CN101835343A - 印刷布线板、包含其的印刷集成电路板及其制造方法 - Google Patents

印刷布线板、包含其的印刷集成电路板及其制造方法 Download PDF

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CN101835343A
CN101835343A CN201010129308A CN201010129308A CN101835343A CN 101835343 A CN101835343 A CN 101835343A CN 201010129308 A CN201010129308 A CN 201010129308A CN 201010129308 A CN201010129308 A CN 201010129308A CN 101835343 A CN101835343 A CN 101835343A
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China
Prior art keywords
insulating barrier
wiring
printing
wiring board
plate
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CN201010129308A
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English (en)
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孝谷卓哉
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Denso Corp
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Denso Corp
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Publication of CN101835343A publication Critical patent/CN101835343A/zh
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    • H—ELECTRICITY
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Abstract

本发明涉及印刷布线板、具有该印刷布线板的印刷IC板及其制造方法。一种印刷IC板具有多层印刷布线板和一个或多个裸IC芯片。该多层印刷布线板具有由PTFE制成的绝缘层和在绝缘层上面形成的布线图形，绝缘层和布线图形被堆叠以实现叠层结构。作为布线图形的部分的电极部分电气连接到裸IC芯片。用作强化部件的铜部件被放置于在除了第一绝缘层以外的绝缘层中形成的区域中。该区域形成在电极部分正下方。该区域在沿堆叠的绝缘层的厚度的方向Z上形成。在除了第一绝缘层以外的绝缘层中的形成在电极部分正下方的区域具有高于绝缘层的刚性。

Description

印刷布线板、包含其的印刷集成电路板及其制造方法
技术领域
本发明涉及一种印刷布线板、一种由一个或更多个裸IC芯片和具有绝缘层和印刷布线图形的印刷布线板组成的印刷集成电路(IC)板(或印刷IC组件)、以及一种制造该印刷布线板和印刷IC板的方法。
背景技术
由印刷布线板组成的多种类型的印刷IC板(或印刷IC组件)是公知的。例如，印刷布线板具有绝缘层和由诸如铜导线的传导线制成的印刷布线图形。该绝缘层由根据其应用选择的绝缘材料制成。印刷IC板包括印刷布线板和设置在印刷布线板上的由诸如硅的半导体制成的多个裸IC芯片。
