WO2010044561A3 - 3족 질화물 반도체 발광소자 - Google Patents
3족 질화물 반도체 발광소자 Download PDFInfo
- Publication number
- WO2010044561A3 WO2010044561A3 PCT/KR2009/005706 KR2009005706W WO2010044561A3 WO 2010044561 A3 WO2010044561 A3 WO 2010044561A3 KR 2009005706 W KR2009005706 W KR 2009005706W WO 2010044561 A3 WO2010044561 A3 WO 2010044561A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- nitride semiconductor
- group iii
- iii nitride
- emitting device
- light emitting
- Prior art date
Links
- 150000004767 nitrides Chemical class 0.000 title abstract 3
- 239000004065 semiconductor Substances 0.000 title abstract 3
- 239000000758 substrate Substances 0.000 abstract 2
- 230000006798 recombination Effects 0.000 abstract 1
- 238000005215 recombination Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/26—Materials of the light emitting region
- H01L33/30—Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table
- H01L33/32—Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table containing nitrogen
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/20—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0062—Processes for devices with an active region comprising only III-V compounds
- H01L33/0066—Processes for devices with an active region comprising only III-V compounds with a substrate not being a III-V compound
- H01L33/007—Processes for devices with an active region comprising only III-V compounds with a substrate not being a III-V compound comprising nitride compounds
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Led Devices (AREA)
Abstract
본 개시는 기판; 기판 위에 위치하며, 전자와 정공의 재결합을 통해 빛을 생성시키는 활성층을 구비하는 복수개의 3족 질화물 반도체층; 그리고, 활성층에서 생성된 빛을 스캐터링하는 면;으로서, 식각된 제1 면과 제1 면을 덮는 제2 면을 구비하는 스캐터링 면;을 포함하는 것을 특징으로 하는 3족 질화물 반도체 발광소자에 관한 것이다.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/648,692 US20100102353A1 (en) | 2008-10-15 | 2009-12-29 | III-Nitride Semiconductor Light Emitting Device |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2008-0101155 | 2008-10-15 | ||
KR1020080101155A KR101009651B1 (ko) | 2008-10-15 | 2008-10-15 | 3족 질화물 반도체 발광소자 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/648,692 Continuation US20100102353A1 (en) | 2008-10-15 | 2009-12-29 | III-Nitride Semiconductor Light Emitting Device |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2010044561A2 WO2010044561A2 (ko) | 2010-04-22 |
WO2010044561A3 true WO2010044561A3 (ko) | 2010-08-05 |
Family
ID=42107018
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/KR2009/005706 WO2010044561A2 (ko) | 2008-10-15 | 2009-10-07 | 3족 질화물 반도체 발광소자 |
Country Status (3)
Country | Link |
---|---|
US (1) | US20100102353A1 (ko) |
KR (1) | KR101009651B1 (ko) |
WO (1) | WO2010044561A2 (ko) |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101008285B1 (ko) * | 2005-10-28 | 2011-01-13 | 주식회사 에피밸리 | 3족 질화물 반도체 발광소자 |
US8476658B2 (en) | 2009-11-25 | 2013-07-02 | Jing Jie Dai | Semiconductor light-emitting devices |
KR100993093B1 (ko) | 2010-02-04 | 2010-11-08 | 엘지이노텍 주식회사 | 발광 소자 및 발광 소자 패키지 |
EP2403019B1 (en) * | 2010-06-29 | 2017-02-22 | LG Innotek Co., Ltd. | Light emitting device |
US9245760B2 (en) | 2010-09-30 | 2016-01-26 | Infineon Technologies Ag | Methods of forming epitaxial layers on a porous semiconductor layer |
EP2509120A1 (en) | 2011-04-05 | 2012-10-10 | Imec | Semiconductor device and method |
KR101259999B1 (ko) | 2011-04-28 | 2013-05-06 | 서울옵토디바이스주식회사 | 반도체 기판 및 그 제조방법 |
JP5875249B2 (ja) * | 2011-04-28 | 2016-03-02 | ソウル バイオシス カンパニー リミテッドSeoul Viosys Co.,Ltd. | 半導体基板、半導体装置及びその製造方法 |
TW201248725A (en) * | 2011-05-31 | 2012-12-01 | Aceplux Optotech Inc | Epitaxial substrate with transparent cone, LED, and manufacturing method thereof. |
TWI528579B (zh) * | 2012-04-18 | 2016-04-01 | 新世紀光電股份有限公司 | 發光二極體元件 |
WO2014025003A1 (ja) * | 2012-08-06 | 2014-02-13 | 日本碍子株式会社 | 複合基板および機能素子 |
TWI565094B (zh) * | 2012-11-15 | 2017-01-01 | 財團法人工業技術研究院 | 氮化物半導體結構 |
