CN101960585A - 包括导线元件和带槽的微电子芯片并包括保持该导线元件的至少一个凸块的组件 - Google Patents

包括导线元件和带槽的微电子芯片并包括保持该导线元件的至少一个凸块的组件 Download PDF

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CN101960585A
CN101960585A CN2008801278464A CN200880127846A CN101960585A CN 101960585 A CN101960585 A CN 101960585A CN 2008801278464 A CN2008801278464 A CN 2008801278464A CN 200880127846 A CN200880127846 A CN 200880127846A CN 101960585 A CN101960585 A CN 101960585A
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wire element
projection
groove
assembly
diameter
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CN101960585B (zh
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让-布龙
多米尼克·维卡德
索菲·弗朗
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Commissariat a lEnergie Atomique et aux Energies Alternatives CEA
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Abstract

本发明涉及一种组件，其包括至少一个微电子芯片，该至少一个微电子芯片具有两个平行的主表面(1、2)和侧表面(3a、3b)，其中侧表面(3a、3b)的至少一个包括用于容纳导线元件(5)的纵向的槽(4)，该导线元件(5)的轴平行于槽(4)的纵向轴，槽由至少两个侧壁(10a、10b)定义。导线元件(5)在夹紧区域处连接到芯片，该夹紧区域在设置到侧壁(10a、10b)之一上的至少一个凸块(9)与所述凸块(9)对面的槽4的侧壁(10b)之间。夹紧区域的高度小于凸块(9)沿着槽(4)的纵向轴的直径。自由区域的高度对应于两个侧壁(10a、10b)分开的距离，并大于导线元件(5)的直径。

