WO2011031098A3 - 반도체 발광소자 - Google Patents
반도체 발광소자 Download PDFInfo
- Publication number
- WO2011031098A3 WO2011031098A3 PCT/KR2010/006191 KR2010006191W WO2011031098A3 WO 2011031098 A3 WO2011031098 A3 WO 2011031098A3 KR 2010006191 W KR2010006191 W KR 2010006191W WO 2011031098 A3 WO2011031098 A3 WO 2011031098A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- substrate
- emitting device
- light emitting
- semiconductor light
- material layer
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title abstract 5
- 239000000463 material Substances 0.000 abstract 6
- 239000000758 substrate Substances 0.000 abstract 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 4
- 239000002184 metal Substances 0.000 abstract 4
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 abstract 2
- 229910052681 coesite Inorganic materials 0.000 abstract 2
- 229910052906 cristobalite Inorganic materials 0.000 abstract 2
- 239000000377 silicon dioxide Substances 0.000 abstract 2
- 229910052682 stishovite Inorganic materials 0.000 abstract 2
- 229910052905 tridymite Inorganic materials 0.000 abstract 2
- 230000000149 penetrating effect Effects 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/44—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
- H01L33/46—Reflective coating, e.g. dielectric Bragg reflector
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Led Devices (AREA)
Abstract
본 개시는 기판; 기판의 상면에 형성되며 전자와 정공의 재결합에 의해 빛을 방출하는 활성층을 포함하는 복수의 반도체층; 기판의 하면에 형성되며 기판을 투과한 빛을 반사시키는 금속층; 기판의 하면과 금속층 사이에 위치되며 SiO2로 형성된 제1 물질층; 제1 물질층과 금속층 사이에 위치되며 TiO2로 형성된 제2 물질층; 및 제2 물질층과 금속층 사이에 위치되며 SiO2로 형성된 제3 물질층;을 포함하며, 제1,2,3 물질층은 기판의 하면에서 하방으로 차례로 적층되고 서로 다른 두께를 갖는 것을 특징으로 하는 반도체 발광소자를 제공한다.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020090085389A KR101100681B1 (ko) | 2009-09-10 | 2009-09-10 | 반도체 발광소자 |
KR10-2009-0085389 | 2009-09-10 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2011031098A2 WO2011031098A2 (ko) | 2011-03-17 |
WO2011031098A3 true WO2011031098A3 (ko) | 2011-06-23 |
Family
ID=43732973
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/KR2010/006191 WO2011031098A2 (ko) | 2009-09-10 | 2010-09-10 | 반도체 발광소자 |
Country Status (2)
Country | Link |
---|---|
KR (1) | KR101100681B1 (ko) |
WO (1) | WO2011031098A2 (ko) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9461201B2 (en) | 2007-11-14 | 2016-10-04 | Cree, Inc. | Light emitting diode dielectric mirror |
US7915629B2 (en) | 2008-12-08 | 2011-03-29 | Cree, Inc. | Composite high reflectivity layer |
US9362459B2 (en) | 2009-09-02 | 2016-06-07 | United States Department Of Energy | High reflectivity mirrors and method for making same |
US9435493B2 (en) | 2009-10-27 | 2016-09-06 | Cree, Inc. | Hybrid reflector system for lighting device |
US9012938B2 (en) | 2010-04-09 | 2015-04-21 | Cree, Inc. | High reflective substrate of light emitting devices with improved light output |
US9105824B2 (en) | 2010-04-09 | 2015-08-11 | Cree, Inc. | High reflective board or substrate for LEDs |
US8764224B2 (en) | 2010-08-12 | 2014-07-01 | Cree, Inc. | Luminaire with distributed LED sources |
