KR101455047B1 - 물 배리어 캡슐화 방법 - Google Patents

물 배리어 캡슐화 방법 Download PDF

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Publication number
KR101455047B1
KR101455047B1 KR1020107022767A KR20107022767A KR101455047B1 KR 101455047 B1 KR101455047 B1 KR 101455047B1 KR 1020107022767 A KR1020107022767 A KR 1020107022767A KR 20107022767 A KR20107022767 A KR 20107022767A KR 101455047 B1 KR101455047 B1 KR 101455047B1
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South Korea
Prior art keywords
light emitting
emitting diode
organic light
layer
layers
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Korean (ko)
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KR20110007128A (ko
Inventor
태경 원
호세 마누엘 디귀즈 캄포
산자이 디. 야다브
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어플라이드 머티어리얼스, 인코포레이티드
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/14—Carrier transporting layers
    • H10K50/15—Hole transporting layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/14—Carrier transporting layers
    • H10K50/16—Electron transporting layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H10K50/8445—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H10K59/8731—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)
KR1020107022767A 2008-03-13 2009-02-17 물 배리어 캡슐화 방법 Active KR101455047B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US3623008P 2008-03-13 2008-03-13
US61/036,230 2008-03-13
PCT/US2009/034266 WO2009114242A1 (en) 2008-03-13 2009-02-17 Water-barrier encapsulation method

Publications (2)

Publication Number Publication Date
KR20110007128A KR20110007128A (ko) 2011-01-21
KR101455047B1 true KR101455047B1 (ko) 2014-10-27

Family

ID=41062054

Family Applications (1)

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KR1020107022767A Active KR101455047B1 (ko) 2008-03-13 2009-02-17 물 배리어 캡슐화 방법

Country Status (6)

Country Link
US (2) US7951620B2 (enExample)
JP (1) JP2011513944A (enExample)
KR (1) KR101455047B1 (enExample)
CN (2) CN104752626A (enExample)
TW (1) TWI499106B (enExample)
WO (1) WO2009114242A1 (enExample)

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US7951620B2 (en) * 2008-03-13 2011-05-31 Applied Materials, Inc. Water-barrier encapsulation method
EP2451991B1 (en) 2009-07-08 2019-07-03 Aixtron SE Method for plasma processing
US8765232B2 (en) 2011-01-10 2014-07-01 Plasmasi, Inc. Apparatus and method for dielectric deposition
CN103370806A (zh) * 2011-02-07 2013-10-23 应用材料公司 用于封装有机发光二极管的方法
US8772066B2 (en) 2011-02-08 2014-07-08 Applied Materials, Inc. Method for hybrid encapsulation of an organic light emitting diode
US9299956B2 (en) 2012-06-13 2016-03-29 Aixtron, Inc. Method for deposition of high-performance coatings and encapsulated electronic devices
US10526708B2 (en) 2012-06-19 2020-01-07 Aixtron Se Methods for forming thin protective and optical layers on substrates
CN102751307A (zh) * 2012-06-29 2012-10-24 昆山工研院新型平板显示技术中心有限公司 一种可进行透明不透明转换的显示器
US9397318B2 (en) 2012-09-04 2016-07-19 Applied Materials, Inc. Method for hybrid encapsulation of an organic light emitting diode
WO2014082306A1 (zh) * 2012-11-30 2014-06-05 海洋王照明科技股份有限公司 一种有机电致发光器件及其制备方法
US9385342B2 (en) 2013-07-30 2016-07-05 Global Oled Technology Llc Local seal for encapsulation of electro-optical element on a flexible substrate
US9287522B2 (en) 2013-07-30 2016-03-15 Global Oled Technology Llc Local seal for encapsulation of electro-optical element on a flexible substrate
US9494792B2 (en) 2013-07-30 2016-11-15 Global Oled Technology Llc Local seal for encapsulation of electro-optical element on a flexible substrate
KR101561102B1 (ko) * 2014-07-01 2015-10-19 주식회사 이녹스 유기전자장치용 접착필름 및 이를 포함하는 유기전자장치용 봉지재
CN107113926B (zh) 2015-01-16 2019-02-05 夏普株式会社 显示装置、用于制作该显示装置的贴合治具、贴合装置、拉伸治具以及显示装置的制造方法
JP6757363B2 (ja) * 2017-10-06 2020-09-16 株式会社Ｊｏｌｅｄ 有機ｅｌ表示パネルの製造方法及び封止層形成装置
CN114203927A (zh) * 2021-12-02 2022-03-18 长春若水科技发展有限公司 一种柔性黄光有机发光二极管及其制备方法