Description

包括导线元件和带槽的微电子芯片并包括保持该导线元件的至少一个凸块的组件
技术领域
本发明涉及一种包括至少一个微电子芯片的组件，该至少一个微电子芯片具有两个平行主表面和侧表面，至少一个侧表面包括用于容纳导线元件的纵向槽，该导线元件具有平行于该槽的纵向轴的轴，所述槽由至少两个侧壁定义出轮廓。
背景技术
当前存在许多将微电子芯片彼此机械连接且电连接的技术。常规技术在于当芯片已经形成在基板上并通过切割而被释放时在芯片之间建立刚性机械连接。接着，固定在刚性支撑物上的芯片在形成保护涂层之前被电连接。当芯片的连接存在很大的复杂性时，通常采用在刚性支撑物上建立连接的上述第一方法。然而，该方法的主要缺陷是采用刚性机械支撑物，其尤其不适用于在柔性结构中的集成。
由申请人提交的文件WO2008/025889描述了包括两个平行主表面1、2和侧表面3a、3b的微电子芯片，如图1所示。侧表面3a、3b中的至少一个包括槽4，该槽4设置有电连接元件并形成导线元件5的容纳空间，该导线元件5具有平行于槽4的纵向轴的轴。电连接元件通过对槽4镀金属法(metallization)来实现。通过与附加材料焊接、电解、粘接或嵌入，导线元件5能够被固定到槽4，该导线元件5的轴平行于槽4的纵向轴。嵌入到槽4中需要向导线元件5施加力，这会使槽4损坏或弱化。此外，根据槽4的长度，进行嵌入时施加的力会增大，因此，很难在不损坏芯片的情况下进行嵌入。由嵌入得到的强度保持的较弱，通常需要涉及附加胶或金属的加强相。
发明内容
本发明的目的是制造具有槽的芯片，该槽设计为通过嵌入而容纳导线元件，当导线元件被插入槽中时，限制施加到该导线上的力。
该目的通过以下事实实现：所述导线元件在夹紧区域处被固定到芯片，该夹紧区域在布置到侧壁之一上的至少一个凸块与槽的所述凸块对面的侧壁之间，所述夹紧区域的高度小于导线元件的直径；自由区域沿着槽的纵向轴布置在凸块的侧面，所述自由区域的高度对应于两个侧壁分开的距离，并大于导线元件的直径。
根据一设计，至少一个凸块是导电凸块。
根据第二设计，两个侧壁支撑以Z字形方式布置的凸块。
根据第三设计，凸块是棒形式的并且具有三角形截面的顶点。
根据可选实施方式，导线元件的直径大于凸块与槽的底部分开的距离，导线元件还与槽的底部接触。
根据一改进，导线元件包括覆盖有绝缘体的导电核心，核心的直径与绝缘体的厚度之和大于夹紧区域的高度。
附图说明
通过下文对本发明的具体实施方式进行详细描述，本发明的其它优点和特性将变得更加清楚，本发明的具体实施方式仅为了非限制的实例目的并且在附图中示出，附图中：
图1描绘根据现有技术的芯片。
图2描绘根据本发明的芯片。
图3描绘沿图2的A-A线的视图。
图4至图6示意性地描绘以芯片的槽为中心的视图。
图7至图9描绘槽中的凸块的形状和布置的可选实施方式。
具体实施方式
如图2所示，根据本发明的微电子芯片包括两个平行主表面1、2和侧表面3a和3b。侧表面3a和3b中的至少一个包括纵向槽4。槽4由两个侧壁10a和10b及底部11来定义出轮廓。槽设计为容纳具有纵向轴的导线元件，该导线元件的纵向轴平行于槽的纵向轴。
这种类型的芯片能够是两个微电子部件的组件形式或是尺寸基本相同并由间隔体8彼此接合的电子部件6和相对板7的组件形式。间隔体的尺寸小于部件的尺寸，间隔体的布置使得能够自然地获得至少一个槽4。如图2所示，芯片能包括布置在间隔体8的每侧的两个槽4。由此，由芯片的组件获得了槽4，避免在制造槽时易于损坏芯片的复杂机械步骤。每个槽是U形并由两个基本平行的侧壁10a和10b来定义，该两个基本平行的侧壁10a和10b通过槽4的底部11彼此接合。相对板7能够由玻璃、复合材料等制成。
每个槽4分别能够使导线元件5通过沿着平行于槽4的纵向轴的纵向轴嵌入而被插入。槽4包括用于固定导线元件5的装置，使得导线元件5能够被固定在槽4中。用于固定的这些装置由布置在槽4的侧壁10a、10b中至少一个上的至少一个凸块9组成。由此，导线元件5能够在至少一个凸块9与位于凸块9对面的侧壁10b或10a(图9中的10a)之间的夹紧区域处被固定到芯片。如图3所示，夹紧区域的高度为H1，该高度小于即将用于进行装配的导线元件的直径。夹紧区域的高度H1能由关于凸块9的顶点直到与对面的侧壁10a的界面的垂线来定义。自由区域进一步沿着槽的纵向轴布置到凸块9的侧面。自由区域的高度为H2，其相应于两个侧壁10a和10b分开的距离，该高度大于导线元件5的直径。自由区域能围绕每个凸块9，在槽包括多个凸块的情况下，凸块被自由区域分开。由此，在夹紧区域处的接触是针-点(pin-point)接触，导线元件5嵌入槽4中不需要大大的力。施加的力实际上相应于摩擦力，由每个凸块9施加的针-点接触形成导线元件5的简单且高质量的嵌入。
每个凸块9包括与侧壁10a或10b之一接触的基座以及朝向相对的侧壁10a或10b的方向的顶点，该基座布置在侧壁10a或10b之一上。当导线元件5被嵌入到槽4中时，每个凸块9与相对的侧壁10a或10b合作以起到机械夹的作用。如图4所示，当导线元件5插入到槽4中时，导线元件5被针-点接触挤压住，该针-点接触在布置到槽4的壁10b上的凸块9与凸块9对面的槽的壁10a之间。通过单个夹紧(在凸块与凸块对面的侧壁之间)导致的导线元件5的收缩允许导线元件5被保持在槽4中。