通常，制造印刷IC板的步骤使用导线接合或倒装芯片接合方法。在导线接合方法中，裸IC芯片的盘部分和布线图形的电极部分通过传导线电气连接。另一方面，在倒装芯片接合方法中，接合盘部分电气连接到凸点部分(诸如焊料凸点)以便于在印刷布线板上面接合IC芯片。
在印刷IC板的制造中，当该接合部件由金制成时，印刷布线板被安置在热台单元(其由例如陶瓷或金属制成)上面，在150℃～200℃范围内的高温下对其加热，并且通过如超声热压接合的使用超声振动的热压接合，使用传导线或焊料凸点(在下文中，这样的传导线和焊料凸点将被称为“接合部件”)将裸IC芯片接合到印刷布线板上。
此外，在制造印刷IC板期间通常使用诸如玻璃环氧树脂或苯酚纸的绝缘材料。然而，在适用于毫米波段或毫米波中的高频信号这样的印刷IC板的制造中，常常使用较之上述绝缘材料具有低的耗散因数的诸如聚四氟乙烯(PTFE)的氟碳聚合物。例如，日本专利公开公报No.JPH07-323501公开了使用该PTFE的传统技术。即，使用低介电耗散因数的绝缘材料可以抑制与信号频率和介电耗散因数成比例的能量损失(介电损失)。
顺便提及，已知适用于高频应用的诸如氟碳树脂和液晶聚合物(LCP)的绝缘材料的弹性模量在150℃～200℃范围内的高温下剧烈下降。
由于安置在热台单元上面的印刷布线板中包含的绝缘材料使超声波消散并且使施加到接合部件(诸如传导线和焊料凸点)的负载分散，这使印刷IC板的可靠性下降，并且这阻止裸IC芯片和凸点部分(诸如焊料凸点)之间的适当的接合。
发明内容
本发明的一个目的在于提供一种印刷布线板、一种由一个或更多个裸IC芯片和印刷布线板组成的印刷集成电路(IC)板(或印刷IC组件)，这些裸IC芯片被安置在该印刷布线板上面并且连接到布线图形。本发明还提供了一种制造该印刷布线板和印刷IC板的方法。
为了实现上述目的，本发明提供了一种具有电气连接的印刷布线板和一个或更多个裸IC芯片的印刷IC板。该印刷布线板由绝缘材料制成的绝缘层组成，在该绝缘层上面形成布线图形。该布线图形具有电极部分，裸IC芯片通过该电极部分电气连接到布线图形。
特别地，根据本发明的印刷IC板具有改进的结构，其中强化部件被放置在绝缘层中，并且该强化部件被放置在位于布线图形中的电极部分的位置正下方的区域中，该区域在绝缘层中形成。即，在电极部分正下方、在绝缘层中形成该区域。“在电极部分正下方的形成在绝缘层中的区域”是指从第一绝缘层中形成的布线图形的电极部分观察时在Z轴的方向上(作为印刷IC板中堆叠的绝缘层的厚度的方向)位于电极部分正下方的形成在绝缘层中的预定区域。
由于在印刷IC板上面的电极部分正下方形成的、在绝缘层中形成的区域因强化部件的存在而具有增加的刚性，因此这使得可以容易地在Z轴中(或者朝向绝缘层的厚度的方向)传播或传送超声波和负载，其中在印刷IC板的制造期间通过诸如传导线或凸点的连接部件将裸IC芯片电气连接到布线图形的步骤期间，超声波和负载被施加到印刷布线板侧。
即，本发明提供了预先选择并且随后在绝缘层中使用强化部件的印刷IC板，该强化部件的刚性高于形成该绝缘层的绝缘材料的刚性，与形成该绝缘层的绝缘材料的类型无关。该结构可以适当地执行热熔步骤，以便于将诸如传导线和凸点的连接材料连接到在绝缘层的表面上形成的布线图形的电极部分。上述结构允许将一个或更多个裸IC芯片接合到印刷IC板中的印刷电路板。
根据本发明的另一方面，提供了一种具有如下结构的印刷布线板，其中布线图形在由绝缘材料制成的绝缘层上形成，电极部分在布线图形上形成，该电极部分将该布线图形电气连接到裸IC芯片。在印刷布线图形的该结构中，具有高于绝缘材料的刚性的预定刚性的强化部件被放置在绝缘层中形成的区域中。该区域的位置对应于在绝缘层上面形成的电极部分。在除了上面形成有电极部分的绝缘层以外的绝缘层中，在电极部分正下方形成该区域。因此根据本发明可以将印刷布线板适当地施加到印刷IC板。