CN103165771B (zh) * | 2013-03-28 | 2015-07-15 | 天津三安光电有限公司 | 一种具有埋入式孔洞结构的氮化物底层及其制备方法 |
US20140367693A1 (en) * | 2013-06-14 | 2014-12-18 | Epistar Corporation | Light-emitting device and the manufacturing method thereof |
US9362452B2 (en) * | 2013-06-14 | 2016-06-07 | Epistar Corporation | Light-emitting device and the manufacturing method thereof |
US20150325741A1 (en) * | 2013-08-21 | 2015-11-12 | Sharp Kabushiki Kaisha | Nitride semiconductor light emitting device |
TWI597863B (zh) * | 2013-10-22 | 2017-09-01 | 晶元光電股份有限公司 | 發光元件及其製造方法 |
KR102284535B1 (ko) * | 2014-11-12 | 2021-08-02 | 서울바이오시스 주식회사 | 발광 소자 및 그 제조 방법 |
JP2016066814A (ja) * | 2015-12-22 | 2016-04-28 | 株式会社東芝 | 半導体発光素子、窒化物半導体層成長用基板及び窒化物半導体ウェーハ |
KR102591149B1 (ko) * | 2021-12-20 | 2023-10-19 | 웨이브로드 주식회사 | 비발광 3족 질화물 반도체 적층체를 제조하는 방법 |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20050062832A (ko) * | 2003-12-18 | 2005-06-28 | 삼성코닝 주식회사 | 발광 소자용 질화물 반도체 템플레이트 제조 방법 |
US7052979B2 (en) * | 2001-02-14 | 2006-05-30 | Toyoda Gosei Co., Ltd. | Production method for semiconductor crystal and semiconductor luminous element |
KR100786777B1 (ko) * | 2006-03-28 | 2007-12-18 | 전북대학교산학협력단 | 반도체 구조물의 제조 방법 |
KR100809227B1 (ko) * | 2006-10-27 | 2008-03-05 | 삼성전기주식회사 | 질화물 반도체 발광소자 및 제조 방법 |
JP2008135778A (ja) * | 2000-09-18 | 2008-06-12 | Mitsubishi Cable Ind Ltd | 半導体発光素子 |
KR100863804B1 (ko) * | 2007-04-19 | 2008-10-16 | 고려대학교 산학협력단 | 질화물 발광소자 및 그 제조 방법 |
JP2009152334A (ja) * | 2007-11-28 | 2009-07-09 | Mitsubishi Chemicals Corp | GaN系LED素子、GaN系LED素子の製造方法およびGaN系LED素子製造用テンプレート |
KR100916375B1 (ko) * | 2007-06-27 | 2009-09-07 | 주식회사 에피밸리 | 반도체 발광소자 및 반도체 발광소자를 제조하는 방법 |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3026087B2 (ja) * | 1989-03-01 | 2000-03-27 | 豊田合成株式会社 | 窒化ガリウム系化合物半導体の気相成長方法 |
DE69126152T2 (de) * | 1990-02-28 | 1997-11-13 | Toyoda Gosei Kk | Lichtemittierende Halbleitervorrichtung mit Gallium-Nitrid-Verbindung |
JP3160914B2 (ja) * | 1990-12-26 | 2001-04-25 | 豊田合成株式会社 | 窒化ガリウム系化合物半導体レーザダイオード |
US5290393A (en) * | 1991-01-31 | 1994-03-01 | Nichia Kagaku Kogyo K.K. | Crystal growth method for gallium nitride-based compound semiconductor |
US5306662A (en) * | 1991-11-08 | 1994-04-26 | Nichia Chemical Industries, Ltd. | Method of manufacturing P-type compound semiconductor |
EP1450415A3 (en) * | 1993-04-28 | 2005-05-04 | Nichia Corporation | Gallium nitride-based III-V group compound semiconductor device |
TW253999B (ko) * | 1993-06-30 | 1995-08-11 | Hitachi Cable | |
US6194743B1 (en) * | 1997-12-15 | 2001-02-27 | Agilent Technologies, Inc. | Nitride semiconductor light emitting device having a silver p-contact |
US6335546B1 (en) * | 1998-07-31 | 2002-01-01 | Sharp Kabushiki Kaisha | Nitride semiconductor structure, method for producing a nitride semiconductor structure, and light emitting device |
US6940098B1 (en) * | 1999-03-17 | 2005-09-06 | Mitsubishi Cable Industries, Ltd. | Semiconductor base and its manufacturing method, and semiconductor crystal manufacturing method |
WO2001041225A2 (en) * | 1999-12-03 | 2001-06-07 | Cree Lighting Company | Enhanced light extraction in leds through the use of internal and external optical elements |
JP3556916B2 (ja) * | 2000-09-18 | 2004-08-25 | 三菱電線工業株式会社 | 半導体基材の製造方法 |
TW488088B (en) * | 2001-01-19 | 2002-05-21 | South Epitaxy Corp | Light emitting diode structure |
JP3690340B2 (ja) * | 2001-03-06 | 2005-08-31 | ソニー株式会社 | 半導体発光素子及びその製造方法 |
TW536841B (en) * | 2001-03-21 | 2003-06-11 | Mitsubishi Cable Ind Ltd | Semiconductor light emitting element |
JP4055503B2 (ja) * | 2001-07-24 | 2008-03-05 | 日亜化学工業株式会社 | 半導体発光素子 |
WO2005008795A1 (en) * | 2003-07-18 | 2005-01-27 | Epivalley Co., Ltd. | Nitride semiconductor light emitting device |
KR100714639B1 (ko) * | 2003-10-21 | 2007-05-07 | 삼성전기주식회사 | 발광 소자 |
KR100448352B1 (ko) * | 2003-11-28 | 2004-09-10 | 삼성전기주식회사 | GaN 기반 질화막의 형성방법 |
US7342261B2 (en) * | 2005-05-16 | 2008-03-11 | Dong-Sing Wuu | Light emitting device |
