CN101959376B - 多层柔性印刷布线板的制造方法 - Google Patents
多层柔性印刷布线板的制造方法 Download PDFInfo
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- CN101959376B CN101959376B CN201010197377.2A CN201010197377A CN101959376B CN 101959376 B CN101959376 B CN 101959376B CN 201010197377 A CN201010197377 A CN 201010197377A CN 101959376 B CN101959376 B CN 101959376B
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- copper
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Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009126726A JP2010278067A (ja) | 2009-05-26 | 2009-05-26 | 多層フレキシブルプリント配線板の製造方法および多層回路基材 |
JP2009-126726 | 2009-05-26 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101959376A CN101959376A (zh) | 2011-01-26 |
CN101959376B true CN101959376B (zh) | 2016-01-13 |
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ID=43424794
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201010197377.2A Active CN101959376B (zh) | 2009-05-26 | 2010-05-26 | 多层柔性印刷布线板的制造方法 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP2010278067A (ja) |
CN (1) | CN101959376B (ja) |
TW (1) | TWI459879B (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013074270A (ja) * | 2011-09-29 | 2013-04-22 | Nec Toppan Circuit Solutions Inc | リジッドフレキシブルプリント配線板の製造方法 |
EP2765163A1 (en) * | 2013-02-12 | 2014-08-13 | Solvay Specialty Polymers USA, LLC. | Mobile electronic device |
CN104768242A (zh) * | 2014-01-06 | 2015-07-08 | 黄伟聪 | 一种应用柔性厚膜发热体的可发热布料及该布料的制作方法 |
JPWO2015141004A1 (ja) * | 2014-03-20 | 2017-04-06 | 富士通株式会社 | 多層回路基板、半導体装置、及びその多層回路基板の製造方法 |
TWI566659B (zh) * | 2014-09-18 | 2017-01-11 | 矽品精密工業股份有限公司 | 封裝基板及其製法 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1972571A (zh) * | 2005-11-01 | 2007-05-30 | 日本梅克特隆株式会社 | 具有电缆部的多层布线基板的制造方法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08148828A (ja) * | 1994-11-18 | 1996-06-07 | Hitachi Ltd | 薄膜多層回路基板およびその製造方法 |
JP2001189548A (ja) * | 1999-12-28 | 2001-07-10 | Tdk Corp | 電子部品用基板の製造方法 |
JP2002289743A (ja) * | 2001-03-28 | 2002-10-04 | Cmk Corp | 非スルーホールプリント配線板及びその製造方法 |
JP2006210492A (ja) * | 2005-01-26 | 2006-08-10 | Hitachi Chem Co Ltd | プリント配線板の製造方法 |
-
2009
- 2009-05-26 JP JP2009126726A patent/JP2010278067A/ja active Pending
-
2010
- 2010-03-30 TW TW99109652A patent/TWI459879B/zh active
- 2010-05-26 CN CN201010197377.2A patent/CN101959376B/zh active Active
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1972571A (zh) * | 2005-11-01 | 2007-05-30 | 日本梅克特隆株式会社 | 具有电缆部的多层布线基板的制造方法 |
Also Published As
Publication number | Publication date |
---|---|
JP2010278067A (ja) | 2010-12-09 |
TW201112908A (en) | 2011-04-01 |
CN101959376A (zh) | 2011-01-26 |
TWI459879B (zh) | 2014-11-01 |
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