根据本发明的另一方面，提供了一种制造前述印刷IC板的方法。该印刷IC板包括多层印刷布线板和安置在该多层印刷布线板上的一个或更多个裸IC芯片。该多层印刷布线板包括多个绝缘层和在该些绝缘层上面形成的布线图形，并且绝缘层和布线图形被堆叠以实现叠层结构。特别地，本发明的方法具有在除了第一绝缘层以外的绝缘层中形成穿孔作为直接位于电极部分下方的区域的步骤。电极部分是在第一绝缘层的表面上形成的，并且电极部分电气连接到裸IC芯片，该第一绝缘层堆叠在第二绝缘层上，从而使第一绝缘层的与上面形成有电极部分的表面相反的表面面对第二绝缘层的表面。该方法进一步具有将具有高于绝缘材料的刚性的预定刚性的强化部件插入到穿孔中的步骤。该方法进一步具有堆叠多个绝缘层的步骤。
特别地，在第一步骤中，在除了第一绝缘层以外的绝缘层中形成穿孔。该穿孔形成在除了第一绝缘层以外的绝缘层中并位于在第一绝缘层上形成的布线图形中的电极部分正下方。在随后的步骤中，强化部件被插入到该穿孔中，该强化部件的刚性高于形成绝缘层的绝缘材料的刚性。在随后的步骤中，第一绝缘层和除了第一绝缘层以外的绝缘层的组被堆叠在一起，以便于实现具有叠层结构的印刷IC板。
根据制造该印刷IC板的方法，可以容易地将强化部件放置到绝缘层中，并且可以将裸IC芯片适当地连接到多层印刷布线板。
附图说明
将参照附图描述作为示例的本发明的优选的、非限制性的实施例，在附图中：
图1是示出根据本发明的第一实施例的印刷IC板的配置的视图；
图2A～图2H是示出制造根据本发明的第一实施例的印刷IC板的主要步骤的视图；
图3A～图3C是示出根据本发明的第二实施例的印刷IC板的配置的视图；
图4A～图4E是示出制造根据本发明的第二实施例的印刷IC板的主要步骤的视图；
图5是示出根据本发明的第三实施例的印刷IC板的配置的视图；
图6A～图6G是示出制造根据本发明的第三实施例的印刷IC板的主要步骤的视图；以及
图7A～图7C是示出根据本发明的另一实施例的印刷IC板的配置的视图。
具体实施方式
下面将参照附图描述本发明的多种实施例。在下面的多种实施例的描述中，在数个附图中相同的附图标记表示相同或等效的组成部分。
第一实施例
将参照图1至图2A～2H给出根据本发明的第一实施例的印刷IC板(或印刷IC组件)的描述。
图1是示出根据本发明的第一实施例的印刷IC板1的配置的视图。图2A～图2H是示出制造根据本发明的第一实施例的印刷IC板1的主要步骤的视图。
<完整结构>
如图1中所示，印刷IC板1主要由多层印刷布线板2、一个或更多个裸IC芯片3(顺便提及，为了简化，图1仅示出了单个裸IC芯片3)以及诸如电容和电阻的芯片元件4组成。多层印刷布线板2具有多层结构，其中多个印刷布线图形被堆叠以实现叠层结构，其中印刷布线图形由铜薄膜制成。裸IC芯片3由诸如硅的半导体制成。特别地，裸IC芯片3和芯片元件4安装在多层印刷布线板2的表面上。
裸IC芯片和多层印刷布线板2的表面通过使用由金或铜制成的传导线5电气连接在一起。同样可接受的是，芯片元件4内置在多层印刷布线板2中。
裸IC芯片3是未封装的半导体IC元件。即，裸IC芯片3被放置在空腔部分2a上面，并且通过使用诸如银(Ag)环氧树脂或硅树脂的粘合剂固定到空腔部分2a，空腔部分2a是在多层印刷布线板2的表面上形成的。传导线5通过导线接合电气连接到裸IC芯片3上的盘部分3a和3b。
多层印刷布线板2包括由绝缘材料制成的多个绝缘层20和布线图形10。在布线图形10中，在信号线路上形成多个部分10a和10b(在下文中被称为“电极部分”)。这些电极部分10a和10b通过导线接合电气连接到传导线5。
绝缘层20由被堆叠为形成多层印刷布线板2的一组绝缘层组成。如图1中所示，在具有N(在图1中示出的第一实施例中N＝1～7)个层的绝缘层20的结构中，具有高的刚性的铜部件6(用作“强化部件”)被放置在对应于从电极部分10a和10b侧数起的第二层(N＝2)和第三层(N＝3)的预定区域(该预定区域对应于“位于电极部分10a和10b正下方的区域”)中。
该预定部分是针对每个电极部分10a和10b在多层印刷布线板2中的绝缘层20中形成的。此外，过孔7被形成以将信号线路连接在一起或者将接地线路连接在一起，其是在不同的绝缘层20之间形成的。
