JP2011513944A5 - - Google Patents

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Publication number
JP2011513944A5
JP2011513944A5 JP2010550721A JP2010550721A JP2011513944A5 JP 2011513944 A5 JP2011513944 A5 JP 2011513944A5 JP 2010550721 A JP2010550721 A JP 2010550721A JP 2010550721 A JP2010550721 A JP 2010550721A JP 2011513944 A5 JP2011513944 A5 JP 2011513944A5
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JP
Japan
Prior art keywords
light emitting
emitting diode
layer
organic light
layers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2010550721A
Other languages
English (en)
Japanese (ja)
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JP2011513944A (ja
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Publication date
Application filed filed Critical
Priority claimed from PCT/US2009/034266 external-priority patent/WO2009114242A1/en
Publication of JP2011513944A publication Critical patent/JP2011513944A/ja
Publication of JP2011513944A5 publication Critical patent/JP2011513944A5/ja
Pending legal-status Critical Current

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JP2010550721A 2008-03-13 2009-02-17 水障壁封止方法 Pending JP2011513944A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US3623008P 2008-03-13 2008-03-13
PCT/US2009/034266 WO2009114242A1 (en) 2008-03-13 2009-02-17 Water-barrier encapsulation method

Publications (2)

Publication Number Publication Date
JP2011513944A JP2011513944A (ja) 2011-04-28
JP2011513944A5 true JP2011513944A5 (enExample) 2012-04-05

Family

ID=41062054

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010550721A Pending JP2011513944A (ja) 2008-03-13 2009-02-17 水障壁封止方法

Country Status (6)

Country Link
US (2) US7951620B2 (enExample)
JP (1) JP2011513944A (enExample)
KR (1) KR101455047B1 (enExample)
CN (2) CN104752626A (enExample)
TW (1) TWI499106B (enExample)
WO (1) WO2009114242A1 (enExample)

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US7951620B2 (en) * 2008-03-13 2011-05-31 Applied Materials, Inc. Water-barrier encapsulation method
WO2011006018A2 (en) 2009-07-08 2011-01-13 Plasmasi, Inc. Apparatus and method for plasma processing
US8765232B2 (en) 2011-01-10 2014-07-01 Plasmasi, Inc. Apparatus and method for dielectric deposition
WO2012109113A2 (en) * 2011-02-07 2012-08-16 Applied Materials, Inc. Method for encapsulating an organic light emitting diode
CN103348502B (zh) 2011-02-08 2016-01-27 应用材料公司 有机发光二极管的混合式封装方法
US9299956B2 (en) 2012-06-13 2016-03-29 Aixtron, Inc. Method for deposition of high-performance coatings and encapsulated electronic devices
US10526708B2 (en) 2012-06-19 2020-01-07 Aixtron Se Methods for forming thin protective and optical layers on substrates
CN102751307A (zh) * 2012-06-29 2012-10-24 昆山工研院新型平板显示技术中心有限公司 一种可进行透明不透明转换的显示器
US9397318B2 (en) 2012-09-04 2016-07-19 Applied Materials, Inc. Method for hybrid encapsulation of an organic light emitting diode
WO2014082306A1 (zh) * 2012-11-30 2014-06-05 海洋王照明科技股份有限公司 一种有机电致发光器件及其制备方法
US9287522B2 (en) 2013-07-30 2016-03-15 Global Oled Technology Llc Local seal for encapsulation of electro-optical element on a flexible substrate
US9385342B2 (en) 2013-07-30 2016-07-05 Global Oled Technology Llc Local seal for encapsulation of electro-optical element on a flexible substrate
US9494792B2 (en) 2013-07-30 2016-11-15 Global Oled Technology Llc Local seal for encapsulation of electro-optical element on a flexible substrate
KR101561102B1 (ko) * 2014-07-01 2015-10-19 주식회사 이녹스 유기전자장치용 접착필름 및 이를 포함하는 유기전자장치용 봉지재
WO2016114373A1 (ja) 2015-01-16 2016-07-21 シャープ株式会社 表示装置、その表示装置を作製するために用いる貼り合わせ治具、貼り合わせ装置、伸ばし治具、及び表示装置の製造方法
JP6757363B2 (ja) * 2017-10-06 2020-09-16 株式会社Joled 有機el表示パネルの製造方法及び封止層形成装置
CN114203927A (zh) * 2021-12-02 2022-03-18 长春若水科技发展有限公司 一种柔性黄光有机发光二极管及其制备方法

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