JP5378011B2 - 少なくとも2つの超小型電子チップのアセンブリを作製する方法および装置 - Google Patents
少なくとも2つの超小型電子チップのアセンブリを作製する方法および装置 Download PDFInfo
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- JP5378011B2 JP5378011B2 JP2009052290A JP2009052290A JP5378011B2 JP 5378011 B2 JP5378011 B2 JP 5378011B2 JP 2009052290 A JP2009052290 A JP 2009052290A JP 2009052290 A JP2009052290 A JP 2009052290A JP 5378011 B2 JP5378011 B2 JP 5378011B2
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- General Physics & Mathematics (AREA)
- Wire Bonding (AREA)
- Dicing (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
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Description
・前記チップを切断するステップと、
・前記溝にアクセス可能とするために、少なくとも1つのチップの少なくとも1つの溝の近くのフレキシブルフィルムを変形するステップと、
・挿入エリアに配置された前記チップの前記溝にスレッド部材を埋め込むステップと、
・除去エリアのフレキシブルフィルムからチップを除去するステップ。
フィルムの変形は、少なくとも入力エリアのフィルムが伸びるよう引っ張ることによって圧力を加えることにより実現されてもよい。
・ウエハをフレキシブルフィルムに貼り付ける手段と、
・チップを切断する手段と、
・前記溝にアクセス可能とするために、少なくとも1つのチップの少なくとも1つの溝の近くのフレキシブルフィルムを変形する手段と、
・挿入エリアに配置された前記チップの前記溝にスレッド部材を埋め込む手段と、
・除去エリアのフレキシブルフィルムからチップを除去する手段と、を備える。
・チップ7が形成されたシリコンウエハ6がフレキシブルフィルム8の上に取り付けられる。フィルムには、チップがウエハ上に形成される前に取り付けられてもよいし、または、チップが形成された後に取り付けられてもよい。
・チップは、好ましくは、初めはウエハ6の上にマトリクス状に形成されており、切断される。しかし、チップが貼り付けられたフレキシブルフィルム8によって、チップは他のチップに機械的に取り付けられたままである。この切断は、例えば切断器(sawing)やプラズマエッチング等、どのような好適な手法を用いて行われてもよい。
・少なくとも1つのチップの少なくとも1つの溝3の近くのフレキシブルフィルム8が変形して、溝3にアクセス可能となる。
・挿入エリア12に配置された前記チップの前記溝3に、少なくとも1つのスレッド部材17を埋め込む。
・除去エリア13のフレキシブルフィルム8からチップを除去する(つまり、チップを取り外す)。
・ウエハ6をフレキシブルフィルム8に貼り付ける手段と、
・チップ7を切断する手段と、
・溝をアクセス可能とするために、少なくとも1つのチップの少なくとも1つの溝の近くのフレキシブルフィルムを変形させる手段と、
・前記チップの前記溝3にスレッド部材17を挿入する手段と、
・除去エリアのフレキシブルフィルムからチップを除去する手段と、
を備え、前記スレッド部材はチップに埋め込まれている。
Claims (12)
- 少なくとも2つの超小型電子チップのアセンブリを作製する方法であって、
前記チップはウエハ(6)上に形成され、各チップ(7)は側面(2)によって結合された2つの平行な主面(1a,1b)を有し、少なくとも1つの前記側面(2)は少なくとも1つの溝(3)を有し、
前記ウエハ(6)をフレキシブルフィルム(8)に貼り付けるステップと、
前記チップ(7)を切断するステップと、
前記溝(3)にアクセス可能とするために、少なくとも1つのチップの少なくとも1つの溝の近くの前記フレキシブルフィルムを変形するステップと、
挿入エリア(12)に配置された前記チップの前記溝(3)にスレッド部材(17)を埋め込むステップと、
除去エリア(13)の前記フレキシブルフィルムから前記チップを除去するステップと、を備えることを特徴とする方法。 - 請求項1に記載の方法であって、
入力エリア(10)の下流側に位置する前記フレキシブルフィルム(8)の変形は、前記溝の近くの前記フレキシブルフィルムを傾けることによりなされることを特徴とする方法。 - 請求項2に記載の方法であって、
前記フィルム(8)は前記挿入エリア(12)への入口で傾けられることを特徴とする方法。 - 請求項2または3に記載の方法であって、
前記フレキシブルフィルム(8)は前記挿入エリア(12)からの出口で傾けられることを特徴とする方法。 - 請求項1に記載の方法であって、
前記フィルム(8)の変形は、引っ張って圧力を加え、少なくとも入力エリア(10)の前記フィルム(8)を引き伸ばすことによりなされることを特徴とする方法。 - 請求項5に記載の方法であって、
前記入力エリア(10)は加熱プレート(11)に備えられていることを特徴とする方法。 - 請求項1乃至6のいずれかに記載の方法であって、
前記挿入エリア(12)と前記除去エリア(13)とは同一であることを特徴とする方法。 - 請求項1乃至7のいずれかに記載の方法であって、
前記フレキシブルフィルムはポリマーのフィルムであることを特徴とする方法。 - 請求項1乃至8のいずれかに記載の方法であって、
各チップ(7)は、それぞれ2つの向かい合う側面(2)に形成された2つの溝(3)を備え、
2つの近接するチップは2つのスレッドによって接続され、
前記スレッドはスレッドベアリング針(9)によって溝(3)に挿入されることを特徴とする方法。 - 請求項1乃至9のいずれかに記載の方法であって、
ウエハは複数のチップ列によって形成され、各列は1つのエリアから他のエリアまで連続して通過することを特徴とする方法。 - 請求項1乃至10のいずれかに記載の方法であって、
前記除去エリア(13)は刃または少なくとも先が尖った形の除去器具(15)を備えることを特徴とする方法。 - 少なくとも2つの超小型電子チップのアセンブリを作製する装置であって、