<制造印刷IC板的方法A>
下面将给出制造根据本发明的第一实施例的印刷IC板1的方法A的描述。
如图2A～图2H所示，制造印刷IC板1的方法A使用顺序叠层方法产生压制基板9。在该方法中，通过堆叠多个绝缘层20和布线图形10形成基础基板8。然后，绝缘层20和铜部件6进一步堆叠在基础基板8上。该堆叠步骤被重复以便于产生压制基板9。
在如图2A中所示的产生基础基板8的步骤中，通过激光设备等在预浸层中形成穿孔并且该穿孔随后被填充传导膏，以便于实现具有过孔7的预浸层(其对应于绝缘层20)。通过使用层压机或辊压层叠机的热压，使铜薄膜粘附到具有过孔7的预浸层的两个表面。在粘附到绝缘层20的铜薄膜上通过蚀刻形成布线图形10。最后，上面形成有布线图形10的绝缘层20被安置在两个预浸层和一对铜薄膜之间，并且这些层通过热压被粘附和固定在一起以实现叠层结构，从而在叠层的两个表面之间形成布线图形10。这产生了包括三个绝缘层20和四层布线图形10的基础基板8。
本发明的概念不限于产生基础基板8的上述方法。例如，可以使用产生基础基板8的另一方法，其中通过蚀刻在每个板的粘附有铜薄膜的一个表面上形成布线图形，并且随后填充过孔7。最后，具有布线图形和过孔7的这些板被堆叠并且同时压在一起。
为了产生基础基板8，还可以使用另一构建方法。此外，对于基础基板8，除了由三层绝缘层20和四层布线图形10组成的结构之外，还可以具有由多个绝缘层20和布线图形10组成的另一结构。
下一步，如图2B和图2C中所示，通过激光设备等在两个预浸层(其对应于两个绝缘层20)中形成两个空腔，并且铜部件被插入在这些空腔中。最后，七个绝缘层20被叠层并且通过热压被强力粘合，从而使具有被插入铜部件的两个空腔的两个绝缘层20被插入和放置变为第二和第三层，形成基础基板8的三个绝缘层变为第四～第六层，并且两个绝缘层20变为第一和第七层。即，第二～第六绝缘层20被第一和第七绝缘层20夹住。
下一步，如图2D、图2E、图2F中所示，通过使用激光设备等在压制基板9的第一至第三绝缘层中的预定位置处形成过孔。过孔随后被填充传导膏，从而使该传导膏与被放置在基础材料8中的预定位置处的过孔7电气接触。进一步，在压制基板9的两个表面处形成布线图形。通过激光设备等在多层印刷布线板2的第一至第三层中的预定位置处形成空腔部分2a，以便于产生由七个绝缘层20和六个布线图形10组成的多层印刷布线板2。
最后，如图2G和图2H中所示，一个或更多个裸IC芯片3被安置在空腔部分2a中并且通过诸如Ag环氧树脂或硅树脂的粘附剂被芯片接合到空腔部分2a。诸如电容和电阻的芯片元件4也通过焊接接合在于多层印刷布线板2的表面上形成的信号线路和接地的预定位置上。具有裸IC芯片3的多层印刷布线板2被安置在热台单元上面，在150℃～200℃范围内的温度下对其加热。裸IC芯片3的盘部分通过使用由金或铜制成的传导线5电气连接到在多层印刷布线板2的表面(第一绝缘层20侧)上形成的电极部分10a和10b。
<效果>
在通过导线接合连接将裸IC芯片3的盘部分电气连接到在多层印刷布线板2的表面上形成的电极部分10a和10b时，即使将超声波和负载施加到多层印刷布线板2，由于在绝缘层20正下方形成的铜部件6的存在，超声波未消散并且负载未分散，因此产生印刷IC板1的方法A可以通过热熔适当地将传导线5接合到电极部分10a和10b。
因此，由于通过根据第一实施例的方法产生的印刷IC板1具有改进的结构，其中裸IC芯片3适当地连接到多层印刷布线板2，因此印刷IC板1在结构上和操作上具有高的可靠性。
此外，由于铜部件6(用作强化部件)和布线图形10由相同的材料制成，从而使铜部件6和布线图形10具有相同的线性膨胀系数，因此作为防止绝缘层20与铜部件6分离的额外效果，可以防止布线图形10与绝缘层20分离。
第二实施例
将参照图3A～图3C和图4A～图4E给出根据本发明的第二实施例的印刷IC板1-1的描述。