US7795600B2 (en) * | 2006-03-24 | 2010-09-14 | Goldeneye, Inc. | Wavelength conversion chip for use with light emitting diodes and method for making same |
WO2009002129A2 (en) * | 2007-06-27 | 2008-12-31 | Epivalley Co., Ltd. | Semiconductor light emitting device and method of manufacturing the same |
-
2008
- 2008-10-15 KR KR1020080101155A patent/KR101009651B1/ko active IP Right Grant
-
2009
- 2009-10-07 WO PCT/KR2009/005706 patent/WO2010044561A2/ko active Application Filing
- 2009-12-29 US US12/648,692 patent/US20100102353A1/en not_active Abandoned
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008135778A (ja) * | 2000-09-18 | 2008-06-12 | Mitsubishi Cable Ind Ltd | 半導体発光素子 |
US7052979B2 (en) * | 2001-02-14 | 2006-05-30 | Toyoda Gosei Co., Ltd. | Production method for semiconductor crystal and semiconductor luminous element |
KR20050062832A (ko) * | 2003-12-18 | 2005-06-28 | 삼성코닝 주식회사 | 발광 소자용 질화물 반도체 템플레이트 제조 방법 |
KR100786777B1 (ko) * | 2006-03-28 | 2007-12-18 | 전북대학교산학협력단 | 반도체 구조물의 제조 방법 |
KR100809227B1 (ko) * | 2006-10-27 | 2008-03-05 | 삼성전기주식회사 | 질화물 반도체 발광소자 및 제조 방법 |
KR100863804B1 (ko) * | 2007-04-19 | 2008-10-16 | 고려대학교 산학협력단 | 질화물 발광소자 및 그 제조 방법 |
KR100916375B1 (ko) * | 2007-06-27 | 2009-09-07 | 주식회사 에피밸리 | 반도체 발광소자 및 반도체 발광소자를 제조하는 방법 |
JP2009152334A (ja) * | 2007-11-28 | 2009-07-09 | Mitsubishi Chemicals Corp | GaN系LED素子、GaN系LED素子の製造方法およびGaN系LED素子製造用テンプレート |
Also Published As
Publication number | Publication date |
---|---|
KR101009651B1 (ko) | 2011-01-19 |
WO2010044561A2 (ko) | 2010-04-22 |
US20100102353A1 (en) | 2010-04-29 |
KR20100042041A (ko) | 2010-04-23 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2010044561A3 (ko) | 3족 질화물 반도체 발광소자 | |
TW200705709A (en) | Method of making a vertical light emitting diode | |
WO2010036055A3 (ko) | 3족 질화물 반도체 발광소자 | |
WO2008021988A3 (en) | Gan based led with improved light extraction efficiency and method for making the same | |
WO2009142391A3 (ko) | 발광소자 패키지 및 그 제조방법 | |
WO2008112064A3 (en) | Light emitting devices having current reducing structures and methods of forming light emitting devices having current reducing structures | |
WO2008118826A3 (en) | Systems and methods for producing white-light light emitting diodes | |
WO2009002129A3 (en) | Semiconductor light emitting device and method of manufacturing the same | |
EP2403022A3 (en) | Semiconductor light emitting diode and manufacturing method thereof | |
WO2009131319A3 (ko) | 반도체 발광소자 | |
WO2004075307A3 (en) | Group iii nitride contact structures for light emitting devices | |
WO2011091016A3 (en) | Solid state lighting device and associated methods of manufacturing | |
WO2009120990A3 (en) | Ultraviolet light emitting diode/laser diode with nested superlattice | |
WO2008030703A3 (en) | Coating process | |
WO2009120011A3 (ko) | 발광소자 및 그 제조방법 | |
WO2011112544A3 (en) | Light emitting diode wafer-level package with self-aligning features | |
WO2012164437A3 (en) | Light emitting device bonded to a support substrate | |
EP2363895A3 (en) | Light emitting device, method of manufacturing the same, light emitting device package | |
WO2007121739A3 (de) | Optoelektronisches halbleiterbauelement | |
WO2007032546A8 (en) | Production method for nitride semiconductor light emitting device | |
TW200731567A (en) | Production method for nitride semiconductor light emitting device | |
WO2010146390A3 (en) | Light emitting diodes | |
EP2378572A3 (en) | Electrode configuration for a light emitting device | |
WO2010013936A3 (en) | Semiconductor device, light emitting device and method of manufacturing the same | |
WO2010044642A3 (en) | Semiconductor light emitting device and method for manufacturing the same |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 09820711 Country of ref document: EP Kind code of ref document: A2 |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 09820711 Country of ref document: EP Kind code of ref document: A2 |