CN101959376B - 多层柔性印刷布线板的制造方法 - Google Patents

多层柔性印刷布线板的制造方法 Download PDF

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Publication number
CN101959376B
CN101959376B CN201010197377.2A CN201010197377A CN101959376B CN 101959376 B CN101959376 B CN 101959376B CN 201010197377 A CN201010197377 A CN 201010197377A CN 101959376 B CN101959376 B CN 101959376B
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copper
basis material
layer side
thickness
internal layer
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Chinese (zh)
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CN101959376A (zh
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松田文彦
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Nippon Mektron KK
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Nippon Mektron KK
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CN201010197377.2A 2009-05-26 2010-05-26 多层柔性印刷布线板的制造方法 Active CN101959376B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009126726A JP2010278067A (ja) 2009-05-26 2009-05-26 多層フレキシブルプリント配線板の製造方法および多層回路基材
JP2009-126726 2009-05-26

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CN101959376A CN101959376A (zh) 2011-01-26
CN101959376B true CN101959376B (zh) 2016-01-13

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CN (1) CN101959376B (ja)
TW (1) TWI459879B (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013074270A (ja) * 2011-09-29 2013-04-22 Nec Toppan Circuit Solutions Inc リジッドフレキシブルプリント配線板の製造方法
EP2765163A1 (en) * 2013-02-12 2014-08-13 Solvay Specialty Polymers USA, LLC. Mobile electronic device
CN104768242A (zh) * 2014-01-06 2015-07-08 黄伟聪 一种应用柔性厚膜发热体的可发热布料及该布料的制作方法
JPWO2015141004A1 (ja) * 2014-03-20 2017-04-06 富士通株式会社 多層回路基板、半導体装置、及びその多層回路基板の製造方法
TWI566659B (zh) * 2014-09-18 2017-01-11 矽品精密工業股份有限公司 封裝基板及其製法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1972571A (zh) * 2005-11-01 2007-05-30 日本梅克特隆株式会社 具有电缆部的多层布线基板的制造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08148828A (ja) * 1994-11-18 1996-06-07 Hitachi Ltd 薄膜多層回路基板およびその製造方法
JP2001189548A (ja) * 1999-12-28 2001-07-10 Tdk Corp 電子部品用基板の製造方法
JP2002289743A (ja) * 2001-03-28 2002-10-04 Cmk Corp 非スルーホールプリント配線板及びその製造方法
JP2006210492A (ja) * 2005-01-26 2006-08-10 Hitachi Chem Co Ltd プリント配線板の製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1972571A (zh) * 2005-11-01 2007-05-30 日本梅克特隆株式会社 具有电缆部的多层布线基板的制造方法

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JP2010278067A (ja) 2010-12-09
TW201112908A (en) 2011-04-01
CN101959376A (zh) 2011-01-26
TWI459879B (zh) 2014-11-01

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