图3A、图3B和图3C是示出根据本发明的第二实施例的印刷IC板1-1的配置的视图。图4A～图4E是示出产生根据本发明的第二实施例的印刷IC板1-1的主要步骤的视图。
<完整结构>
如图3A、图3B和图3C中所示，印刷IC板1-1具有在结构上不同于根据第一实施例的印刷IC板1中的多层印刷布线板2的多层印刷布线板2-1。下面的描述将解释与根据第一实施例的印刷IC板1的元件不同的元件，并且为了简化不解释第一和第二实施例之间相同的元件。
多层印刷布线板2-1具有多个预浸层20(其对应于绝缘层20)，该些预浸层20是通过将具有低的耗散因数的聚四氟乙烯(PTFE)浸渍在玻璃布(其用作“填料”或者“补充材料”)中而形成的。在多层印刷布线板2-1中，布线图形10形成在多个绝缘层20上。玻璃布按照根据PTFE的浸渍量的比例被包含在绝缘层20中，从而使绝缘层20和布线图形10具有相同的线性膨胀系数。
电极10a和10b形成在布线图形10中的信号线路上，并且接地盘10c、10d、10e和10f进一步形成在布线图形10上。即，在根据第二实施例的印刷IC板1-1的结构中，电极10a和10b以及接地盘10c、10d、10e和10f对应于电极部分。
<产生印刷IC板1-1的方法B>
下面将给出制造根据本发明的第二实施例的印刷IC板1-1的方法B的主要步骤的描述。
根据第二实施例的方法B与根据第一实施例的方法A的不同之处主要在于产生压制基板9的步骤。为了简化，下面的描述将解释不同的步骤。即，较之第一实施例的方法A，第二实施例具有在产生压制基板9期间放置裸IC芯片3和其他元件的不同的步骤。下面的描述将仅解释不同的步骤，并且省略方法A和B之间相同的步骤。
如图4A～图4E中所示，在产生根据第二实施例的印刷IC板1-1的方法B中，通过单个叠层步骤同时使七个绝缘层20和八层布线图形10叠层。
具体地，如图4A和4B中所示，通过使用激光设备等，在第二绝缘层20和第三绝缘层20中形成第一空腔，并且在第三绝缘层20、第四绝缘层20和第五绝缘层20中形成第二空腔。
铜部件6(其用作强化部件)随后被安置在第一空腔中并且芯片元件4被安置在第二空腔中。其中形成布线图形10的七个绝缘层20被堆叠并且热压以产生叠层结构。在对应于诸如电容和电阻的芯片元件4的安装位置的第六绝缘层20中的部分中形成过孔7。通过这些过孔7电气连接芯片元件4。
<效果>
如上文详细描述的，根据第二实施例的印刷IC板1-1，由于在每个绝缘层20中使用PTFE并且该PTFE具有小(或低)的介电耗散因数，因此可以抑制能量损失(介电损失)。因此可以适当地将根据本发明的印刷IC板1-1应用到使用毫米波段或毫米波中的高频信号的设备。
此外，根据第二实施例的印刷IC板1-1，由于PTFE包含玻璃布，从而使绝缘层20和布线图形10具有相同的线性膨胀系数，因此这可以防止布线图形10与绝缘层20分离。
第三实施例
将参照图5和图6A～图6G给出根据本发明的第三实施例的印刷IC板1-2的描述。
图5是示出根据本发明的第三实施例的印刷IC板1-2的配置的视图。图6A～图6G是示出产生根据本发明的第三实施例的印刷IC板1-2的主要步骤的视图。
<完整结构>
如图5中所示，根据第三实施例的印刷IC板1-2具有在结构上不同于根据第一实施例的印刷IC板1中的多层印刷布线板2并且也不同于根据第二实施例的印刷IC板1-1中的多层印刷布线板2-1的多层印刷布线板2-2。
由于根据第三实施例的印刷IC板1-2在裸IC芯片和多层印刷布线板之间的连接结构上不同于根据第一实施例的印刷IC板1，因此下面的描述将主要解释不同的连接结构，并且为了简化将不解释第一～第三实施例之间相同的元件。
具体地，根据第三实施例的印刷IC板1-2主要由多层印刷布线板2-2、裸IC芯片3、诸如电容和电阻的芯片元件4组成。进一步，裸IC芯片3和在多层印刷布线板2-2的表面上形成的电极部分10a和10b通过在裸IC芯片3的盘部分3a和3b上形成的凸点电气连接。例如，凸点由金或铜制成。
