JP2011513944A - 水障壁封止方法 - Google Patents

水障壁封止方法 Download PDF

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Publication number
JP2011513944A
JP2011513944A JP2010550721A JP2010550721A JP2011513944A JP 2011513944 A JP2011513944 A JP 2011513944A JP 2010550721 A JP2010550721 A JP 2010550721A JP 2010550721 A JP2010550721 A JP 2010550721A JP 2011513944 A JP2011513944 A JP 2011513944A
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JP
Japan
Prior art keywords
layer
light emitting
organic
emitting diode
organic light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2010550721A
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English (en)
Japanese (ja)
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JP2011513944A5 (enExample
Inventor
タエ キュング ウォン
ホセ マニュエル ディエゲス カンポ，
サンジェイ ディー． ヤーダヴ，
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Applied Materials Inc
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Applied Materials Inc
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Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of JP2011513944A publication Critical patent/JP2011513944A/ja
Publication of JP2011513944A5 publication Critical patent/JP2011513944A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/14—Carrier transporting layers
    • H10K50/15—Hole transporting layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/14—Carrier transporting layers
    • H10K50/16—Electron transporting layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H10K50/8445—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H10K59/8731—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)
JP2010550721A 2008-03-13 2009-02-17 水障壁封止方法 Pending JP2011513944A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US3623008P 2008-03-13 2008-03-13
PCT/US2009/034266 WO2009114242A1 (en) 2008-03-13 2009-02-17 Water-barrier encapsulation method

Publications (2)

Publication Number Publication Date
JP2011513944A true JP2011513944A (ja) 2011-04-28
JP2011513944A5 JP2011513944A5 (enExample) 2012-04-05

Family

ID=41062054

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010550721A Pending JP2011513944A (ja) 2008-03-13 2009-02-17 水障壁封止方法

Country Status (6)

Country Link
US (2) US7951620B2 (enExample)
JP (1) JP2011513944A (enExample)
KR (1) KR101455047B1 (enExample)
CN (2) CN104752626A (enExample)
TW (1) TWI499106B (enExample)
WO (1) WO2009114242A1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019071268A (ja) * 2017-10-06 2019-05-09 株式会社Ｊｏｌｅｄ 有機ｅｌ表示パネルの製造方法及び封止層形成装置
US10388909B2 (en) 2015-01-16 2019-08-20 Sharp Kabushiki Kaisha Display device, bonding jig, bonding device, and stretching jig used for manufacturing the display device, and method for manufacturing display device

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* Cited by examiner, † Cited by third party
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US7951620B2 (en) * 2008-03-13 2011-05-31 Applied Materials, Inc. Water-barrier encapsulation method
KR101842675B1 (ko) 2009-07-08 2018-03-27 플라즈마시, 인크. 플라즈마 처리를 위한 장치 및 방법
US8765232B2 (en) 2011-01-10 2014-07-01 Plasmasi, Inc. Apparatus and method for dielectric deposition
KR101698462B1 (ko) * 2011-02-07 2017-01-20 어플라이드 머티어리얼스, 인코포레이티드 유기 발광 다이오드를 캡슐화하기 위한 방법
TWI577066B (zh) 2011-02-08 2017-04-01 應用材料股份有限公司 有機發光二極體的混合式封裝方法
US9299956B2 (en) 2012-06-13 2016-03-29 Aixtron, Inc. Method for deposition of high-performance coatings and encapsulated electronic devices
US10526708B2 (en) 2012-06-19 2020-01-07 Aixtron Se Methods for forming thin protective and optical layers on substrates
CN102751307A (zh) * 2012-06-29 2012-10-24 昆山工研院新型平板显示技术中心有限公司 一种可进行透明不透明转换的显示器
US9397318B2 (en) 2012-09-04 2016-07-19 Applied Materials, Inc. Method for hybrid encapsulation of an organic light emitting diode
WO2014082306A1 (zh) * 2012-11-30 2014-06-05 海洋王照明科技股份有限公司 一种有机电致发光器件及其制备方法
US9385342B2 (en) 2013-07-30 2016-07-05 Global Oled Technology Llc Local seal for encapsulation of electro-optical element on a flexible substrate
US9494792B2 (en) 2013-07-30 2016-11-15 Global Oled Technology Llc Local seal for encapsulation of electro-optical element on a flexible substrate
US9287522B2 (en) 2013-07-30 2016-03-15 Global Oled Technology Llc Local seal for encapsulation of electro-optical element on a flexible substrate
KR101561102B1 (ko) * 2014-07-01 2015-10-19 주식회사 이녹스 유기전자장치용 접착필름 및 이를 포함하는 유기전자장치용 봉지재
CN114203927A (zh) * 2021-12-02 2022-03-18 长春若水科技发展有限公司 一种柔性黄光有机发光二极管及其制备方法

Citations (4)