除了起到固定导线元件5的作用之外，凸块9可以是有源的，即，它相应于微电子部件6的连接端子。凸块9是导电的并能够起到数据或电能供应总线的作用。为了改善固定，槽可以包括多个凸块9，优选多个凸块9的至少一个是有源的。
由凸块9施加到导线元件5的压力促进导线元件5与凸块9之间的紧密接触。因此，当凸块9与导线元件5电导通时，在接触区域12处的大压力能够实现紧密接触，该紧密接触通过刮擦接触区域12处的材料而获得。该接触对凸块9与导线元件5之间的良好电传导是必须的。
为了实现导线元件5、槽4和凸块9的充分固定，必须根据将要被嵌入的导线元件5的直径来设定凸块9的尺寸。凸块9的边的尺寸大体为50至200μm，它们的高度H3能在2和100μm之间变化。因此，如图5所示，高度为H3的凸块9布置在槽4的壁10b(图5的底壁)上。槽4的深度为H4，其宽度相应于自由区域的高度H2，即，侧壁10a、10b分开的距离。为了通过单一夹紧来固定导线元件，导线元件的直径Df在嵌入之前大于凸块9的顶点与凸块9对面的侧壁10a(图5中的顶壁)分开的距离(H1＝H2-H3)，即，Df＞H1。凸块9与相对的侧壁10a分开的距离H1优选地被包括在导线元件5的直径的98％至80％之间。因此，该距离H1依赖导线元件5的直径Df和形成导线元件5的材料。
凸块9优选由比导线元件5更具延展性的材料制成，或反之亦然。在导电连接的情况下，此特性增强了凸块9与导线元件5之间的紧密接触。例如，凸块能由镍、铜或金制成，导线元件由铜或银与钨的合金制成。考虑到导线元件将很容易变形的情况，形成导线元件5的材料与形成凸块9的材料相比较越具有延展性，距离H1与直径Df相比越小。
固定导线元件5还能通过多重夹紧来实现。当导线元件5被如图6所示的插入时，导线元件5穿越凸块9时施加了多重夹紧。然后，导线元件5被凸块9、槽4的底部11和与凸块9相对的侧壁10a阻挡。这种固定引入了附加的应力。因此，如图5和6所示，凸块9的顶点与凸块对面的壁10a分开的高度H1总是必须小于导线元件5的直径Df。槽的底部11与凸块9分开的距离H5小于导线元件5的直径。确实，如果距离H5大于导线元件5的直径，导线元件一旦被插入将不会被固定到芯片，由此芯片能沿着导线元件5自由地滑动，导线元件5将不会被夹紧。
每个凸块9优选比凸块9所处的槽4的长度窄。实际上，凸块越窄，凸块9与导线元件5的接触区域12将越小。因此，更易于插入导线元件5，且易于通过限制用于插入而施加的力来实现将导线元件5阻挡在槽4中而不损坏导线元件5。
导电导线元件能被涂上瓷漆，在这种情况，为了插入导电导线元件所施加的压力能够使得在与凸块9的接触区域处瓷漆被刮掉直到导线元件5的导电核心。根据可选实施方式，导线元件涂覆有有机绝缘沉积物(热塑性塑料、环氧树脂等等)和/或无机绝缘沉积物(SiO2、氧化铝等等)。当导线元件5与凸块9相挤压时这些沉积物将被穿破。接着，导线元件5与凸块9独立地电接触并且在接触区域12外部绝缘。在热塑性塑料沉积物的情况下，热塑性塑料也能够被再熔化以确保导线在槽中的粘合。绝缘体覆盖导电导线的厚度典型地为约2至50μm。在导线元件被绝缘体覆盖的情况下，导电核心的直径加上绝缘层的厚度要大于夹紧区域的高度H1。
与导线元件5接触的凸块9的数量能增加。通过增加凸块9的数量，确保导线元件5固定在槽4中的摩擦力变得更大。因此，芯片的槽4能包括多个凸块9，布置在槽4的侧壁10b上。优选地，这些凸块9中的至少一个是导电的，从而给芯片供电或者起到数据总线的作用。然后，其它非导电的凸块仅起到导线元件5的固定装置的作用。
根据图7所示的可选实施方式，通过将凸块9放置到槽4的两个侧壁10a和10b上来执行导线元件5在槽4中的固定。凸块9优选以Z字形方式定位并具有规则的间距。通过单个或多重夹紧，以Z字形方式安置凸块改善了凸块9的阻挡功能。此外，在芯片由两个微电子部件制成且该两个微电子部件被间隔体分开的情况下，每个槽4的每个侧壁能包括至少一个导电凸块9以起到电能供应和/或数据总线的作用。
凸块9的形状能影响导线元件在槽中的固定。凸块可以是立方体形式(图2、3、5和6)、半球形形式(图4和7)，或者如图8所示，其能是沿着对称轴S垂直于槽4的底部11延伸的棒的形式。棒的长度优选小于或等于槽4的深度H4。为了通过导线元件5的单个夹紧实现固定，棒能延伸超过相应于槽的深度H4的整个长度。为了实现多重夹紧，棒的长度比槽4的深度H4小并且以这样的方式布置：在每个棒与槽的底部11之间留下小于导线元件5的直径的空白空间(empty space)。
根据图9所示的实施方式，形成凸块9的棒的顶点面对相对方向的侧壁10a，该顶点可以是尖端的形式，即，顶点包括三角形截面。由于三角形截面的顶点，当发生有效的插入时，形成导线元件5的材料将更容易变形，并且如果适用的话形成导线元件5的材料将更容易被裸露，这将能够得到更好的电接触，该电接触通过改善棒的尖端形式的顶点与形成导线元件5的一种或多种材料之间的紧密接触而获得。
一旦导线元件5被固定到槽4中，导线元件5与槽4之间的连接能通过不同方法改善，诸如，电解、或者通过绝缘胶或导电胶的方式的粘接。
所描述的固定导线元件能使得芯片以串级链(daisy chain)的形式或两个两个地彼此电连接和/或彼此机械连接。由此能够实现任意类型芯片的组件(并联、串联等)。
凸块优选地由涂覆有1000至
Figure BPA00001214284400061
的金沉积物的电解镍制成。
组件可以包括以共享相同数据总线的串级链的形式连接的多个芯片。