再者，布线图形10通过公知的共面线路在多层印刷布线板2-2中形成，并且考虑在相同表面上形成的信号线路和接地之间的间隙来确定布线图形10中的信号线路的宽度，使得多层印刷布线板2-2的特性阻抗具有预定值(例如，50Ω)。
<制造印刷IC板1-2的方法C>
如图6A～6G中所示，根据第三实施例的方法C与根据第一实施例的方法A有如下不同。
第三实施例的方法C在产生压制基板9的步骤中形成单个空腔，并且使用倒装芯片接合。
下面的描述将解释不同的步骤，并且为了简化将省略第一实施例和第三实施例之间相同的步骤。
如图6B和图6C中所示，在产生压制基板9的步骤期间，通过激光设备等在预浸层(其对应于三个绝缘层20)中形成单个空腔，并且铜部件插入到该空腔中。最后，七个绝缘层20被叠层并且通过热压被强力粘合，从而使具有被插入铜部件6(其用作强化部件)的空腔的两个绝缘层20变为第二和第三层，形成基础基板8的三个绝缘层变为第四～第六层，并且两个绝缘层20变为第一和第七层。即，第二～第六绝缘层20被第一和第七绝缘层20夹住。
铜部件6具有与裸IC芯片3的安装面积近似相同的面积并且被安置或放置在面对用于安装裸IC芯片3的位置的区域中。
在图6F和图6G中示出的步骤中，诸如电容、电阻等的芯片元件4通过焊接被固定在于多层印刷布线板2-2的表面上形成的信号线路上的预定位置处。具有裸IC芯片3的多层印刷布线板2-2被安置在热台单元上面，在150℃～200℃范围内的温度下对其加热。如图6G中所示，裸IC芯片3面向下地被安置在第一绝缘层20的表面上，以便于将在裸IC芯片3的盘部分3a和3b上面形成的凸点直接地且电气地连接到在多层印刷布线板2-2的表面(第一绝缘层20侧)上形成的电极部分10a和10b。
<效果>
根据产生第三实施例的印刷IC板1-2的方法C，由于裸IC芯片3在不使用任何传导线5的情况下电气连接到多层印刷布线板2-2(另一方面，根据第一和第二实施例的方法A和B使用传导线5)，因此可以减小裸IC芯片3的安装面积并且将裸IC芯片3和多层印刷布线板2-2之间的连接部分的总长度抑制为尽可能小的，并且该结构使得可以提高印刷IC板1-2的电气特性。
<其他修改方案>
本发明的概念不限于前述第一实施例、第二实施例和第三实施例。可以将本发明的概念应用于本发明的范围内的多种修改方案。
例如，由于第一和第二实施例提供通过微带线路或共面线路(作为电气传输线路的类型)形成的印刷IC板中的布线图形10，本发明不限于此。可以通过已知的接地共面线路形成布线图形10。
作为由微带线路制成的布线图形10的一个示例，在第一绝缘层20中的包含电极部分10a和10b的表面(作为第一表面)上形成线路图形，在第一和第二绝缘层20之间的表面(作为第二表面)上，以把铜部件6和过孔7放置在形成于电极部分正下方的区域中所需的面积来形成接地图形。在第二绝缘层20中的表面(作为第三表面)上形成接地图形，该第三表面是针对第一绝缘层20的表面的相反表面。第二表面和第三表面中的接地图形通过在第二绝缘层20中形成的过孔7电气连接。
两个绝缘层20的厚度“h”可由下式(1)表述：
Z＝(120π/εeff1/2)/{W/h+1.393+ln(W/h+1.444)}      (1)
其中εeff＝(εr+1)/2+(εr-1)/2(1+12h/W)1/2，W是微带线路的宽度，εr是相对静态介电常数(或静态相对介电常数)，并且Z是多层印刷布线板的特性阻抗。例如，由于在Z＝50Ω，εr＝3.5，W＝300μm时h变为约135μm(h≈135μm)，因此优选的是，每个绝缘层20具有约67.5μm的厚度。
图7A～图7C是示出根据本发明的另一修改方案的印刷IC板的上述配置的视图。
图7A、图7B和图7C中示出的印刷IC板的结构通过减小位于电极部分10a和10b正下方的区域的厚度，使得可以在制造印刷IC板的步骤期间，抑制施加到电极部分10a和10b的超声波的消散并且抑制负载分散。该结构使得可以将裸IC芯片3适当地连接到多层印刷布线板上。再者，由于通过充分保持除电极部分10a和10b正下方的区域之外的绝缘层20的厚度，布线具有最优的宽度，因此可以抑制信号线路的传导损失的劣化。