US8680556B2 (en) | 2011-03-24 | 2014-03-25 | Cree, Inc. | Composite high reflectivity layer |
US10243121B2 (en) | 2011-06-24 | 2019-03-26 | Cree, Inc. | High voltage monolithic LED chip with improved reliability |
US9728676B2 (en) | 2011-06-24 | 2017-08-08 | Cree, Inc. | High voltage monolithic LED chip |
US8686429B2 (en) | 2011-06-24 | 2014-04-01 | Cree, Inc. | LED structure with enhanced mirror reflectivity |
US8624482B2 (en) * | 2011-09-01 | 2014-01-07 | Toshiba Techno Center Inc. | Distributed bragg reflector for reflecting light of multiple wavelengths from an LED |
CN103972352B (zh) * | 2013-01-31 | 2019-05-31 | 晶元光电股份有限公司 | 具有高效能反射结构的发光元件 |
KR102115564B1 (ko) | 2013-09-24 | 2020-05-27 | 삼성디스플레이 주식회사 | 표시기판 및 이를 포함하는 표시패널 |
US10658546B2 (en) | 2015-01-21 | 2020-05-19 | Cree, Inc. | High efficiency LEDs and methods of manufacturing |
EP3144032A1 (en) * | 2015-09-15 | 2017-03-22 | Pixium Vision SA | Photosensitive pixel structure with front side coating |
CN109166953B (zh) * | 2018-07-03 | 2020-04-10 | 华灿光电股份有限公司 | 一种发光二极管芯片及其制作方法 |
CN111668235B (zh) * | 2020-06-08 | 2023-10-17 | Tcl华星光电技术有限公司 | 显示面板及其制备方法 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20060091509A (ko) * | 2005-02-15 | 2006-08-21 | 삼성전자주식회사 | 양자점 수직공진형 표면방출 레이저 및 그 제조방법 |
KR20060134491A (ko) * | 2005-06-22 | 2006-12-28 | 김성진 | 질화물 반도체 발광 다이오드 및 그 제조 방법 |
KR20070013324A (ko) * | 2004-05-18 | 2007-01-30 | 크리, 인코포레이티드 | 3족 질화물 소자를 제조하는 방법 및 그 방법을 이용하여제조된 소자 |
JP2008211164A (ja) * | 2007-01-29 | 2008-09-11 | Matsushita Electric Ind Co Ltd | 窒化物半導体発光装置及びその製造方法 |
JP2009016505A (ja) * | 2007-07-03 | 2009-01-22 | Showa Denko Kk | Iii族窒化物化合物半導体発光素子 |
KR20090080218A (ko) * | 2008-01-21 | 2009-07-24 | 엘지이노텍 주식회사 | 질화물계 발광 소자 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11126925A (ja) | 1997-10-21 | 1999-05-11 | Toyoda Gosei Co Ltd | 窒化ガリウム系化合物半導体発光素子 |
KR20020081947A (ko) * | 2001-04-20 | 2002-10-30 | 주식회사 옵토웨이퍼테크 | 다중반사막을 포함한 발광소자 및 그 제조방법 |
KR20040081829A (ko) * | 2003-03-17 | 2004-09-23 | 엘지이노텍 주식회사 | 발광 다이오드의 반사막 구조 |
KR20080017180A (ko) * | 2006-08-21 | 2008-02-26 | 삼성전기주식회사 | 반도체 발광장치 |
-
2009
- 2009-09-10 KR KR1020090085389A patent/KR101100681B1/ko not_active IP Right Cessation
-
2010
- 2010-09-10 WO PCT/KR2010/006191 patent/WO2011031098A2/ko active Application Filing
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20070013324A (ko) * | 2004-05-18 | 2007-01-30 | 크리, 인코포레이티드 | 3족 질화물 소자를 제조하는 방법 및 그 방법을 이용하여제조된 소자 |
KR20060091509A (ko) * | 2005-02-15 | 2006-08-21 | 삼성전자주식회사 | 양자점 수직공진형 표면방출 레이저 및 그 제조방법 |
KR20060134491A (ko) * | 2005-06-22 | 2006-12-28 | 김성진 | 질화물 반도체 발광 다이오드 및 그 제조 방법 |
JP2008211164A (ja) * | 2007-01-29 | 2008-09-11 | Matsushita Electric Ind Co Ltd | 窒化物半導体発光装置及びその製造方法 |
JP2009016505A (ja) * | 2007-07-03 | 2009-01-22 | Showa Denko Kk | Iii族窒化物化合物半導体発光素子 |
KR20090080218A (ko) * | 2008-01-21 | 2009-07-24 | 엘지이노텍 주식회사 | 질화물계 발광 소자 |
Also Published As
Publication number | Publication date |
---|---|
KR101100681B1 (ko) | 2012-01-03 |
KR20110027341A (ko) | 2011-03-16 |
WO2011031098A2 (ko) | 2011-03-17 |
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