Claims (9)

1.一种组件，包括至少一个微电子芯片，该至少一个微电子芯片提供有两个平行的主表面(1、2)和侧表面(3a、3b)，所述侧表面(3a、3b)中的至少一个包括用于容纳导线元件(5)的纵向的槽(4)，该导线元件(5)具有平行于所述槽(4)的纵向轴的轴，所述槽由至少两个侧壁(10a、10b)定义出轮廓，所述组件的特征在于：所述导线元件(5)在夹紧区域处被固定到所述芯片，该夹紧区域在布置到所述侧壁之一(10b)上的至少一个凸块(9)与所述槽4的所述凸块(9)对面的侧壁(10a)之间，所述夹紧区域的高度小于所述导线元件(5)的直径，自由区域沿着所述槽(4)的纵向轴布置在所述凸块(9)的侧面，所述自由区域的高度对应于所述两个侧壁(10a、10b)分开的距离，并大于所述导线元件(5)的直径。
2.根据权利要求1所述的组件，其特征在于：所述夹紧区域的高度在所述导线元件(5)的直径的98％至80％之间。
3.根据权利要求1和2之一所述的组件，其特征在于：所述导线元件(5)的直径大于所述凸块(9)与所述槽(4)的底部(11)分开的距离，并且所述导线元件(5)还与所述槽的底部(11)接触。
4.根据权利要求1至3中任一项所述的组件，其特征在于：至少一个所述凸块(9)是导电凸块(9)。
5.根据权利要求1至4中任一项所述的组件，其特征在于：所述两个侧壁(10a、10b)支撑以Z字形方式布置的凸块(9)。
6.根据权利要求1至5中任一项所述的组件，其特征在于：每个凸块(9)为棒的形式，该棒具有垂直于所述槽(4)的底部(11)的轴。
7.根据权利要求6所述的组件，其特征在于：每个棒具有三角形截面的顶点。
8.根据权利要求1至7中任一项所述的组件，其特征在于：所述导线元件(5)包括覆盖有绝缘体的导电核心，所述核心的直径与所述绝缘体的厚度之和大于所述夹紧区域的高度(H1)。
9.根据权利要求1至8中任一项所述的组件，其特征在于：所述组件包括在所述导线元件(5)与所述槽(4)之间的绝缘粘合剂或导电粘合剂。
CN200880127846.4A 2008-03-06 2008-10-21 包括导线元件和带槽的微电子芯片并包括保持该导线元件的至少一个凸块的组件 Expired - Fee Related CN101960585B (zh)

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EP2099060A1 (fr) 2009-09-09
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US8723312B2 (en) 2014-05-13
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DE602009000024D1 (de) 2010-06-24
EP2250667B1 (fr) 2013-04-24
US20090227069A1 (en) 2009-09-10
EP2099060B1 (fr) 2010-05-12
JP2009218590A (ja) 2009-09-24
CN101960585B (zh) 2014-07-16
EP2250667A1 (fr) 2010-11-17
US20110001237A1 (en) 2011-01-06
WO2009112644A1 (fr) 2009-09-17
FR2928491A1 (fr) 2009-09-11
ATE467900T1 (de) 2010-05-15

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