顺便提及，根据第一～第三实施例和前述修改方案的每个印刷IC板示出了将单个裸IC芯片3安装在印刷IC板上的结构。本发明不限于该结构。可以具有将多个裸IC芯片安装在印刷IC板上的结构。再者，对于印刷IC板，可以包括单层印刷布线板而非多层印刷布线板。
<本发明的其他特征和效果>
由于诸如PTFE的氟碳聚合物、诸如PEEK(聚醚醚酮)的塑性树脂和LCP(液晶聚合物)较之诸如玻璃环氧树脂和苯酚纸的绝缘树脂具有低的介电耗散因数，并且适用于使多个印刷布线板叠层的大部分绝缘树脂具有热塑性特性，因此根据本发明的印刷IC板使用热塑性树脂作为绝缘材料以形成绝缘层。
由于具有上述结构的印刷IC板可以抑制与信号频率和介电耗散因数成比例的能量损失(介电损失)，因此可以将本发明的印刷IC板应用到使用毫米波段或毫米波中的高频信号的多种设备。
在根据本发明的印刷IC板中，形成于电极部分正下方的区域具有在绝缘层中形成的单个区域，从而使该单个区域对应于电极部分的全部。本发明不限于以上结构。例如，在绝缘层中多个区域形成在电极部分正下方。
由于具有上述结构的印刷IC板可以减小绝缘层中强化部件的占用比例，因此当在绝缘层中形成多个布线图形或者通过微带线路形成布线图形时，可以增加绝缘层中布线图形的密度。
优选的是，使用多层印刷布线板作为印刷布线图形，其具有将多个绝缘层和布线图形堆叠为叠层结构的结构。使用该多层印刷布线板可以减小印刷IC板中的印刷布线板的面积。
特别地，对于在多层印刷布线板中形成的强化部件，优选的是具有如下结构，其中从与上面形成有电极部分的第一绝缘层的表面相反的第一绝缘层的另一表面观察，强化部件在除了第一绝缘层以外的堆叠的绝缘层中形成。
由于该结构不需要在第一绝缘层中形成用于强化部件的区域(作为凹入部分)，因此可以避免使用防止强化部件与电极部分接触的任何技术。例如，穿孔被形成在除了第一绝缘层以外的多个绝缘层(被称为“目标绝缘层”)中作为位于电极部分正下方的区域，并且强化部件被插入到该穿孔中并且被放置在该穿孔中。具有穿孔的目标绝缘层被第一绝缘层和多层印刷布线板中的除了目标绝缘层以外的剩余绝缘层夹住。这可以容易地将强化部件放置于在目标绝缘层中形成的穿孔中。
顺便提及，为了在制造印刷IC板的步骤期间抑制超声波消散并且抑制负载分散，期望减小绝缘层的厚度。
为了实现该目的，优选的是，第一绝缘层的厚度小于每个其他绝缘层的厚度。
在该情况中，在绝缘层被堆叠并且随后被热粘附以制作具有叠层结构的印刷IC板时，减小第一绝缘层的厚度可以抑制超声波的消散并且抑制所施加的负载的分散。这可以将裸IC芯片适当地连接到多层印刷布线板中的布线图形。
当布线图形由微带线路制成时，在进一步减小绝缘层的厚度的情况下，此时需要进一步减小该信号线路的宽度，以便于使印刷布线板的阻抗特性与预定值(例如，50Ω)匹配。然而，过度减小信号线路的宽度将引起信号线路的传导损失并且由此引起整个电路的传导损失的增加。
为了避免该问题，本发明提供了具有如下结构的印刷IC板，其中通过微带线路形成多个布线图形，该布线图形是线路图形和接地图形的组合，并且线路图形是在第一绝缘层的包含电极部分的第一表面上形成的，接地图形在面对第二绝缘层的表面的第一绝缘层的第二表面上、仅在电极部分正下方的区域中形成，以及接地图形在第二绝缘层的第三表面中形成，第二绝缘层的第三表面是相对于第一绝缘层的第二表面的相反表面。进一步，第二表面和第三表面中形成的接地图形电气连接到第二绝缘层中形成的过孔。
具有上述结构的印刷IC板实质上减小与在电极部分正下方形成的区域对应的第一绝缘层中的区域的厚度，由此可以将裸IC芯片适当地连接到印刷布线板，并且在保持除了第一绝缘层以外的绝缘层的厚度的时候不用限制信号线路的宽度，抑制了信号线路的传导损失。