Citations (4)

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JP2002532850A (ja) 1998-12-16 2002-10-02 バッテル・メモリアル・インスティチュート 有機発光デバイスのための環境バリヤー材料及びその製造方法
JP2004281189A (ja) 2003-03-14 2004-10-07 Optrex Corp 上面発光型有機エレクトロルミネセンス表示素子およびその製造方法
US20040238846A1 (en) 2003-05-30 2004-12-02 Georg Wittmann Organic electronic device
JP2004537448A (ja) 2001-08-20 2004-12-16 ノバ−プラズマ インコーポレイテッド 気体および蒸気に対する浸透度の低いコーティング

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WO1995010117A1 (en) * 1993-10-04 1995-04-13 Catalina Coatings, Inc. Cross-linked acrylate coating material useful for forming capacitor dielectrics and oxygen barriers
US5686360A (en) * 1995-11-30 1997-11-11 Motorola Passivation of organic devices
EP1145338B1 (en) * 1998-12-16 2012-12-05 Samsung Display Co., Ltd. Environmental barrier material for organic light emitting device and method of making
CN1675058B (zh) * 2002-08-07 2010-12-29 株式会社丰田中央研究所 包括粘合层的层压产品和包括保护膜的层压产品
US7169472B2 (en) * 2003-02-13 2007-01-30 Jds Uniphase Corporation Robust multilayer magnetic pigments and foils
CN1442872A (zh) * 2003-04-17 2003-09-17 上海交通大学 多层纳米透明导电膜及其制备方法
CN1799153A (zh) * 2003-05-30 2006-07-05 奥斯兰姆奥普托半导体有限责任公司 有机电子器件
US20050266679A1 (en) * 2004-05-26 2005-12-01 Jing-Cheng Lin Barrier structure for semiconductor devices
US7214600B2 (en) * 2004-06-25 2007-05-08 Applied Materials, Inc. Method to improve transmittance of an encapsulating film
US7220687B2 (en) * 2004-06-25 2007-05-22 Applied Materials, Inc. Method to improve water-barrier performance by changing film surface morphology
JP5848862B2 (ja) 2004-06-25 2016-01-27 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ カプセル化膜の遮水性能の改善
DE102004061464B4 (de) * 2004-12-17 2008-12-11 Schott Ag Substrat mit feinlaminarer Barriereschutzschicht und Verfahren zu dessen Herstellung
JP2006278139A (ja) * 2005-03-29 2006-10-12 Tohoku Pioneer Corp 自発光パネル及びその製造方法
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KR100838073B1 (ko) * 2005-12-30 2008-06-13 삼성에스디아이 주식회사 유기 발광 소자 및 그 제조 방법
CN101045395A (zh) * 2006-03-24 2007-10-03 应用材料股份有限公司 用于采用多组打印头的喷墨打印的方法和装置
US7560747B2 (en) * 2007-05-01 2009-07-14 Eastman Kodak Company Light-emitting device having improved light output
US7951620B2 (en) * 2008-03-13 2011-05-31 Applied Materials, Inc. Water-barrier encapsulation method

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002532850A (ja) 1998-12-16 2002-10-02 バッテル・メモリアル・インスティチュート 有機発光デバイスのための環境バリヤー材料及びその製造方法
JP2004537448A (ja) 2001-08-20 2004-12-16 ノバ−プラズマ インコーポレイテッド 気体および蒸気に対する浸透度の低いコーティング
JP2004281189A (ja) 2003-03-14 2004-10-07 Optrex Corp 上面発光型有機エレクトロルミネセンス表示素子およびその製造方法
US20040238846A1 (en) 2003-05-30 2004-12-02 Georg Wittmann Organic electronic device

Also Published As

Publication number Publication date
KR20110007128A (ko) 2011-01-21
TWI499106B (zh) 2015-09-01
CN104752626A (zh) 2015-07-01
US7951620B2 (en) 2011-05-31
US20110297921A1 (en) 2011-12-08
US20090230425A1 (en) 2009-09-17
TW200950173A (en) 2009-12-01
CN101971699A (zh) 2011-02-09
WO2009114242A1 (en) 2009-09-17
US8404502B2 (en) 2013-03-26
JP2011513944A (ja) 2011-04-28

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