前記チップはウエハ(6)上に形成され、各チップ(7)は側面(2)によって結合された2つの平行な主面(1a,1b)を有し、少なくとも1つの前記側面(2)は少なくとも1つの溝(3)を有し、
前記ウエハ(6)をフレキシブルフィルム(8)に貼り付ける手段と、
前記チップ(7)を切断する手段と、
前記溝にアクセス可能とするために、少なくとも1つのチップの少なくとも1つの溝の近くの前記フレキシブルフィルムを変形する手段と、
挿入エリア(12)に配置された前記チップの前記溝(3)にスレッド部材(17)を埋め込む手段と、
除去エリアの前記フレキシブルフィルムから前記チップを除去する手段と、を備えることを特徴とする装置。
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FR0801234A FR2928491A1 (fr) | 2008-03-06 | 2008-03-06 | Procede et dispositif de fabrication d'un assemblage d'au moins deux puces microelectroniques |
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JP2009218590A JP2009218590A (ja) | 2009-09-24 |
JP2009218590A5 JP2009218590A5 (ja) | 2012-04-19 |
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JP2009052290A Expired - Fee Related JP5378011B2 (ja) | 2008-03-06 | 2009-03-05 | 少なくとも2つの超小型電子チップのアセンブリを作製する方法および装置 |
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US (2) | US8723312B2 (ja) |
EP (2) | EP2250667B1 (ja) |
JP (2) | JP5341114B2 (ja) |
CN (2) | CN101960585B (ja) |
AT (1) | ATE467900T1 (ja) |
DE (1) | DE602009000024D1 (ja) |
ES (1) | ES2346274T3 (ja) |
FR (1) | FR2928491A1 (ja) |
WO (1) | WO2009112644A1 (ja) |
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-
2008
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- 2008-10-21 EP EP08873297.9A patent/EP2250667B1/fr not_active Not-in-force
- 2008-10-21 WO PCT/FR2008/001476 patent/WO2009112644A1/fr active Application Filing
- 2008-10-21 CN CN200880127846.4A patent/CN101960585B/zh not_active Expired - Fee Related
- 2008-10-21 JP JP2010549171A patent/JP5341114B2/ja not_active Expired - Fee Related
- 2008-10-21 US US12/919,512 patent/US8723312B2/en active Active
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2009
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- 2009-02-20 AT AT09354009T patent/ATE467900T1/de active
- 2009-02-20 EP EP09354009A patent/EP2099060B1/fr active Active
- 2009-02-20 DE DE602009000024T patent/DE602009000024D1/de active Active
- 2009-02-20 ES ES09354009T patent/ES2346274T3/es active Active
- 2009-03-05 JP JP2009052290A patent/JP5378011B2/ja not_active Expired - Fee Related
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JP2011513980A (ja) | 2011-04-28 |
CN101527269B (zh) | 2012-07-25 |
US8012795B2 (en) | 2011-09-06 |
CN101527269A (zh) | 2009-09-09 |
EP2099060A1 (fr) | 2009-09-09 |
ES2346274T3 (es) | 2010-10-13 |
US8723312B2 (en) | 2014-05-13 |
JP5341114B2 (ja) | 2013-11-13 |
CN101960585A (zh) | 2011-01-26 |
DE602009000024D1 (de) | 2010-06-24 |
EP2250667B1 (fr) | 2013-04-24 |
US20090227069A1 (en) | 2009-09-10 |
EP2099060B1 (fr) | 2010-05-12 |
JP2009218590A (ja) | 2009-09-24 |
CN101960585B (zh) | 2014-07-16 |
EP2250667A1 (fr) | 2010-11-17 |
US20110001237A1 (en) | 2011-01-06 |
WO2009112644A1 (fr) | 2009-09-17 |
FR2928491A1 (fr) | 2009-09-11 |
ATE467900T1 (de) | 2010-05-15 |
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