此外，对于包含补充材料的绝缘材料，优选的是具有与布线图形相同的线性膨胀系数，而且对于绝缘层中的强化部件，优选的是由具有与布线图形相同的线性膨胀系数的材料制成。
对于补充材料，包含诸如玻璃布的具有低的线性膨胀系数的绝缘材料就足够了，不需要包含补充材料的全部绝缘层都具有相同的线性膨胀系数。
对于印刷IC板的结构，可以防止强化部件与绝缘层分离，并且可以防止布线图形与绝缘层分离。
尽管已经详细描述了本发明的特定实施例，但是本领域的技术人员将认识到，按照本公开内容的整体教导内容，可以开发针对那些细节的多种修改方案和替换方案。因此，所公开的特定设置仅是说明性的，并非限制由所附权利要求及其所有等同物的完整范围限定的本发明的范围。

Claims (10)

1.一种印刷集成电路IC板，包括：
印刷布线板，其包括由绝缘材料制成的绝缘层，布线图形形成在所述绝缘层上；和
裸集成电路IC芯片，其电气连接到在所述印刷布线板上形成的布线图形，
其中作为所述布线图形的一部分的电极部分电气连接到所述裸IC芯片，以及具有高于形成所述绝缘层的所述绝缘材料的刚性的预定刚性的强化部件在所述绝缘层中的区域中形成并且位于所述电极部分正下方。
2.如权利要求1所述的印刷IC板，其中所述绝缘材料是热塑性树脂。
3.如权利要求2所述的印刷IC板，其中在所述电极部分正下方、在所述绝缘层中形成多个区域，所述多个区域对应于所述电极部分。
4.如权利要求2所述的印刷IC板，其中所述印刷布线板是包括堆叠的多个绝缘层和布线图形的多层印刷布线板。
5.如权利要求4所述的印刷IC板，其中所述强化部件是在除了第一绝缘层以外的绝缘层中形成的，并且所述电极部分是在所述第一绝缘层中形成的，并且所述第一绝缘层堆叠在第二绝缘层的表面上，所述第二绝缘层的表面与上面形成有所述电极部分的所述第一绝缘层的表面相反。
6.如权利要求5所述的印刷IC板，其中所述第一绝缘层的厚度小于所述多层印刷布线板中的每个其他绝缘层的厚度。
7.如权利要求5所述的印刷IC板，其中通过微带线路形成所述布线图形，所述微带线路是线路图形和接地图形的组合，并且
所述线路图形是在所述第一绝缘层的包含所述电极部分的第一表面上形成的，所述接地图形在面对所述第二绝缘层的表面的所述第一绝缘层的第二表面上、仅在所述电极部分正下方形成的区域中形成，并且所述接地图形在所述第二绝缘层的第三表面中形成，第三表面是相对于所述第一绝缘层的所述第二表面的相反表面，并且
所述第二表面和所述第三表面中形成的所述接地图形电气连接到所述第二绝缘层中形成的过孔。
8.如权利要求2所述的印刷IC板，其中所述绝缘材料包含补充材料以便于具有与所述布线图形相同的线性膨胀系数，并且所述强化部件具有线性膨胀系数与所述布线图形相同的材料。
9.一种印刷布线板，其中布线图形在由绝缘材料制成的绝缘层上形成，电极部分在所述布线图形上形成，所述电极部分将所述布线图形电气连接到裸集成电路IC芯片，并且具有高于所述绝缘材料的刚性的预定刚性的强化部件被放置于在除了上面形成有所述电极部分的绝缘层以外的绝缘层中的区域中，所述区域形成在所述电极部分正下方。
10.一种制造印刷集成电路IC板的方法，所述印刷IC板包括多层印刷布线板和安置在所述多层印刷布线板上的裸集成电路IC芯片，其中所述多层印刷布线板包括多个绝缘层和在所述绝缘层上面形成的布线图形，并且所述绝缘层和所述布线图形被堆叠以实现叠层结构，
所述方法包括如下步骤：
在所述多层印刷布线板中的除了第一绝缘层以外的绝缘层中的位于电极部分正下方的区域中形成穿孔，其中所述电极部分是在第一绝缘层的表面上形成的，并且所述电极部分电气连接到所述裸IC芯片，所述第一绝缘层堆叠在第二绝缘层上，从而使与上面形成有电极部分的表面相反的所述第一绝缘层的表面面对所述第二绝缘层的表面；和
将具有高于绝缘材料的刚性的预定刚性的强化部件插入到所述穿孔中；以及
堆叠所述多个绝缘层。
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