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JPH08512256A (ja) * 1993-10-04 1996-12-24 カタリナ コーティングス，インコーポレイティド コンデンサーの誘電体及び酸素バリヤーを形成するのに有用な架橋アクリレートコーティング材料
JP2002532850A (ja) * 1998-12-16 2002-10-02 バッテル・メモリアル・インスティチュート 有機発光デバイスのための環境バリヤー材料及びその製造方法
JP2004281189A (ja) * 2003-03-14 2004-10-07 Optrex Corp 上面発光型有機エレクトロルミネセンス表示素子およびその製造方法
JP2004537448A (ja) * 2001-08-20 2004-12-16 ノバ−プラズマ インコーポレイテッド 気体および蒸気に対する浸透度の低いコーティング

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US5686360A (en) * 1995-11-30 1997-11-11 Motorola Passivation of organic devices
EP1145338B1 (en) * 1998-12-16 2012-12-05 Samsung Display Co., Ltd. Environmental barrier material for organic light emitting device and method of making
WO2004014644A1 (ja) * 2002-08-07 2004-02-19 Kabushiki Kaisha Toyota Chuo Kenkyusho 密着層を備える積層体及び保護膜を備える積層体
US7169472B2 (en) * 2003-02-13 2007-01-30 Jds Uniphase Corporation Robust multilayer magnetic pigments and foils
CN1442872A (zh) * 2003-04-17 2003-09-17 上海交通大学 多层纳米透明导电膜及其制备方法
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CN1799153A (zh) * 2003-05-30 2006-07-05 奥斯兰姆奥普托半导体有限责任公司 有机电子器件
US20050266679A1 (en) * 2004-05-26 2005-12-01 Jing-Cheng Lin Barrier structure for semiconductor devices
US7220687B2 (en) * 2004-06-25 2007-05-22 Applied Materials, Inc. Method to improve water-barrier performance by changing film surface morphology
WO2006007313A2 (en) 2004-06-25 2006-01-19 Applied Materials, Inc. Improving water-barrier performance of an encapsulating film
US7214600B2 (en) * 2004-06-25 2007-05-08 Applied Materials, Inc. Method to improve transmittance of an encapsulating film
DE102004061464B4 (de) * 2004-12-17 2008-12-11 Schott Ag Substrat mit feinlaminarer Barriereschutzschicht und Verfahren zu dessen Herstellung
JP2006278139A (ja) * 2005-03-29 2006-10-12 Tohoku Pioneer Corp 自発光パネル及びその製造方法
JP4600254B2 (ja) * 2005-11-22 2010-12-15 セイコーエプソン株式会社 発光装置および電子機器
US8003999B2 (en) * 2005-12-30 2011-08-23 Samsung Mobile Display Co., Ltd. Organic light emitting device
TWI328518B (en) * 2006-03-24 2010-08-11 Applied Materials Inc Methods and apparatus for inkjet printing using multiple sets of print heads
US7560747B2 (en) * 2007-05-01 2009-07-14 Eastman Kodak Company Light-emitting device having improved light output
US7951620B2 (en) * 2008-03-13 2011-05-31 Applied Materials, Inc. Water-barrier encapsulation method

Patent Citations (4)

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Publication number Priority date Publication date Assignee Title
JPH08512256A (ja) * 1993-10-04 1996-12-24 カタリナ コーティングス，インコーポレイティド コンデンサーの誘電体及び酸素バリヤーを形成するのに有用な架橋アクリレートコーティング材料
JP2002532850A (ja) * 1998-12-16 2002-10-02 バッテル・メモリアル・インスティチュート 有機発光デバイスのための環境バリヤー材料及びその製造方法
JP2004537448A (ja) * 2001-08-20 2004-12-16 ノバ−プラズマ インコーポレイテッド 気体および蒸気に対する浸透度の低いコーティング
JP2004281189A (ja) * 2003-03-14 2004-10-07 Optrex Corp 上面発光型有機エレクトロルミネセンス表示素子およびその製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10388909B2 (en) 2015-01-16 2019-08-20 Sharp Kabushiki Kaisha Display device, bonding jig, bonding device, and stretching jig used for manufacturing the display device, and method for manufacturing display device
JP2019071268A (ja) * 2017-10-06 2019-05-09 株式会社Ｊｏｌｅｄ 有機ｅｌ表示パネルの製造方法及び封止層形成装置

Also Published As

Publication number Publication date
TWI499106B (zh) 2015-09-01
CN101971699A (zh) 2011-02-09
US20090230425A1 (en) 2009-09-17
US8404502B2 (en) 2013-03-26
TW200950173A (en) 2009-12-01
US7951620B2 (en) 2011-05-31
WO2009114242A1 (en) 2009-09-17
KR101455047B1 (ko) 2014-10-27
CN104752626A (zh) 2015-07-01
US20110297921A1 (en) 2011-12-08
KR20110007128A (ko) 2011-01-21

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