CN106879188B - 一种元器件内置型电路板的制作方法及电路板 - Google Patents
一种元器件内置型电路板的制作方法及电路板 Download PDFInfo
- Publication number
- CN106879188B CN106879188B CN201710156442.9A CN201710156442A CN106879188B CN 106879188 B CN106879188 B CN 106879188B CN 201710156442 A CN201710156442 A CN 201710156442A CN 106879188 B CN106879188 B CN 106879188B
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- internal layer
- daughter board
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- prepreg
- layer daughter
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
Abstract
Description
Claims (13)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201710156442.9A CN106879188B (zh) | 2017-03-16 | 2017-03-16 | 一种元器件内置型电路板的制作方法及电路板 |
Applications Claiming Priority (1)
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CN201710156442.9A CN106879188B (zh) | 2017-03-16 | 2017-03-16 | 一种元器件内置型电路板的制作方法及电路板 |
Publications (2)
Publication Number | Publication Date |
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CN106879188A CN106879188A (zh) | 2017-06-20 |
CN106879188B true CN106879188B (zh) | 2018-11-30 |
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CN201710156442.9A Active CN106879188B (zh) | 2017-03-16 | 2017-03-16 | 一种元器件内置型电路板的制作方法及电路板 |
Country Status (1)
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CN (1) | CN106879188B (zh) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108040426A (zh) * | 2017-11-02 | 2018-05-15 | 广州兴森快捷电路科技有限公司 | 具有内置元器件的芯板的制作方法及电路板的制作方法 |
CN111669893A (zh) * | 2019-03-06 | 2020-09-15 | 珠海方正科技高密电子有限公司 | 电路板及其制备方法 |
CN110831354A (zh) * | 2019-11-15 | 2020-02-21 | 莆田市涵江区依吨多层电路有限公司 | 一种基于盲钻和元器件内压的多层板生产方法 |
CN111465192A (zh) * | 2020-04-16 | 2020-07-28 | 四川英创力电子科技股份有限公司 | 一种嵌入式埋元器件印制板的加工工艺 |
CN114206032A (zh) * | 2021-12-23 | 2022-03-18 | 四川省华兴宇电子科技有限公司 | 一种埋置无源元件印制电路板的制作方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101946568A (zh) * | 2008-02-11 | 2011-01-12 | 揖斐电株式会社 | 电子部件内置基板的制造方法 |
CN103188882A (zh) * | 2011-12-31 | 2013-07-03 | 深南电路有限公司 | 一种电路板及其制作方法 |
CN103687333A (zh) * | 2012-09-25 | 2014-03-26 | 松下电器产业株式会社 | 电路元器件内置基板的制造方法 |
CN104363720A (zh) * | 2014-10-21 | 2015-02-18 | 深圳崇达多层线路板有限公司 | 一种在pcb中制作深盲槽的方法 |
CN105472886A (zh) * | 2015-11-13 | 2016-04-06 | 惠州市金百泽电路科技有限公司 | 一种内置有源器件pcb板制作方法 |
-
2017
- 2017-03-16 CN CN201710156442.9A patent/CN106879188B/zh active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101946568A (zh) * | 2008-02-11 | 2011-01-12 | 揖斐电株式会社 | 电子部件内置基板的制造方法 |
CN103188882A (zh) * | 2011-12-31 | 2013-07-03 | 深南电路有限公司 | 一种电路板及其制作方法 |
CN103687333A (zh) * | 2012-09-25 | 2014-03-26 | 松下电器产业株式会社 | 电路元器件内置基板的制造方法 |
CN104363720A (zh) * | 2014-10-21 | 2015-02-18 | 深圳崇达多层线路板有限公司 | 一种在pcb中制作深盲槽的方法 |
CN105472886A (zh) * | 2015-11-13 | 2016-04-06 | 惠州市金百泽电路科技有限公司 | 一种内置有源器件pcb板制作方法 |
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CN106879188A (zh) | 2017-06-20 |
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Effective date of registration: 20171107 Address after: 283 No. 523860 Guangdong province Dongguan city Changan town usha BBK Avenue Applicant after: VIVO MOBILE COMMUNICATION CO., LTD. Applicant after: Wewo Mobile Communication Co. Ltd. Beijing branch Address before: 283 No. 523860 Guangdong province Dongguan city Changan town usha BBK Avenue Applicant before: VIVO MOBILE COMMUNICATION CO., LTD. |
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Effective date of registration: 20200521 Address after: 283 No. 523860 Guangdong province Dongguan city Changan town usha BBK Avenue Patentee after: VIVO MOBILE COMMUNICATION Co.,Ltd. Address before: 283 No. 523860 Guangdong province Dongguan city Changan town usha BBK Avenue Co-patentee before: Wewo Mobile Communication Co. Ltd. Beijing branch Patentee before: VIVO MOBILE COMMUNICATION Co.,Ltd. |
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