記有機発光ダイオード部分を実質的に封入し、前記有機発光ダイオード部分および前記基板の両方に結合される有機層を含み、前記封止部分は、前記有機層全体の上に広がり、前記有機発光ダイオード部分と前記封止部分との間の界面と反対側に配置される実質的に平らな表面を有する、封止部分とを含む、有機発光ダイオード構造体。 - 前記有機発光ダイオード部分は、
透明アノード層と、
前記透明アノード層の上に配置されるホール注入層と、
前記ホール注入層の上に配置されるホール輸送層と、
前記ホール輸送層の上に配置される発光層と、
前記発光層の上に配置される電子注入層と、
前記電子注入層の上に配置されるカソード層とを含む、請求項1に記載の構造体。 - 前記封止部分はさらに、前記有機層の上に配置されるシリコンを含む1つまたは複数の層および炭素を含む1つまたは複数の層を含む、請求項1に記載の構造体。
- シリコンを含む前記1つまたは複数の層は、窒化シリコンを含む、請求項3に記載の構造体。
- シリコンを含む前記1つまたは複数の層および炭素を含む前記1つまたは複数の層は、交互方式で前記有機層の上に配置される、請求項4に記載の構造体。
- 基板の上に有機発光ダイオード層状構造体を堆積させるステップと、
前記有機発光ダイオード層状構造体および前記基板の上に有機封止層を、前記有機封止層が前記基板および前記有機発光ダイオード層状構造体の両方に結合されるように堆積させるステップであって、前記有機封止層は、前記有機発光ダイオード層状構造体と前記有機封止層との間の界面と反対側の表面全体を横断して広がる実質的に平らな表面を有する、ステップとを含む、有機発光ダイオード製造方法。 - 前記有機封止層は、インクジェットまたは回転塗布によって堆積される、請求項6に記載の方法。
- 前記有機封止層は、アクリラート、メタクリラート、およびアクリル酸の混合物を含む、請求項6に記載の方法。
- 前記有機封止層上にシリコンを含む1つまたは複数の層を堆積させるステップと、
シリコンを含む前記1つまたは複数の層の上に炭素を含む1つまたは複数の層を堆積させるステップとをさらに含む、請求項6に記載の方法。 - 基板が、その上に配置される有機発光ダイオード層状構造体を有する、前記基板の上におよび前記有機発光ダイオード層状構造体の上に有機封止層を、前記有機封止層が、前記基板および前記有機発光ダイオード層状構造体の両方に結合され、前記有機発光ダイオード層状構造体と前記有機封止層との間の界面と反対側に配置される実質的に平らな表面を有するようにインクジェット堆積させるステップを含む、有機発光ダイオード製造方法。
- 前記インクジェット堆積させるステップはさらに、前記基板および前記有機発光ダイオード層状構造体上にアクリラート、メタクリラート、およびアクリル酸の混合物をインクジェットするステップを含む、請求項10に記載の方法。
- 前記アクリラートは、約25容積パーセントから約50容積パーセントを含む、請求項11に記載の方法。
- 前記メタクリラートは、約10容積パーセントから約25容積パーセントを含む、請求項12に記載の方法。
- 前記インクジェット堆積させるステップ中に前記有機封止層の厚さを測定するステップをさらに含む、請求項10に記載の方法。
- 前記有機発光ダイオード層状構造体上に堆積される有機封止材料の量と比較して、より多くの量の有機封止材料が前記基板上に堆積されるように前記インクジェット堆積させるステップを制御するステップをさらに含む、請求項10に記載の方法。
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Application Number | Priority Date | Filing Date | Title |
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US3623008P | 2008-03-13 | 2008-03-13 | |
PCT/US2009/034266 WO2009114242A1 (en) | 2008-03-13 | 2009-02-17 | Water-barrier encapsulation method |
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JP2011513944A true JP2011513944A (ja) | 2011-04-28 |
JP2011513944A5 JP2011513944A5 (ja) | 2012-04-05 |
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US (2) | US7951620B2 (ja) |
JP (1) | JP2011513944A (ja) |
KR (1) | KR101455047B1 (ja) |
CN (2) | CN101971699A (ja) |
TW (1) | TWI499106B (ja) |
WO (1) | WO2009114242A1 (ja) |
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US10388909B2 (en) | 2015-01-16 | 2019-08-20 | Sharp Kabushiki Kaisha | Display device, bonding jig, bonding device, and stretching jig used for manufacturing the display device, and method for manufacturing display device |
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US7951620B2 (en) * | 2008-03-13 | 2011-05-31 | Applied Materials, Inc. | Water-barrier encapsulation method |
EP3020850B1 (en) | 2009-07-08 | 2018-08-29 | Aixtron SE | Apparatus for plasma processing |
US8765232B2 (en) | 2011-01-10 | 2014-07-01 | Plasmasi, Inc. | Apparatus and method for dielectric deposition |
CN103370806A (zh) * | 2011-02-07 | 2013-10-23 | 应用材料公司 | 用于封装有机发光二极管的方法 |
US8772066B2 (en) | 2011-02-08 | 2014-07-08 | Applied Materials, Inc. | Method for hybrid encapsulation of an organic light emitting diode |
US9299956B2 (en) | 2012-06-13 | 2016-03-29 | Aixtron, Inc. | Method for deposition of high-performance coatings and encapsulated electronic devices |
US10526708B2 (en) | 2012-06-19 | 2020-01-07 | Aixtron Se | Methods for forming thin protective and optical layers on substrates |
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US9397318B2 (en) | 2012-09-04 | 2016-07-19 | Applied Materials, Inc. | Method for hybrid encapsulation of an organic light emitting diode |
WO2014082306A1 (zh) * | 2012-11-30 | 2014-06-05 | 海洋王照明科技股份有限公司 | 一种有机电致发光器件及其制备方法 |
US9385342B2 (en) | 2013-07-30 | 2016-07-05 | Global Oled Technology Llc | Local seal for encapsulation of electro-optical element on a flexible substrate |
US9494792B2 (en) | 2013-07-30 | 2016-11-15 | Global Oled Technology Llc | Local seal for encapsulation of electro-optical element on a flexible substrate |
US9287522B2 (en) | 2013-07-30 | 2016-03-15 | Global Oled Technology Llc | Local seal for encapsulation of electro-optical element on a flexible substrate |
KR101561102B1 (ko) * | 2014-07-01 | 2015-10-19 | 주식회사 이녹스 | 유기전자장치용 접착필름 및 이를 포함하는 유기전자장치용 봉지재 |
CN114203927A (zh) * | 2021-12-02 | 2022-03-18 | 长春若水科技发展有限公司 | 一种柔性黄光有机发光二极管及其制备方法 |
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KR20110007128A (ko) | 2011-01-21 |
TWI499106B (zh) | 2015-09-01 |
CN101971699A (zh) | 2011-02-09 |
US7951620B2 (en) | 2011-05-31 |
US20110297921A1 (en) | 2011-12-08 |
US20090230425A1 (en) | 2009-09-17 |
CN104752626A (zh) | 2015-07-01 |
KR101455047B1 (ko) | 2014-10-27 |
TW200950173A (en) | 2009-12-01 |
WO2009114242A1 (en) | 2009-09-17 |
US8404502B2 (en) | 2013-03-26 |
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